Group 1: Sodium Battery Industry - Zhongna Energy successfully completed A2 round financing, raising nearly 300 million yuan, setting a new global record in the sodium battery sector [2] - The financing reflects strong market recognition of the company's clear development strategy, robust R&D capabilities, unique product system, and significant commercial prospects [2] - Funds will be allocated to technology R&D, capacity layout, and market expansion, focusing on innovative material systems and optimizing product development processes [2] Group 2: Robotics and Automation - Accelerated Evolution Technology completed A round financing led by Shenzhen Capital Group, with funds primarily for product iteration and large-scale production delivery [3] - Huachuang Technology completed A and A+ rounds of financing, focusing on high-end servo localization in the machine tool and semiconductor fields [4] - The company has developed micro and joint servo products with significant improvements in power density and size reduction, enhancing customer capabilities [4] Group 3: Immunodiagnostic Technology - Hefei Guoyan Hanyin Detection Technology completed several million yuan in A round financing, aimed at developing a new generation of single-molecule immunodiagnostic systems [5][6] - The company focuses on digital immune analysis technology for applications in neurodegenerative diseases, infectious diseases, and early cancer screening [5] - The AI-SiMAS semi-automated single-molecule immunodiagnostic system received regulatory approval, with further developments underway [5] Group 4: Semiconductor Equipment - Hefei Xinyi Intelligent Machinery completed over 300 million yuan in B+ round financing, focusing on high-end equipment for the semiconductor industry [7][8] - The company has established strong partnerships with over 100 clients in the semiconductor supply chain, driving continuous technological upgrades [8] - Xinyi has developed key products for the display panel and integrated circuit sectors, contributing to the domestic equipment industry's growth [9][10] Group 5: Cloud Computing and CPU Development - Xieao Computing announced several hundred million yuan in Pre-A round financing, focusing on ARM Server CPU product delivery and RISC-V architecture exploration [11][12] - The company aims to launch its first commercial CPU chip by 2026, aligning with market trends towards diverse technology paths [12] Group 6: Robotics and Core Components - Benmo Technology completed B and B+ rounds of financing, focusing on flexible motor design and production, enhancing delivery capabilities for robotic products [13][14] - The company has established a dual R&D system and automated production lines to meet growing market demands [13] - Benmo is developing a leading open-source wheeled robot platform, optimizing motion control algorithms and hardware design for various applications [14]

投资界6月6日消息，「本末科技」已完成B轮及B+轮融资，累计金额达数亿元人民币。本次融资由北京市先进制造和智能装备产业投资基金领投，北京市 新材料产业投资基金、顺禧基金、联想之星联合跟投，星辰资本担任长期独家财务顾问。融资资金将主要用于三大方向：面向新兴需求的电机柔性化设计 和生产，继续提升直驱关节模组规模化交付能力，加速机器人产品开发迭代与多场景商业化落地。 本末科技轮足机器人 据公开信息展示，本末科技成立于2020年，从事机器人本体及机器人动力模组的研发及生产，目前已设立机器人和核心部件两大事业部，并组建了一支超 过150人的技术研发团队。公司在东莞松山湖设立两大研发中心具身智能机器人技术开拓中心与直驱关节模组技术预研中心，已构建起"机器人本体+核心 部件"的双重研发体系，并配备大型生产基地，形成从设计、打样、生产、检测、认证的全链条闭环能力。 本末科技直驱电机与关节模组 在具身智能赛道，本末科技打造全球领先的开源轮足机器人平台，已推出刑天、TITA、D1等多款轮足式机器人产品。通过机器人本体的模块化设计与形 态多样化探索，结合大模型积累海量场景数据，推动机器人在复杂环境中的适应性与应用价值提升。在产品迭 ...