Core Viewpoint - The article emphasizes the importance of interconnect architecture in AI infrastructure, highlighting that while GPUs are crucial, the ability to train and run large models relies heavily on effective interconnect systems [1]. Group 1: Interconnect Architecture - Interconnect architecture encompasses various levels, including chip-to-chip communication within packages and system-level networks that support thousands of accelerators [1]. - Nvidia's dominance in the industry is attributed to its expertise in developing and integrating these interconnect architectures [1]. - Broadcom has been quietly advancing various technologies related to interconnect architecture, including Ethernet architectures for large-scale expansion and internal chip interconnect technologies [1][3]. Group 2: Ethernet Switch Technology - Broadcom has introduced high-capacity switches, such as the 51.2Tbps Tomahawk 5 and the recently launched 102.4Tbps Tomahawk 6, which can significantly reduce the number of switches needed for large GPU clusters [3]. - The number of switches required decreases as the switch's port count increases, allowing for more efficient connections among GPUs [3]. - Nvidia has also announced its own 102.4Tbps Ethernet switch, indicating a competitive landscape in high-capacity switch technology [4]. Group 3: Scalable Ethernet Solutions - Broadcom's Tomahawk 6 switches are positioned as a shortcut for rack-level architectures, supporting between 8 to 72 GPUs, with future designs expected to support up to 576 GPUs by 2027 [6]. - Ethernet technology is being utilized for both scalable and large-scale networks, with Intel and AMD also planning to implement Ethernet for their systems [7]. Group 4: Co-Packaged Optics (CPO) Technology - Broadcom has invested in co-packaged optics (CPO) technology, which integrates components typically found in pluggable transceivers into the same package as the switch ASIC, significantly reducing power consumption [9][10]. - The efficiency of Broadcom's CPO technology is reported to be over 3.5 times that of traditional pluggable devices [10]. - The third generation of CPO technology is expected to support up to 512 200Gbps optical ports, with future developments aiming for 400Gbps channels by 2028 [11]. Group 5: Multi-Chip Architecture - As Moore's Law slows, the industry is shifting towards multi-chip architectures, allowing for higher yields and optimized costs by using smaller chips [14]. - Broadcom has developed a 3.5D eXtreme Dimension System in Package (3.5D XDSiP) technology to facilitate the design of multi-chip processors, which is open for licensing to other companies [15]. - The first products based on this design are expected to enter production by 2026, although the specific applications of Broadcom's technology in AI chips may remain undisclosed [15].

据称，Tomahawk 6专为AI时代设计，其带宽理论峰值达102Tbps，相当于每秒处理2.5万部4K电影，较前代Tomahawk 5芯片实现6倍吞吐 能力提升；架构创新方面，其支持100G/200G SerDes接口及共封装光学模块（CPO），兼容超大规模AI网络运营商的定制化需求。 【环球网科技综合报道】6月4日消息，博通（Broadcom）宣布正式交付其最新一代数据中心交换机芯片Tomahawk 6。据介绍，该芯片单 芯片交换容量为102.4Tbps，较现有以太网交换机带宽翻倍，并支持超大规模GPU集群的互联需求，单颗芯片即可驱动多达10万张GPU协 同工作。 | BBROADCOM' Products Solutions | Support and | Company | LIUW TO | Search | ơ | | --- | --- | --- | --- | --- | --- | | | Services | | | | | | | | | Buv | | | | Company / News / Product News Release | | | | Print | Share Pa ...

Core Insights - The article discusses the rapid growth of Ethernet networks and the competition among major players like Broadcom, Cisco, and Nvidia in the Ethernet switch ASIC market, particularly in the context of AI advancements [1][2][3] - Broadcom's Tomahawk 6 ASIC is highlighted as a leading product, with capabilities of 102.4 Tb/s and future versions expected to reach 204.8 Tb/s and 409.6 Tb/s, which are crucial for AI applications [2][3][10] - The article emphasizes the shift in enterprise networks towards higher-speed Ethernet, driven by the demands of AI workloads, which may accelerate the adoption of 100 Gb/s, 200 Gb/s, and even 400 Gb/s Ethernet [2][3] Summary by Sections Ethernet Network Growth - Ethernet networks are experiencing significant growth, allowing switch manufacturers to maintain business growth despite challenges [1] - The UltraEthernet Consortium aims to support 1 million GPU endpoints, necessitating larger capacity switch ASICs [1] Competition in the ASIC Market - Broadcom faces competition from Cisco and Nvidia, with its Tomahawk 6 ASIC leading the market with a focus on high bandwidth and cost efficiency [2][3] - The introduction of co-packaged optical devices is anticipated to reduce costs and expand network coverage [2] AI and Ethernet Adoption - The enterprise market has been slow to transition from 10 Gb/s to 100 Gb/s Ethernet, but AI's influence may accelerate this shift [2] - AI backend demands are expected to drive the adoption of higher-speed Ethernet in enterprise settings [2] Tomahawk 6 ASIC Features - Tomahawk 6 is designed to meet the bandwidth, low latency, and high base requirements of AI training and inference applications [6] - The chip utilizes a 3nm process technology, offering significant improvements in performance and efficiency compared to previous generations [10][11] Cost and Efficiency - The article discusses how the design of Tomahawk 6 allows for a reduction in the number of chips needed for equivalent performance, thereby lowering costs [8][15] - The transition to Tomahawk 6 is expected to significantly reduce power consumption compared to older ASICs, which is critical for large-scale AI deployments [15] Market Demand and Future Outlook - There is immense pressure from OEMs and cloud builders to bring Tomahawk 6 to market quickly, with expectations for product readiness by early 2026 [12][15] - The architecture of Tomahawk 6 enables efficient scaling of AI clusters, which is essential for modern data center requirements [14]