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机构:预计今年八大CSP资本支出将逾4200亿美元, 同比增长61%
Zheng Quan Shi Bao Wang· 2025-10-13 11:00
Core Insights - The report by TrendForce indicates a significant increase in capital expenditure (CapEx) among major cloud service providers (CSPs) driven by the rapid expansion of AI server demand, with a projected total CapEx exceeding $420 billion by 2025, representing a 61% year-over-year increase compared to 2023 and 2024 combined [1] - By 2026, the total CapEx for these CSPs is expected to reach over $520 billion, marking a 24% year-over-year growth, as the spending structure shifts towards assets like servers and GPUs to strengthen long-term competitiveness [1] Group 1: CSPs and AI Solutions - The GB200/GB300 Rack is identified as a key AI solution for CSPs, with demand expected to exceed initial forecasts, particularly from North America's top four CSPs and Oracle, as well as companies like Tesla/xAI and Coreweave [2] - CSPs are anticipated to increase their self-developed chip shipments annually, with North American CSPs focusing on AI ASICs to enhance autonomy and cost control in generative AI and large language model computations [2] Group 2: Specific CSP Developments - AWS is set to deploy Trainium v2, with a liquid-cooled version expected by the end of 2025, and Trainium v3 projected to begin mass production in Q1 2026, with a forecasted shipment increase of over 100% in 2025 [3] - Meta is enhancing its collaboration with Broadcom, expecting to mass-produce MTIA v2 by Q4 2025, with significant growth anticipated in shipments [3] - Microsoft plans to produce Maia v2 with GUC's assistance, although its self-developed chip shipments are expected to lag behind competitors in the short term [3] Group 3: Capital Expenditure Trends - Tencent's capital expenditure saw a year-over-year increase of 119% in Q2, reaching 19.107 billion RMB, with total investments exceeding 83.1 billion RMB over the last three quarters [3] - Alibaba's capital expenditure reached a record high of 38.6 billion RMB in Q2 2025, with a commitment to invest 380 billion RMB over the next three years for cloud and AI hardware infrastructure [4]
TrendForce:预计2025年八大CSP的总资本支出达4200亿美元 同比增长61%
Zhi Tong Cai Jing· 2025-10-13 05:45
Core Insights - The demand for AI servers is rapidly expanding, leading major cloud service providers (CSPs) to increase their procurement of NVIDIA GPU solutions and expand data center infrastructure, with a projected capital expenditure of over $420 billion by 2025, representing a 61% year-on-year increase compared to 2023 and 2024 combined [1] - By 2026, total capital expenditure for the eight major CSPs is expected to reach over $520 billion, marking a 24% year-on-year growth, as spending shifts from revenue-generating equipment to servers and GPUs, prioritizing long-term competitiveness over short-term profits [1] Group 1: AI Server Demand and Capital Expenditure - The eight major CSPs, including Google, AWS, Meta, Microsoft, Oracle, Tencent, Alibaba, and Baidu, are expected to see a combined capital expenditure surpassing $420 billion by 2025, driven by the demand for AI server solutions [1] - The demand for the GB200/GB300 Rack AI solutions is anticipated to grow beyond expectations, with significant interest from North America's top four CSPs and other companies like Tesla and Coreweave [4] - The capital expenditure structure is shifting towards assets like servers and GPUs, indicating a focus on strengthening long-term market share and competitiveness [1] Group 2: In-house Chip Development - North America's top four CSPs are intensifying their AI ASIC development to enhance autonomy and cost control in generative AI and large language model computations [5] - Google is collaborating with Broadcom on the TPU v7p, expected to ramp up in 2026, which will replace the TPU v6e as the core AI acceleration platform [6] - AWS is set to deploy the Trainium v2 by the end of 2025, with a projected doubling of its in-house ASIC shipments in 2025, the highest growth rate among the major players [6] - Meta is enhancing its collaboration with Broadcom, anticipating the mass production of MTIA v2 by Q4 2025, which will significantly improve inference performance [6] - Microsoft plans to produce Maia v2 with GUC's assistance, but its in-house chip shipment volume is expected to be limited in the short term due to delays in Maia v3 production [6]
研报 | 2026年CSP资本支出预计将高达5,200亿美元,GPU采购与ASIC研发成创新高核心驱动力
TrendForce集邦· 2025-10-13 04:08
Core Insights - The article highlights the rapid expansion of AI Server demand, leading major Cloud Service Providers (CSPs) to significantly increase their capital expenditures, projected to exceed $420 billion in 2025, representing a 61% year-over-year growth compared to the combined capital expenditures of 2023 and 2024 [2] - It is anticipated that the total capital expenditure of the eight major CSPs will reach over $520 billion in 2026, marking a 24% increase from 2025, as they shift their spending focus from revenue-generating equipment to assets like servers and GPUs to strengthen long-term competitiveness [2] CSP Capital Expenditure - The demand for the GB200/GB300 Rack AI solutions is expected to grow beyond expectations, with significant interest from major North American CSPs and companies like Tesla, Coreweave, and Nebius for cloud AI leasing services [5] - CSPs are expected to expand their deployment of the GB300 Rack solutions in 2026, transitioning to the NVIDIA Rubin VR200 Rack solutions in the latter half of the year [5] In-house Chip Development - North American CSPs are intensifying their AI ASIC development to enhance autonomy and cost control in generative AI and large language model computations [6] - Google is collaborating with Broadcom on the TPU v7p, expected to ramp up in 2026, while AWS is set to launch the liquid-cooled version of Trainium v2 by the end of 2025, with Trainium v3 expected to enter mass production in early 2026 [6][7] - Meta is enhancing its collaboration with Broadcom, anticipating the mass production of MTIA v2 in Q4 2025, while Microsoft plans to produce Maia v2 with GUC's assistance, although its timeline is lagging behind competitors [7]
研报 | 受国际形势变化影响,2025年AI服务器出货年增幅度略减
TrendForce集邦· 2025-07-02 06:03
Core Insights - The North American large CSPs are the main drivers of AI Server market demand expansion, with a forecasted 24.3% year-on-year growth in global AI Server shipments for this year, slightly revised down due to international circumstances [1][4] Group 1: North American CSPs - Microsoft is focusing on AI investments, which has somewhat suppressed the procurement of general-purpose servers, primarily utilizing NVIDIA's GPU AI solutions for AI Server deployment [1] - Meta has significantly increased its demand for general-purpose servers due to new data center openings, primarily using AMD platforms, and is actively expanding its AI Server infrastructure with self-developed ASICs expected to double in shipments by 2026 [1] - Google has benefited from sovereign cloud projects and new data centers in Southeast Asia, significantly boosting server demand, and has begun mainstream production of its TPU v6e for AI inference [2] - AWS is focusing on its self-developed Trainium v2 platform, with plans for Trainium v3 development expected to launch in 2026, anticipating a doubling of its self-developed ASIC shipments by 2025 [2] - Oracle is emphasizing the procurement of AI Servers and In-Memory Database Servers, actively integrating its core cloud database and AI applications [3] Group 2: Market Outlook - Due to international circumstances, many Server Enterprise OEMs are reassessing their market plans for the second half of 2025, with an overall forecast of approximately 5% year-on-year growth in total server shipments, including both general-purpose and AI Servers [4]
研报 | AI芯片自主化进程加速,云端巨头竞相自研ASIC
TrendForce集邦· 2025-05-15 07:15
Core Insights - The article discusses the accelerating trend of AI server demand driving major North American Cloud Service Providers (CSPs) to develop their own Application-Specific Integrated Circuits (ASICs) to reduce reliance on external suppliers like NVIDIA and AMD [1][2][3][4][5]. Group 1: North American CSP Developments - Google has launched the TPU v6 Trillium, focusing on energy efficiency and optimization for large AI models, with plans to significantly replace the TPU v5 by 2025 [2]. - AWS is collaborating with Marvell on the Trainium v2, which supports generative AI and large language model training, and is expected to see substantial growth in ASIC shipments by 2025 [2]. - Meta is developing the next-generation MTIA v2 in partnership with Broadcom, emphasizing energy efficiency and low-latency architecture for AI inference workloads [3]. - Microsoft is accelerating its ASIC development with the Maia series chips, optimizing for Azure cloud services, and is collaborating with Marvell for the Maia v2 design [3]. Group 2: Chinese AI Supply Chain Autonomy - Huawei is actively developing the Ascend chip series for domestic markets, targeting applications in LLM training and smart city infrastructure, which may challenge NVIDIA's market position in China [4]. - Cambricon's MLU AI chip series is aimed at cloud service providers for AI training and inference, with plans to advance its solutions to the cloud AI market by 2025 [4]. - Chinese CSPs like Alibaba, Baidu, and Tencent are rapidly developing their own AI ASICs, with Alibaba's T-head launching the Hanguang 800 AI inference chip and Baidu working on the Kunlun III chip [5].