Group 1: AI and Technology Developments - Luo Yonghao was spotted at Baidu's Hangzhou branch, indicating his involvement in AI entrepreneurship with the launch of his first AI hardware product, JARVIS ONE, which features fingerprint recognition and voice command activation [1] - Xiaomi's newly developed XRING 01 chip shows competitive performance against Qualcomm's Snapdragon 8 Elite, with a multi-core score only 7% lower, highlighting Xiaomi's significant R&D progress over the past decade [2][5] - The XRING 01 chip utilizes a 3nm process technology, allowing for higher clock speeds and improved performance metrics compared to previous generations [4] Group 2: Electric Vehicle Infrastructure - CATL announced the launch of the 75 standardized battery swap block and plans to build a nationwide battery swap network covering 80% of trunk transport capacity by 2030 [7][8] - The company aims for a 50% market penetration of electric heavy trucks within three years, with plans to establish 300 battery swap stations in key regions by 2025 [8] Group 3: Corporate Strategies and Market Moves - Apple plans to allow EU users to set third-party voice assistants as default options on their devices, responding to regulatory pressures [5][6] - Google CEO Sundar Pichai revealed that the company seriously considered acquiring Netflix, which would have been a significant move in the streaming market [9]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 wccftech ，谢谢 。 小米定制SoC"Xring"的名称 在一个月前就被曝光，而该公司很快便正式发布了这款名为XRING 01的新芯片组。小米 首席执行官雷军在微博社交网络上发布了这一消息，但一如既往地没有透露规格等重要细节。值得庆幸的是，我们之 前已经深入报道过这些信息，现在我们将再次回顾，以便您了解未来小米智能手机将采用何种芯片。 此前有报道称，XRING 01 将采用台积电的 4nm 技术，但有传言称小米将推出 3nm 版本，并可能在未来实现量产 除了提到XRING 01将于本月晚些时候发布外，该微博帖子未分享其他任何有价值的信息。目前尚不清楚小米CEO是 想让观众保持悬念，还是另有其他原因。此前，我们曾报道XRING 01将采用台积电较老的4nm工艺进行量产，但与 骁龙8 Elite不同的是，这款自主研发的解决方案将基于ARM的当前一代CPU设计，其中最快的是主频为3.20GHz的 Cortex-X925。 采用上一代制造工艺可能意味着小米希望避免成本上涨，但我们去年提到，这家中国科技巨星已成功实现 3nm 芯片组 的流片，暗示可能会在 ...