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Market Trends - The price of iPhones in Ethereum has generally decreased over the years, indicating a shift in the relative value of ETH compared to iPhones [1] - From iPhone 6s to iPhone 17, the price dropped significantly from 876.4 ETH to 0.18 ETH [1] Cryptocurrency & Technology Valuation - The price of iPhone 7 was 51.83 ETH, while the price of iPhone 8 dropped significantly to 2.65 ETH [1] - The price of iPhone X was 3.27 ETH, and the price of iPhone XS was 4.45 ETH [1] - The price of iPhone 13 was 0.25 ETH, the price of iPhone 14 was 0.51 ETH, the price of iPhone 15 was 0.50 ETH, the price of iPhone 16 was 0.34 ETH, and the price of iPhone 17 was 0.18 ETH [1]

Core Viewpoint - IBM has formed a significant alliance with Deca Technologies in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging (FOWLP) market [1][2]. Group 1: IBM and Deca Technologies Collaboration - IBM plans to establish a new high-volume production line at its existing packaging facility in Bromont, Quebec, to produce advanced packaging based on Deca's M series fan-out interconnect technology (MFIT) [1]. - The MFIT technology enables the integration of complex multi-chip packages, particularly for AI and memory-intensive computing applications [2][12]. - The collaboration aims to expand IBM's packaging capabilities and provide North American customers with new fan-out production options [2][9]. Group 2: Background on IBM's Semiconductor History - IBM has a long history in the semiconductor industry, dating back to its founding in 1911, and has made significant contributions, including the invention of DRAM in 1966 [4][5]. - The company entered the commercial semiconductor market in 1993, manufacturing and selling ASICs, processors, and other chips [5]. - In the 2010s, IBM's microelectronics division faced challenges, leading to the sale of its semiconductor business to GlobalFoundries in 2014 [6][8]. Group 3: Current Semiconductor and Packaging Efforts - IBM continues to design processors and chips but relies on foundries for production, with a significant semiconductor R&D center in New York [8]. - The Bromont facility is the largest outsourced semiconductor packaging and testing (OSAT) facility in North America, providing flip-chip packaging and testing services [8]. - IBM is also collaborating with Rapidus to develop 2nm processes based on IBM's nanosheet transistor technology [8]. Group 4: Fan-Out Wafer-Level Packaging (FOWLP) - FOWLP is an advanced packaging technology that integrates complex chips into a small package, enhancing chip performance [1][10]. - The technology gained prominence in 2016 when Apple used TSMC's fan-out packaging in its iPhone 7 [10]. - FOWLP allows for the integration of multiple chips and components, offering a compact solution with numerous I/O interfaces [10][12]. Group 5: Future Developments and Contracts - IBM and SkyWater are developing fan-out packaging capabilities based on Deca's technology, with SkyWater having secured a $120 million contract with the U.S. Department of Defense [11]. - Deca is also advancing its M series technology, which includes the MFIT version, enabling high-density integration of memory and processors [12].

Core Insights - Samsung Electronics has launched its thinnest flagship model, the S25 Edge, aiming to surpass Apple in the high-end smartphone market [1][4] - The S25 Edge is designed to meet the growing demand from consumers in their 20s and 30s for portable smartphones [1] - The device features enhanced AI capabilities, allowing real-time interaction through visual and voice commands [5] Product Details - The S25 Edge will be available in South Korea on May 23 and in the U.S. on May 30, with a launch in approximately 30 countries including China and Europe [5] - The starting price for the S25 Edge is $1,099, featuring a 6.7-inch screen and a thickness of 5.8 mm, making it larger than the basic S25 model but only slightly heavier [5] - Samsung has made structural changes to reduce the thickness of internal components, including the printed circuit board and thermal systems [4] Market Strategy - Analysts suggest that the early release of the S25 Edge is a strategic move to preemptively capture market share ahead of Apple's anticipated thinner iPhone launch later this year [5] - Samsung aims to attract consumers seeking thinner smartphones, indicating a thoughtful decision to address this market demand [5] Performance Assurance - Samsung has addressed concerns regarding the performance and heat management of the thinner device, stating that they have successfully designed a thinner heat spreader to accommodate the slim design [6] - The company is confident that users will not experience overheating issues with the S25 Edge [6] Market Position - According to Counterpoint Research, Samsung became the leading smartphone supplier globally in Q1 2025, holding a 20% market share, slightly surpassing Apple at 19% [6] - However, Samsung has indicated that potential tariff risks could impact demand and shipment volumes in the second quarter [7]