Price of iPhone in #Ethereum Over The YearsiPhone 6s - 876.4 ETHiPhone 7 - 51.83 ETHiPhone 8 - 2.65 ETHiPhone X - 3.27 ETHiPhone XS - 4.45 ETHiPhone 11 - 3.15 ETHiPhone 12 - 1.79 ETHiPhone 13 - 0.25 ETHiPhone 14 - 0.51 ETHiPhone 15 - 0.50 ETHiPhone 16 - 0.34 ETHiPhone 17 - 0.18 ETH#AppleEvent ...

Core Viewpoint - IBM has formed a significant alliance with Deca Technologies in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging (FOWLP) market [1][2]. Group 1: IBM and Deca Technologies Collaboration - IBM plans to establish a new high-volume production line at its existing packaging facility in Bromont, Quebec, to produce advanced packaging based on Deca's M series fan-out interconnect technology (MFIT) [1]. - The MFIT technology enables the integration of complex multi-chip packages, particularly for AI and memory-intensive computing applications [2][12]. - The collaboration aims to expand IBM's packaging capabilities and provide North American customers with new fan-out production options [2][9]. Group 2: Background on IBM's Semiconductor History - IBM has a long history in the semiconductor industry, dating back to its founding in 1911, and has made significant contributions, including the invention of DRAM in 1966 [4][5]. - The company entered the commercial semiconductor market in 1993, manufacturing and selling ASICs, processors, and other chips [5]. - In the 2010s, IBM's microelectronics division faced challenges, leading to the sale of its semiconductor business to GlobalFoundries in 2014 [6][8]. Group 3: Current Semiconductor and Packaging Efforts - IBM continues to design processors and chips but relies on foundries for production, with a significant semiconductor R&D center in New York [8]. - The Bromont facility is the largest outsourced semiconductor packaging and testing (OSAT) facility in North America, providing flip-chip packaging and testing services [8]. - IBM is also collaborating with Rapidus to develop 2nm processes based on IBM's nanosheet transistor technology [8]. Group 4: Fan-Out Wafer-Level Packaging (FOWLP) - FOWLP is an advanced packaging technology that integrates complex chips into a small package, enhancing chip performance [1][10]. - The technology gained prominence in 2016 when Apple used TSMC's fan-out packaging in its iPhone 7 [10]. - FOWLP allows for the integration of multiple chips and components, offering a compact solution with numerous I/O interfaces [10][12]. Group 5: Future Developments and Contracts - IBM and SkyWater are developing fan-out packaging capabilities based on Deca's technology, with SkyWater having secured a $120 million contract with the U.S. Department of Defense [11]. - Deca is also advancing its M series technology, which includes the MFIT version, enabling high-density integration of memory and processors [12].

Core Insights - Samsung Electronics has launched its thinnest flagship model, the S25 Edge, aiming to surpass Apple in the high-end smartphone market [1][4] - The S25 Edge is designed to meet the growing demand from consumers in their 20s and 30s for portable smartphones [1] - The device features enhanced AI capabilities, allowing real-time interaction through visual and voice commands [5] Product Details - The S25 Edge will be available in South Korea on May 23 and in the U.S. on May 30, with a launch in approximately 30 countries including China and Europe [5] - The starting price for the S25 Edge is $1,099, featuring a 6.7-inch screen and a thickness of 5.8 mm, making it larger than the basic S25 model but only slightly heavier [5] - Samsung has made structural changes to reduce the thickness of internal components, including the printed circuit board and thermal systems [4] Market Strategy - Analysts suggest that the early release of the S25 Edge is a strategic move to preemptively capture market share ahead of Apple's anticipated thinner iPhone launch later this year [5] - Samsung aims to attract consumers seeking thinner smartphones, indicating a thoughtful decision to address this market demand [5] Performance Assurance - Samsung has addressed concerns regarding the performance and heat management of the thinner device, stating that they have successfully designed a thinner heat spreader to accommodate the slim design [6] - The company is confident that users will not experience overheating issues with the S25 Edge [6] Market Position - According to Counterpoint Research, Samsung became the leading smartphone supplier globally in Q1 2025, holding a 20% market share, slightly surpassing Apple at 19% [6] - However, Samsung has indicated that potential tariff risks could impact demand and shipment volumes in the second quarter [7]