提名人江苏长电科技股份有限公司董事会，现提名郑建彪为江苏长电科技股 份有限公司第九届董事会独立董事候选人，并已充分了解被提名人职业、学历、 职称、详细的工作经历、全部兼职、有无重大失信等不良记录等情况。被提名人 已同意出任江苏长电科技股份有限公司第九届董事会独立董事候选人（参见该独 立董事候选人声明）。提名人认为，被提名人具备独立董事任职资格，与江苏长 电科技股份有限公司之间不存在任何影响其独立性的关系，具体声明并承诺如下： 一、被提名人具备上市公司运作的基本知识，熟悉相关法律、行政法规、规 章及其他规范性文件，具有 5 年以上经济、会计、财务、管理或者其他履行独立 董事职责所必需的工作经验。 被提名人已经参加培训并取得证券交易所认可的相关培训证明材料。 江苏长电科技股份有限公司 独立董事提名人声明与承诺 二、被提名人任职资格符合下列法律、行政法规和部门规章的要求： （一）《中华人民共和国公司法》关于董事任职资格的规定； （二）《中华人民共和国公务员法》关于公务员兼任职务的规定（如适用）； （三）中国证监会《上市公司独立董事管理办法》、上海证券交易所自律监 管规则以及公司章程有关独立董事任职资格和条件的相关规 ...

证券代码：600584 证券简称：长电科技 公告编号：临 2025-049 江苏长电科技股份有限公司 关于召开2025年第二次临时股东大会的通知 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 一、 召开会议的基本情况 (四)现场会议召开的日期、时间和地点 (六)融资融券、转融通、约定购回业务账户和沪股通投资者的投票程序 召开的日期时间：2025 年 12 月 30 日 14 点 30 分 召开地点：江苏长电科技股份有限公司 D3 二楼会议室（江阴市长山路 78 号） 股东大会召开日期：2025年12月30日 本次股东大会采用的网络投票系统：上海证券交易所股东大会网络投票 系统 (一)股东大会类型和届次 2025年第二次临时股东大会 (二)股东大会召集人：董事会 (三)投票方式：本次股东大会所采用的表决方式是现场投票和网络投票相结合的 方式 (五)网络投票的系统、起止日期和投票时间。 网络投票系统：上海证券交易所股东大会网络投票系统 网络投票起止时间：自2025 年 12 月 30 日 至2025 年 12 月 ...

江苏长电科技股份有限公司（以下简称"公司"）第八届董事会第十六次临 时会议于 2025 年 12 月 4 日以通讯方式发出通知，于 2025 年 12 月 10 日以现场 结合通讯方式召开，本次会议应参会董事 9 人，实际参会董事 9 人，公司监事及 高级管理人员列席会议。董事长周响华女士主持会议。会议的召集和召开符合《中 华人民共和国公司法》（以下简称《公司法》）和《公司章程》的有关规定。 二、董事会会议审议情况 证券代码：600584 证券简称：长电科技 公告编号：临 2025-047 江苏长电科技股份有限公司 第八届董事会第十六次临时会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 一、董事会会议召开情况 本次会议表决通过了相关议案，形成决议如下： （一）逐项审议通过了《关于修订公司章程及相关公司治理制度的议案》 为贯彻落实《公司法》及中国证券监督管理委员会《关于新<公司法>配套 制度规则实施相关过渡期安排》、《上市公司章程指引（2025）》（以下简称《章程 指引》）等相关规定，公司将不再设立监事会或监事，由 ...

12月10日上午，A股三大指数集体下跌，上证指数盘中下跌0.60%，林木、零售、工程机械等板块涨幅 靠前，电脑硬件、电工电网跌幅居前。芯片板块低迷，截至10:31，芯片ETF（159995）下跌1.10%，成 分股澜起科技下跌3.27%，海光信息下跌2.69%，中微公司下跌2.23%。部分个股活跃，华润微上涨 10.61%，豪威集团上涨2.97%。 开源证券表示，H200等芯片供给恢复或推动国产大模型全面升级，加速国内AI生态繁荣发展，或进一 步全面扩大对国产算力芯片的需求，长期利好国产芯片板块。 资料显示，芯片ETF（159995）跟踪国证芯片指数，30只成分股集合A股芯片产业中材料、设备、设 计、制造、封装和测试等龙头企业，其中包括中芯国际、寒武纪、长电科技、北方华创等。 （文章来源：每日经济新闻） 12月9日，据央视网消息，美国总统特朗普在"真实社交"媒体平台发文称，在确保美国国家安全的前提 下，将"允许英伟达向中国及其他国家的合格客户交付其H200芯片产品"，Blackwell芯片以及即将发布 的Rubin芯片则不在获批名单中，芯片销售收入的25%将上缴美国政府，并表示已告知中国并得到积极 回应。 ...

Core Viewpoint - The article emphasizes the critical role of material innovation in driving the next generation of AI computing power, highlighting the shift from traditional silicon-based materials to advanced materials that can meet the increasing demands of AI applications [2][53]. Group 1: Key Materials for AI Computing - Advanced channel materials are essential for semiconductor transistors, directly influencing speed, power consumption, and integration [4]. - AI chips require channel materials with high mobility, high switching ratio, high stability, low power consumption, low leakage current, and ultra-thin thickness [6]. - Various materials such as MoS₂, black phosphorus, InGaAs, germanium, and carbon nanotubes are identified as promising candidates for next-generation AI chips, each with specific performance metrics [7][10][11][12][14]. Group 2: Gate and Dielectric Materials - Gate and dielectric materials are crucial for controlling the flow of current in transistors, affecting switching speed, power consumption, and reliability [17]. - Hafnium oxide (HfO₂) and its doped variants are highlighted for their low leakage currents and high dielectric constants, suitable for advanced logic chips [18][20][21]. Group 3: Substrate Materials - Substrate materials provide physical support and thermal management for semiconductor chips, impacting performance and reliability [23]. - Silicon carbide (SiC) and gallium oxide (β-Ga₂O₃) are noted for their high breakdown fields and thermal conductivity, making them suitable for AI power modules [24][25]. Group 4: Non-volatile Storage Materials - Phase change materials and resistive switching materials are identified for their potential in next-generation memory applications, offering high speed and low power consumption [26][27]. Group 5: Advanced Packaging and Integration Materials - Materials for substrate and interconnects, such as silicon photonic intermediates and glass substrates, are crucial for enhancing signal transmission speed and reducing power loss [29][30]. - Diamond-based thermal management materials are highlighted for their superior heat dissipation capabilities, essential for high-performance AI chips [32]. Group 6: New Computing Paradigms - Photonic computing materials, such as lithium niobate and silicon-based photonic materials, are discussed for their potential to significantly increase processing speed while reducing energy consumption [35][36]. - Quantum computing materials, including superconductors and diamond nitrogen-vacancy centers, are essential for developing quantum computing hardware [38][39]. Group 7: Investment Logic - The investment opportunity lies in material innovation that can replace traditional silicon technologies, aligning with national strategies for semiconductor supply chain security [53]. - Focus areas for investment include advanced logic and storage materials, packaging and thermal management materials, and frontier materials for emerging computing paradigms [54]. Group 8: Conclusion - The article presents a comprehensive overview of the material innovations driving the AI computing revolution, emphasizing the importance of these advancements for China's semiconductor industry and global competitiveness [56].

来源：新浪基金∞工作室 12月9日，芯片龙头ETF（516640）开盘跌0.38%，报1.046元。芯片龙头ETF（516640）重仓股方面，中 芯国际开盘跌1.38%，寒武纪跌3.02%，海光信息跌1.33%，北方华创跌0.43%，澜起科技涨0.02%，兆易 创新跌0.88%，中微公司跌1.47%，豪威集团涨0.02%，芯原股份跌2.06%，长电科技跌0.43%。 芯片龙头ETF（516640）业绩比较基准为中证芯片产业指数收益率，管理人为富国基金管理有限公司， 基金经理为张圣贤，成立（2021-08-19）以来回报为5.16%，近一个月回报为-2.03%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 ...

Market Overview - The Shanghai Composite Index closed at 3928.73 points, above the annual line, with a gain of 0.66% [1] - The total trading volume of A-shares reached 16683.26 billion yuan [1] Stocks Breaking Annual Line - A total of 81 A-shares have surpassed the annual line today, with notable stocks including Tianli Composite, Wanshili, and Sanrenxing, showing divergence rates of 11.85%, 9.63%, and 9.17% respectively [1] - Stocks with smaller divergence rates that just crossed the annual line include Mingyang Electric, Meixin Technology, and Yinzhijie [1] Top Stocks by Divergence Rate - Tianli Composite (code: 920576) had a daily increase of 20.67% with a divergence rate of 11.85% [1] - Wanshili (code: 301066) increased by 10.08% with a divergence rate of 9.63% [1] - Sanrenxing (code: 605168) rose by 10.00% with a divergence rate of 9.17% [1] Additional Notable Stocks - Nanjing Shanglv (code: 600250) increased by 9.98% with a divergence rate of 8.18% [1] - Xiexin Integrated (code: 002506) rose by 9.96% with a divergence rate of 7.86% [1] - Daye Co. (code: 603278) increased by 9.98% with a divergence rate of 7.79% [1]

12月5日，2025深圳全球招商大会在深圳会展中心启幕。本届大会以"开放链全球，创新领未来"为主 题，吸引了来自30多个国家和地区的超1000家企业及机构代表参加。深圳以其充沛的经济活力、澎湃的 创新动力与广阔的投资潜力，向全球投资者与创业者抛出橄榄枝。 南山引力链全球 在大会主会场举行的重大项目签约仪式上，南山区成功与中国电子、希尔顿、玻色量子、亚华电子四家 重点企业完成签约。本次签约的四个项目分别聚焦于不同赛道：核心科技、高端服务、量子前沿与高端 电子领域，体现了各行业领军企业对南山未来发展的强大信心。 世界500强央企中国电子再度落子南山，布局春天研究院项目，该项目将围绕集成电路、先进计算等领 域，打造集技术研究、标准制定、测试验证、成果转化于一体的新型研发机构，发挥央企在科技创新与 产业安全中的核心支撑作用。 在这场全球企业与智慧交汇的盛会上，作为深圳经济大区、科技强区与创新高地的南山区，通过精准的 主题推介与重磅项目签约，展现了强大的产业"磁吸力"与合作诚意。 主题专场干货满 大会期间，南山区会同深圳市相关部门及其他区，精心策划并成功举办了人工智能与机器人、AI终端 及软信业两场主题招商活动，向全球 ...

Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by emerging fields such as 5G, AI, IoT, and automotive electronics, with the global market expected to reach $82.1 billion in 2024, a 5% increase year-on-year [1] - Domestic packaging and testing market in China is projected to reach 314.6 billion yuan in 2024, reflecting a 7.14% growth compared to 2023, and is expected to exceed 330.33 billion yuan in 2025 [1] - Major domestic companies like Huada Technology, Changdian Technology, and Tongfu Microelectronics are showing positive financial performance, indicating a strong alignment between domestic advanced packaging technology breakthroughs and market demand upgrades [1] Financial Performance of Leading Companies - Huada Technology reported a total revenue of 12.38 billion yuan for the first three quarters, a year-on-year increase of 17.55%, with a net profit of 543 million yuan, up 51.98% [2] - Changdian Technology achieved a revenue of 28.67 billion yuan, a 14.78% increase year-on-year, but its net profit decreased by 11.39% to 950 million yuan [3] - Tongfu Microelectronics saw a revenue of 20.12 billion yuan, a 17.77% increase, and a net profit of 860 million yuan, reflecting a 55.74% growth [3] Growth Drivers - Huada Technology's growth is attributed to technological breakthroughs in DDR5 DRAM packaging and strategic acquisitions, enhancing its market position in high-value segments like automotive electronics [4] - Changdian Technology is optimizing its product structure and responding to market demand changes, with significant revenue increases in sectors like automotive electronics, which grew by 31.3% [5] - Tongfu Microelectronics is benefiting from increased revenue in mid-to-high-end products, particularly from major clients like AMD, indicating successful strategic positioning in the advanced packaging sector [6] Competitive Landscape - The high-end packaging market is becoming increasingly competitive, with both international giants and domestic leaders intensifying their R&D and capacity expansion efforts, particularly in AI chips and automotive electronics [7] - Changdian Technology has developed a comprehensive advanced packaging technology matrix, applicable across various critical sectors, including AI and automotive electronics [8] - Huada Technology is investing in advanced packaging technologies and has initiated collaborations with AI companies, positioning itself to capture emerging market opportunities [10] Industry Outlook - The domestic advanced packaging industry is transitioning to a phase of high-quality development characterized by technology-driven growth and structural upgrades [11] - Continued demand from AI and automotive electronics sectors, along with advancements in domestic packaging materials and equipment, will enable domestic companies to narrow the gap with international competitors [11] - Companies with strong R&D capabilities and a focus on high-margin products are expected to lead the market and benefit from the overall growth of the semiconductor industry [11]

导读：【编者按】本文作者陆庆丰现年93岁，是长电科技前身——江阴晶体管厂的技术奠基人之一。作 为拥有70年党龄的老党员，陆老曾参与人民海军通信技术工作，1970年代受田秀清同志邀请，从江阴长 江内衣厂开启的晶体管创业团队中加入，后担任该厂厂长长达十年。他不仅主导了晶体管生产技术的突 破，更在企业发展关键阶段推动半导体塑封技术改造，为长电科技如今的行业地位奠定基础。然而，在 企业改制后的发展过程中，这段由田秀清同志带领内衣厂跨界创办晶体管厂、以及陆老等老一辈奠基者 的贡献，却在相当长时间里被淡忘，致使如今许多长电科技员工对这段创业史知之甚少。这段跨越半个 世纪的回忆，既是对田秀清同志的深切致敬，亦是中国半导体工业筚路蓝缕的鲜活见证。 【文/陆庆丰】 当如今长电科技进入中国大陆半导体封测龙头的企业，在国际 "芯" 领域书写中国传奇时，"精益求精、 勇攀高峰" 的企业精神早已融入每一块芯片的封装测试流程之中。可是鲜少有人知晓，这份深植企业骨 髓的精神内核，源自一位名叫田秀清的女性奠基者。她以 39 载短暂生命，在一片荒芜中播下创业的种 子，凭敢闯敢拼的信念、自力更生的坚守，为这座商业巨擘刻下最初的精神烙印。这段从 ...