（来源：淘金ETF） 1.信维通信300136 作为苹果产业链核心供应商，公司主营射频元器件与电磁屏蔽产品，深度绑定苹果手机、平板等产品线 的天线与无线充电模块需求。在消费电子存量竞争阶段，其凭借技术迭代能力和精密制造优势，持续巩 固供应链地位。同时，公司正积极拓展汽车电子等新场景，布局车载无线充电与通信模块业务，以平滑 消费电子周期波动，打造第二增长曲线。从行业维度看，随着苹果对终端设备智能化、集成化要求的提 升，公司在射频领域的技术积累将进一步转化为订单优势。 2.四川长虹600839 公司通过子公司间接切入苹果产业链，主要提供智能电视相关的显示模组与电源管理组件。依托多年积 累的家电制造经验，其在精密组装和成本控制方面具备成熟能力。当前，公司正加速推进"家电+物联 网"战略，围绕苹果生态打造多场景智能终端协同方案，探索家庭场景下的增值服务。在行业层面，消 费电子与家电的融合趋势，为公司带来了新的业务延展空间。 3.智立方301312 作为苹果产业链的后起之秀，公司专注于自动化测试设备的研发与制造，产品覆盖苹果芯片、摄像头模 组等核心部件的性能检测环节。凭借对精密检测技术的持续投入，其设备在精度与稳定性上 ...

Group 1 - The A-share market showed mixed performance on January 20, with the Shanghai Composite Index rising by 0.09%, driven by gains in real estate, building materials, and construction decoration sectors, while the comprehensive and communication sectors experienced declines [1] - The chip technology stocks performed strongly, with the chip ETF (159995.SZ) increasing by 1.16% as of 9:45 AM, and notable individual stock performances included Beijing Junzheng up by 6.08%, Longxin Zhongke up by 5.85%, and Lanke Technology up by 4.03% [1] Group 2 - The demand for AI chips and storage chips remains high, leading overseas storage manufacturers to allocate resources towards advanced packaging (such as HBM), which may tighten the testing capacity for standard storage chips [3] - Rising prices of raw materials such as gold, silver, and copper have significantly increased packaging costs, potentially leading to price hikes across the testing industry [3] - According to Open Source Securities, in a high-demand environment, testing companies may pass on cost pressures through price adjustments and improve profitability, while also optimizing product structures to focus on higher-margin businesses [3] - The chip ETF (159995) tracks the National Chip Index, comprising 30 leading companies in the A-share chip industry across materials, equipment, design, manufacturing, packaging, and testing, including SMIC, Cambricon, Changdian Technology, and Northern Huachuang [3]

沪深两市数据显示，1月16日，融资净买入前十的股票分别为： 中国平安（13.32亿元）、 特变电工 （11.20亿元）、 贵州茅台（10.28亿元）、 佰维存储（6.55亿元）、 香农芯创（6.04亿元）、 新泉股份 （5.93亿元）、 中微公司（5.66亿元）、 兆易创新（4.90亿元）、 通富微电（4.83亿元）、 长电科技 （4.61亿元）。 ...

Group 1 - SMIC (688981) is the largest and most advanced wafer foundry in mainland China, mastering 14nm FinFET technology and maintaining the highest capacity in 28nm mature process domestically, providing foundry services for storage chips [1][40] - The company has received multiple rounds of funding from the National Integrated Circuit Industry Investment Fund, playing a key role in breaking overseas dependence in the domestic storage chip manufacturing sector [1][41] - SMIC also participates in setting multiple industry standards in the domestic semiconductor manufacturing field, consolidating its core voice in the industry chain [1][41] Group 2 - North Huachuang (002371) is a leading semiconductor equipment company in Beijing, providing a full range of equipment for storage chip manufacturing, including etching machines and cleaning machines [2][40] - The company has successfully entered the supply chains of domestic storage manufacturers like Yangtze Memory Technologies and Changxin Memory Technologies, breaking the monopoly of foreign manufacturers [2][41] - With the accelerated expansion of domestic storage chip capacity, North Huachuang's equipment orders continue to grow, and it is establishing new production bases in Tianjin and Yixing [2][41] Group 3 - Hua Hong Semiconductor (688347) focuses on specialty process wafer foundry and is a key player in the domestic storage chip sector, specializing in mature processes like 90nm and 55nm [3][40] - The company provides stable foundry services for domestic storage chip design companies and is expanding its specialty process production lines with support from the National Integrated Circuit Industry Investment Fund [3][41] - Hua Hong has also achieved IATF16949 certification for automotive-grade storage chip processes, enhancing its capabilities in the automotive sector [3][41] Group 4 - Zhongwei (688012) is a global leader in semiconductor etching equipment, with its 5nm etching equipment already in commercial application [4][40] - The company has entered the supply chains of major domestic storage manufacturers and has also penetrated the supply chains of international giants like TSMC and Micron [4][41] - Zhongwei's R&D team comprises over 70% of its workforce, and it holds more than a thousand patents, continuously increasing its market share in the etching equipment sector [4][41] Group 5 - Zhaoyi Innovation (603986) is a leading domestic NOR Flash company, ranking among the top three globally, and is one of the few domestic companies involved in DRAM chip design [5][40] - The company has achieved mass production of 19nm DRAM chips, filling a technology gap in the domestic market, and has established deep cooperation with Changxin Memory Technologies [5][41] - Zhaoyi Innovation has received support from the National Integrated Circuit Industry Investment Fund, focusing its R&D investments on high-end storage chips [5][41] Group 6 - Shengyi Technology (600183) is a leading domestic copper-clad laminate manufacturer, playing a crucial role in the localization of basic materials for the storage chip industry [6][40] - The company has entered the supply chains of major domestic storage packaging companies and provides raw materials to international giants like Samsung and SK Hynix [6][41] - Shengyi is expanding its production capacity in Shaanxi and Jiangsu, with its performance steadily growing alongside the increasing demand for domestic storage chips [6][41] Group 7 - Lanke Technology (688008) is a global leader in memory interface chips, with a market share exceeding 40% for DDR4/DDR5 memory interface chips [7][40] - The company has developed solutions for DDR5 memory interfaces in collaboration with Changxin Memory Technologies, promoting the commercialization of domestic storage modules [7][41] - Lanke's R&D investments focus on cutting-edge fields, extending its product layout into storage control chips [7][41] Group 8 - Shennan Circuits (002916) is a leading domestic printed circuit board manufacturer, focusing on high-end PCB and packaging substrate manufacturing [8][40] - The company has developed storage packaging substrates that meet high reliability and density requirements, entering the supply chains of major domestic storage manufacturers [8][41] - Shennan is also expanding its high-end packaging substrate production lines in Wuxi to further meet the needs of the storage industry [8][41] Group 9 - Jiangbolong (301308) is a leading domestic storage module company, focusing on promoting the application of domestic storage chips in various fields [9][40] - The company has established deep cooperation with domestic storage chip manufacturers and has launched products equipped with domestic storage chips [9][41] - Jiangbolong has acquired the global storage brand Lexar to leverage its overseas channels, increasing its international market presence [9][41] Group 10 - Xian Yicai-U (688783) is a key player in the domestic silicon wafer sector, focusing on the production of 12-inch polished wafers and epitaxial wafers [10][40] - The company has achieved mass production of 12-inch wafers, breaking the monopoly of foreign manufacturers [10][41] - Xian Yicai has received multiple rounds of investment from the National Integrated Circuit Industry Investment Fund, continuously releasing production capacity [10][41] Group 11 - Tuo Jing Technology (688072) is a leading domestic thin film deposition equipment manufacturer, with a market share exceeding 60% for PECVD equipment in domestic storage chip manufacturing [11][40] - The company has entered the supply chains of major domestic storage manufacturers and has also supplied equipment to overseas storage companies [11][41] - Tuo Jing's R&D investment exceeds 30%, continuously launching new equipment suitable for advanced 3D NAND processes [11][41] Group 12 - Shengmei Shanghai (688082) is a leading domestic semiconductor cleaning equipment manufacturer, developing advanced cleaning technologies for storage chip manufacturing [12][40] - The company has entered the supply chains of major domestic storage manufacturers and has also penetrated the supply chains of international giants [12][41] - Shengmei is building a new production base in Shanghai to further meet the equipment needs of storage chip manufacturers [12][41] Group 13 - Huarun Micro (688396) is a leading domestic power semiconductor company, providing packaging and testing services for storage chips [13][40] - The company has expanded its production lines for power semiconductors and storage packaging in Chongqing, enhancing its capabilities in the storage sector [13][41] - Huarun Micro's industrial-grade storage chips have achieved AEC-Q100 certification, enabling them to enter the automotive electronics market [13][41] Group 14 - Changchuan Technology (300604) is a leading domestic semiconductor testing equipment manufacturer, focusing on testing equipment for storage chips [14][40] - The company has entered the supply chains of major domestic storage manufacturers and has received investment from the National Integrated Circuit Industry Investment Fund [14][41] - Changchuan has acquired Singapore's STI company to enhance its competitiveness in the storage testing field [14][41] Group 15 - Changdian Technology (600584) is a global leader in semiconductor packaging and testing, providing high-end packaging services for domestic storage chip design companies [15][40] - The company has established R&D centers in Singapore and South Korea, taking on packaging orders from international giants [15][41] - Changdian has received support from the National Integrated Circuit Industry Investment Fund, continuously expanding its advanced packaging capacity [15][41]

（文章来源：证券日报） 证券日报网讯 1月19日，长电科技在互动平台回答投资者提问时表示，目前SANDISK CHINA LIMITED 及其关联方在一段时间内将持续作为晟碟的主要或者唯一的客户。晟碟上海生产产品包括iNAND闪存 模块，SD、MicroSD存储器，下游产品可广泛应用于移动通信，工业与物联网，汽车，智能家居及消费 终端等领域。公司具有丰富的 Flash / DRAM 产品经验，与全球存储器制造商均有密切合作。 ...

英伟达H100峰值功耗超700W，下一代Rubin处理器直奔1800W，2029年甚至要冲到6000W。算力飙升的背后，是传统封装的"崩溃"——硅中介层散热跟不 上、容易开裂，CoWoS封装的"功耗墙"成了AI算力的致命瓶颈。 （来源：同花顺） 算力需求飙升，先进封装成破局关键 AI算力卷到白热化，芯片却快"热炸"了！ 而破局的关键，藏在"先进封装+SiC"的组合里。台积电广发英雄帖推进SiC中介层，英伟达计划2027年导入12英寸SiC衬底，产业巨头集体押注。 A股市场早已闻风而动：先进封装指数年初至今涨幅超14%，长电科技单日成交额破50亿，晶盛机电、天岳先进等SiC标的异动，一场由"AI算力刚需+SiC 技术突破+国产替代"驱动的盛宴，已经开席！ AI大模型训练、数据中心算力需求呈指数级飙升，直接把芯片推向"功耗极限"。2025年中国智能算力规模达1037.3 EFLOPS，2026年还要再涨40%，但传 统封装早就扛不住了。 芯片性能每提升1倍，功耗就要翻3倍，而硅中介层的热导率只有148 W/m·K，根本散不掉超高功率带来的热量。更麻烦的是，随着CoWoS中介层尺寸变 大，硅材质容易分层开裂，良率大 ...

Group 1 - The A-share market showed mixed performance on January 19, with the Shanghai Composite Index rising by 0.11%, driven by gains in sectors such as electric equipment, public utilities, and automobiles, while the comprehensive and computer sectors faced declines [1] - The chip technology sector demonstrated strength, with the chip ETF (159995.SZ) increasing by 0.15%, and notable gains in constituent stocks such as Haiguang Information (+3.83%), Chipone Technology (+2.53%), and Zhaoyi Innovation (+2.33%) [1] Group 2 - TSMC held a conference on January 15, providing guidance for capital expenditures in 2026, projected to be between $52 billion and $56 billion, a significant increase of up to 36.9% from the previous year's $40.9 billion [3] - The proportion of capital expenditure allocated to advanced packaging, testing, and mask manufacturing has been revised to 10-20%, up from approximately 10% previously [3] - According to Open Source Securities, TSMC's increased capital expenditure is expected to boost expectations for advanced process capacity expansion, with high-end advanced packaging being essential for AI chips, likely leading to significant demand growth [3]

January 16, 2026 03:30 PM GMT JCET Group Co Ltd | Asia Pacific More Visibility on Advanced Packaging, but Fairly Priced | What's Changed | | | | --- | --- | --- | | JCET Group Co Ltd (600584.SS) | From | To | | Rating | Underweight | Equal-weight | | Price Target | Rmb23.50 | Rmb48.50 | JCET stock has rallied in reaction to rising back-end pricing and capacity ramp-up in 2.5D packaging. However, smartphone and PC end demand is challenging in 2026, owing to memory price hikes. JCET is not immune to the weakn ...

如何把握本轮半导体先进封装板块行情？20260116 摘要 全球先进封装市场规模庞大且持续增长，预计到 2029 年将超过 794 亿 美元，台积电等头部企业占比提升，将带动日月光、安靠及大陆长电通 富等封测公司迎来发展机遇。 技术升级驱动封测公司从传统工序向高性能引擎转变，提升价值分配。 多芯片集成等新技术提高 AI 芯片性能，COS L 单片价值可达 1.5~1.7 万美元，较传统封装价值大幅提升。 封测行业价格显著上涨，日月光宣布 2026 年一季度起后端晶圆封装代 工服务价格上调 5~20%，急单涨幅更高。高端需求增长和原材料涨价 是主要驱动因素。 国产算力芯片迎来爆发期，2026-2027 年出货量预计大幅提升，本土 化算力芯片发展将推动国产化供应链建设，加速新型封装板块发展，带 来显著投资机会。 长电先进 XDFOI 全系列产品已量产，覆盖 2.5D/3D 异构集成等前沿领 域，FOY 技术支持 4 纳米节点多芯片集成，良率高，正加速产能建设， COS 月产能预计今年接近 3,000 片，未来有望持续扩张，显著提升利润 率。 Q&A 近年来 AI 技术的深化对封装行业带来了哪些影响？ AI 技术的 ...

长电科技（600584）2025年12月宣布公司旗下车规级芯片封测工厂（JSAC）如期实现通线。京隆科技 2026年1月5日高阶半导体测试项目新厂投产，总投资40亿元，涵盖人工智能、车规级、工业级等高阶芯 片测试领域。通富微电（002156）2026年1月9日披露定增预案，拟定增募资不超44亿元用于存储芯片、 汽车等新兴应用领域、晶圆级封测、高性能计算机通信领域封测产能提升。甬矽电子2026年1月12日公 告拟投资不超过21亿元在马来西亚建设封测基地。此外，日本半导体公司Rapidus计划2026年春季在北 海道启动半导体后道（封测）试产线；海力士2026年1月13日宣布投资19万亿韩元（现汇折算约910亿人 民币）建设清州先进封装工厂P&T7，应对HBM等AI内存需求。 封测涨价：核心推手是结构性需求旺盛与成本传导 据工商时报，日月光因AI芯片需求增长及原材料成本上涨，预计调涨价格5-20%，中国台湾力成、南茂 等封测厂订单饱满，产能接近满载，已启动首轮涨价，涨幅高达30%。结构上看，AI芯片与存储芯片需 求持续高景气，海外存储厂商将资源向先进封装（如HBM）倾斜，可能导致标准型存储芯片的封测产 能趋紧。同 ...