Financial Performance - The company reported a revenue increase of 25% year-over-year for the first half of 2024, reaching approximately 1.5 billion RMB[1]. - The company reported a significant increase in revenue, achieving a total of 1.2 billion CNY for the first half of 2024, representing a 25% year-over-year growth[9]. - The company's operating revenue for the first half of 2024 reached CNY 2,403,896,730.50, representing a year-on-year increase of 49.33%[14]. - The net profit attributable to shareholders was CNY 443,182,595.18, a slight increase of 0.85% compared to the same period last year[14]. - The company achieved continuous revenue growth and maintained profitability during the reporting period, driven by improved technology and product maturity[22]. - The company reported a total R&D investment of approximately CNY 390.32 million, a 62.46% increase compared to the previous year, with R&D expenses accounting for 16.24% of operating revenue[49]. - The company reported a net profit margin improvement, with net profit for the first half of 2024 showing a positive trend compared to the previous year, although specific figures were not disclosed[173]. - The total profit for the first half of 2024 was ¥468,057,022.56, compared to ¥489,187,912.36 in the same period last year, a decline of 4.3%[174]. Market Expansion and Strategy - The company is expanding its market presence in Southeast Asia, targeting a 10% market share by the end of 2025[1]. - The company is expanding its market presence in Southeast Asia, targeting a 30% market share by the end of 2025[9]. - The company has no plans for mergers or acquisitions in the near term, prioritizing organic growth strategies[1]. - The company is actively pursuing new technologies and products, including stress-free copper polishing technology, which is currently in small batch trial production[52]. - The company plans to continue expanding its market presence and investing in new technologies to drive future growth[173]. Research and Development - Research and development expenses increased by 30%, amounting to 200 million RMB, focusing on next-generation semiconductor technologies[1]. - The company is investing 200 million CNY in R&D for new technologies, focusing on FinFET and low-k dielectric materials[9]. - The company has developed advanced cleaning technologies, such as the SAPS and TEBO ultrasonic cleaning technologies, which ensure uniform energy distribution on wafers and non-destructive cleaning of microstructures[25]. - The company has developed a patented nozzle cover to prevent high-temperature chamber acid gas issues, enhancing the operational capabilities of its SPM equipment[56]. - The company has achieved a 62.56% increase in R&D expenses due to improvements in existing products and the development of new products and processes[50]. Financial Position and Assets - The company's total assets increased by 12.78% to CNY 11,000,299,616.44 compared to the end of the previous year[14]. - The company's accounts receivable amounted to 1,523.67 million yuan, accounting for 13.85% of total assets, indicating a significant operational capital pressure[73]. - The company's inventory value reached 4,388.38 million yuan, representing 50.39% of current assets, with finished goods and goods in transit valued at 2,078.78 million yuan, making up 47.37% of total inventory[74]. - The company's total liabilities increased to ¥3,559,738,437.28 as of June 30, 2024, compared to ¥2,399,532,383.22 at the end of 2023, reflecting a growth of 48.2%[172]. - The company's total equity attributable to shareholders reached ¥6,706,082,865.73, up from ¥6,449,959,017.90 at the end of 2023, indicating a growth of 3.9%[172]. Corporate Governance and Compliance - The company has established a robust corporate governance structure, enhancing compliance with laws and regulations to ensure sustainable development[66]. - The company is committed to preventing insider trading and ensuring the transparency of information disclosure to protect investors' rights[66]. - The company has implemented a stock option incentive plan with a three-year exercise period from the exercise date, aimed at motivating key personnel[114]. - The company has a long-term commitment regarding the resolution of related party transactions, effective from November 18, 2021, indicating a focus on transparency and governance[113]. - The company has committed to minimizing investor losses and will publicly disclose reasons for any unfulfilled commitments[132]. Risks and Challenges - The company has identified potential risks related to supply chain disruptions, with mitigation strategies outlined in the management discussion section[1]. - The company faces risks related to technology updates, key talent retention, and potential leaks of core technology[67][68]. - The company is exposed to market competition risks from international giants with stronger financial and technological capabilities, which could negatively impact revenue and financial status[69]. - The company faces high customer concentration risk, as major clients may change their non-binding purchase forecasts without notice, impacting sales and cash flow[72]. Environmental and Sustainability Efforts - The company is focused on environmental sustainability, with new cleaning equipment designed to reduce operational costs and emissions[51]. - The company was listed as a key pollutant discharge unit in Shanghai for 2024, with hazardous waste generation including 49.5 tons of waste copper plating solution and 104.43 tons of acidic waste[101]. - The company has a waste gas treatment facility with a design capacity of 15,000 cubic meters per hour, which is operational and compliant with standards[102]. - The company has committed to not providing loans or financial assistance to incentive recipients for acquiring restricted stocks under the incentive plan[135]. Shareholder and Stock Information - The company plans to issue A-shares to specific investors, with a proposal for the use of raised funds in technology innovation[97]. - The company has committed to a share restriction period of 36 months starting from November 18, 2021, for major shareholders and related parties, ensuring compliance with the commitment[111]. - The company will not engage in any business activities that compete with its main business and will ensure the independence of its assets and operations[133]. - The company has a commitment to distribute dividends within three years from November 18, 2021, reflecting a focus on returning value to shareholders[113].

证券代码：688082 证券简称：盛美上海 公告编号：2024-036 盛美半导体设备（上海）股份有限公司 关于召开 2024 年第一季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2024 年 7 月 30 日（星期二）下午 13:00-14:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网址： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频录播和网络互动 投资者可于 2024 年 7 月 23 日（星期二）至 7 月 29 日（星期一）16:00 前 登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 （ir@acmrcsh.com）进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）已于2024年4 月27日发布公司2024年第一季度报告，为便于广大投资者更全面深入地了解公司 2024年第一季度经营成果、 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-035 盛美半导体设备（上海）股份有限公司 2023 年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 股权登记日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | | 2024/7/18 | 2024/7/19 | 2024/7/19 | 一、 通过分配方案的股东大会届次和日期 本次利润分配方案经公司 2024 年 6 月 18 日的 2023 年年度股东大会审议通 过。 二、 分配方案 1. 发放年度：2023 年年度 2. 分派对象： 四、 分配实施办法 1. 实施办法 除公司自行发放对象外，公司其余股东的红利委托中国结算上海分公司通过 其资金清算系统向股权登记日上海证券交易所收市后登记在册并在上海证券交易 所各会员办理了指定交易的股东派发。已办理指定交易的投资者可于红利发放日 在其指定的证券营业部领取现金红利，未办理指定交易的股东红利暂由中国结算 上海分公司保管，待办理指定交易后再 ...

Investment Rating - Buy rating (首次) [2] Core Views - The company is a leading domestic cleaning equipment manufacturer, expanding globally with a diversified product portfolio including cleaning, electroplating, advanced packaging wet processes, vertical furnace, coating/developing, and PECVD equipment [3] - Revenue CAGR from 2018-2023 was 47.87%, with strong market recognition both domestically and internationally [3] - Expected net profit for 2024-2026 is 1.071/1.569/2.067 billion yuan, with EPS of 2.46/3.60/4.74 yuan [3] - Current PE ratios for 2024-2026 are 35.1/23.9/18.2x [3] Cleaning Equipment - The company's SAPS+TEBO+Tahoe technologies cover 90%-95% of cleaning steps, with IPA and supercritical CO2 drying technologies enhancing competitiveness [4] - Aims to achieve 55%-60% market share in China [4] Multi-Category Product Matrix - Rapid progress in vertical furnace development, with applications in LPCVD, oxidation, annealing, and ALD [5] - Differentiated electroplating technology and comprehensive product range, making it one of the few companies globally with core patents in chip copper interconnect electroplating [5] - Advanced packaging wet process equipment benefits from the growing demand in the post-Moore era [5] Growth Potential - Entry into PECVD and coating/developing markets, with 2-3 core PECVD customers expected by 2024 and revenue contribution starting in 2025 [6] - Plans to launch ArF coating/developing iteration equipment by the end of 2024, along with immersion ArFi Track, offering differentiated product designs [6] Financial Performance - Revenue CAGR from 2018-2023 was 47.87%, with 2023 revenue reaching 3.888 billion yuan, a 35.34% YoY increase [20] - Net profit CAGR from 2018-2023 was 57.84%, with 2023 net profit at 911 million yuan, a 36.21% YoY increase [20] - 2024Q1 revenue was 921 million yuan, a 49.63% YoY increase, while net profit was 80 million yuan, a 38.76% YoY decrease [20] Market Position - The company is ranked third in domestic semiconductor equipment revenue in 2023, with 3.888 billion yuan in revenue [41] - Its platform strategy covers multiple product lines, making it one of the few domestic companies with international competitiveness [42] Industry Overview - The global semiconductor equipment market exceeded $100 billion in 2023, with China accounting for 34.4% of the market [31] - The cleaning equipment market is valued at $6 billion, with the company aiming for a 55%-60% market share in China [4][31]

上海信公轶禾企业管理咨询有限公司 独立财务顾问报告 上海信公轶禾企业管理咨询有限公司 关于 盛美半导体设备（上海）股份有限公司 2023 年限制性股票激励计划 预留授予相关事项 之 独立财务顾问报告 独立财务顾问： 二〇二四年六月 | 第一章 | 声 明 1 | | --- | --- | | 第二章 | 义 3 释 | | 第三章 | 基本假设 4 | | 第四章 | 本激励计划履行的审批程序 5 | | 第五章 | 本次限制性股票的授予情况 7 | | | 一、限制性股票预留授予的具体情况 7 | | | 二、本次实施的股权激励计划与股东大会审议通过的激励计划的差异情况 9 | | 第六章 | 本次限制性股票授予条件说明 10 | | | 一、限制性股票授予条件 10 | | | 二、董事会对授予条件成就的情况说明 10 | | 第七章 | 独立财务顾问的核查意见 12 | 上海信公轶禾企业管理咨询有限公司 独立财务顾问报告 第一章 声 明 上海信公轶禾企业管理咨询有限公司接受委托，担任盛美半导体设备（上 海）股份有限公司（以下简称"盛美上海"、"上市公司"或"公司"）2023 年限制 性股票激励计划（以 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-033 盛美半导体设备（上海）股份有限公司 关于使用部分闲置募集资金暂时补充流动资金的 公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 盛美半导体设备（上海）股份有限公司（以下简称"盛美上海"、"公 司"）于2024年6月25日召开第二届董事会第十一次会议和第二届监事会第十一 次会议，审议通过了《关于使用部分闲置募集资金暂时补充流动资金的议案》， 同意公司拟使用不超过人民币25,000.00万元（含本数）的闲置募集资金进行暂 时性补充流动资金，仅限用于公司的业务拓展、日常经营等与主营业务相关的生 产经营，不会通过直接或者间接安排用于新股配售、申购，或者用于股票及其衍 生品种、可转换公司债券等的交易，不会变相改变募集资金用途，不会影响募集 资金投资计划的正常进行。 使用期限自公司董事会审议通过之日起12个月内有效，在有效期内上述 额度可以滚动循环使用，且公司将随时根据募投项目的进展及需求情况及时归还 至募集资金专用账户。 本议案在董事会审批 ...

（3）最近 12 个月内因重大违法违规行为被中国证监会及其派出机构行政处 罚或者采取市场禁入措施； （4）具有《公司法》规定的不得担任公司董事、高级管理人员情形的； 盛美半导体设备（上海）股份有限公司 监事会关于公司 2023 年限制性股票激励计划预留授予激励对 象名单的核查意见（截至预留授予日） 盛美半导体设备（上海）股份有限公司（以下简称"公司"）监事会依据《中 华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共和国证券法》（以 下简称"《证券法》"）、《上市公司股权激励管理办法》（以下简称"《管理办法》"）、 《上海证券交易所科创板股票上市规则》（以下简称"《股票上市规则》"）、《科创 板上市公司自律监管指南第 4 号——股权激励信息披露》等相关法律、法规及规 范性文件和《公司章程》的有关规定，对公司 2023 年限制性股票激励计划（以 下简称"本激励计划"）预留授予激励对象名单（截至预留授予日）进行了审核， 现发表核查意见如下： 1、本激励计划预留授予的激励对象均不存在《管理办法》第八条规定的不 得成为激励对象的情形： （1）最近 12 个月内被证券交易所认定为不适当人选； （2）最近 12 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-034 盛美半导体设备（上海）股份有限公司 关于向 2023 年限制性股票激励计划激励对象授予 预留部分限制性股票的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 3、2023年5月9日至2023年5月18日，公司在公司内部对本次拟激励对象的姓 名和职务进行了公示，公示期共计10天，公司员工可向公司监事会提出意见。截 至公示期满，公司监事会未收到任何人对本次拟激励对象提出的异议。2023年6 月22日，公司于上海证券交易所网站（www.sse.com.cn）披露了《监事会关于公 司2023年限制性股票激励计划首次授予激励对象名单的审核意见及公示情况说 明》（公告编号：2023-025）。 4、2023年6月28日，公司召开2022年度股东大会审议通过了《关于公司<2023 年限制性股票激励计划（草案）>及其摘要的议案》等相关议案。股东大会批准 公司实施本激励计划，授权董事会确定限制性股票授予日，并在激励对象符合条 件时向激励对象授予限制性股票并办理授予限 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2023 年限制性股票激励计划预留授予事项之 法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）受盛美半导体设备（上 海）股份有限公司（以下简称公司或盛美上海）委托，作为公司 2023 年限制性股 票激励计划（以下简称本计划、本激励计划或本次激励计划）的专项法律顾问， 根据《中华人民共和国公司法》（以下简称《公司法》）、《中华人民共和国证券 法》（以下简称《证券法》）、中国证券监督管理委员会（以下简称中国证监会） 《上市公司股权激励管理办法》（以下简称《管理办法》）、《上海证券交易所科创 板股票上市规则》和《科创板上市公司自律监管指南第 4 号—股权激励信息披 露》等法律、行政法规、部门规章及规范性文件（以下简称法律法规）和《盛美 半导体设备（上海）股份有限公司章程》（以下简称《公司章程》）的有关规定， 就公司向激励对象授予预留部分限制性股票（以下简称本次授予）所涉及的相关 事项，出具本法律意见书。 为出具本法律意见，本所依据《律师事务所从事证券法律业务管理办法》和 《律师事务所证券法律业务执业 ...

证券代码：688082 证券简称：盛美上海 公告编号：2024-030 盛美半导体设备（上海）股份有限公司 第二届董事会第十一次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 2024 年 6 月 25 日，盛美半导体设备（上海）股份有限公司（以下简称"公 司）第二届董事会第十一次会议在上海自由贸易试验区蔡伦路 1690 号第 4 幢 5 楼会议室举行，本次会议应出席董事 11 名，实际出席会议的董事 11 名。全体董 事认可本次会议的通知时间、议案内容等事项。本次会议的召集和召开程序符合 《中华人民共和国公司法》《中华人民共和国证券法》等法律法规及《盛美半导 体设备（上海）股份有限公司章程》和《盛美半导体设备（上海）股份有限公司 董事会议事规则》的相关规定，合法有效。 会议由董事长 HUI WANG 先生主持。 二、董事会会议审议情况 （一）审议通过了《关于公司部分募集资金投资项目延期的议案》 表决情况：11 票赞成，占全体董事人数的 100%；0 票弃权；0 票反对。 详见同日在上 ...