公司将积极推进上述三类产品在中国台湾市场的应用及拓展，后续相关产品的具体动态信息敬请关注公 司披露的公开信息。公司将积极把握面板级设备市场发展趋势，做全湿法工艺的面板设备类型。此外， 晶圆级封装设备今年也有信心在中国台湾打开市场。 格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，目前，公司重点推出的面板级先 进封装的新设备包括Ultra ECP ap-p面板级电镀设备、Ultra C vac-p面板级负压清洗设备和Ultra C bev-p 面板级边缘刻蚀设备等三款新产品。其中，Ultra ECP ap-p面板级电镀设备创新性地采用了专利申请保 护的水平（平面）电镀方式，让方形电场与面板实现同步旋转，能够更好地控制电镀均匀性；同时能够 实现面板传输过程中引起的槽体间污染控制，大大降低了不同种金属电镀槽之间化学交叉污染的风险； Ultra C vac-p面板级负压清洗设备利用负压技术去除芯片结构中的助焊剂残留物，可使清洗液到达狭窄 的缝隙，显著提高了清洗效率，目前该设备已经在客户端实现量产；Ultra C bev-p面板级边缘刻蚀设备 采用专为边缘刻蚀和铜残留清除而设计的湿法刻蚀工艺 ...

格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，目前，公司重点推出的面板级先 进封装的新设备包括Ultra ECP ap-p面板级电镀设备、Ultra C vac-p面板级负压清洗设备和Ultra C bev-p 面板级边缘刻蚀设备等三款新产品。其中，Ultra ECP ap-p面板级电镀设备创新性地采用了专利申请保 护的水平（平面）电镀方式，让方形电场与面板实现同步旋转，能够更好地控制电镀均匀性；同时能够 实现面板传输过程中引起的槽体间污染控制，大大降低了不同种金属电镀槽之间化学交叉污染的风险； Ultra C vac-p面板级负压清洗设备利用负压技术去除芯片结构中的助焊剂残留物，可使清洗液到达狭窄 的缝隙，显著提高了清洗效率，目前该设备已经在客户端实现量产；Ultra C bev-p面板级边缘刻蚀设备 采用专为边缘刻蚀和铜残留清除而设计的湿法刻蚀工艺，在扇出型面板级封装技术中起到至关重要的作 用。 公司将积极推进上述三类产品在中国台湾市场的应用及拓展，后续相关产品的具体动态信息敬请关注公 司披露的公开信息。公司将积极把握面板级设备市场发展趋势，做全湿法工艺的面板设备类型。此外， ...

格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，整体来看，存储客户占比略高于 逻辑客户，整体差异不大，逻辑客户增长也很强劲。具体客户的采购份额会有所差异，部分客户采购公 司产品的比例达到了50%以上。2026年，公司期待实现清洗设备的种类全覆盖、工艺全覆盖，积极推进 成熟工艺继续扩大市场，在先进工艺上也将持续提升市场占有率。 ...

格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，整体来看，存储客户占比略高于 逻辑客户，整体差异不大，逻辑客户增长也很强劲。具体客户的采购份额会有所差异，部分客户采购公 司产品的比例达到了50%以上。2026年，公司期待实现清洗设备的种类全覆盖、工艺全覆盖，积极推进 成熟工艺继续扩大市场，在先进工艺上也将持续提升市场占有率。 ...

格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，公司高度重视海外市场的拓展， 始终坚持"技术差异化、产品平台化、客户全球化"的发展战略，产品矩阵已覆盖清洗设备、电镀设备、 先进封装湿法设备、立式炉管系列设备、涂胶显影设备、PECVD设备和面板级设备等，且所有设备均 拥有全球自主知识产权、具备差异化的市场竞争优势，持续提升了国际市场的客户认可度。目前，公司 自主研发的差异化核心设备已获得多家国际客户的关注与认可，今年公司已经有产品进入新加坡市场， 去年也有四台设备进入美国市场，同时也在推进中国台湾、韩国等海外市场的扩张，预计2026年海外市 场开拓速度相对2025年会加速。未来公司将持续推进客户全球化战略，积极推进产品出海，扩大海外市 场销售份额，不断将具有差异化竞争优势的产品更多推向海外市场，为整体营收攀升提供支撑，更为全 球半导体的工业发展贡献力量。 ...

格隆汇1月29日丨盛美上海(688082.SH)近日接受特定对象调研时表示，公司预计2026年的毛利率水平仍 将保持在42%-48%之间，研发投入占比预计将在14%-19%之间。 ...

公司基本情况 | 最新收盘价（元） | 199.89 | | --- | --- | | 总股本/流通股本（亿股）4.80 | / 4.36 | | 总市值/流通市值（亿元）960 | / 872 | | 52 周内最高/最低价 | 212.45 / 92.60 | | 资产负债率(%) | 36.8% | | 市盈率 | 75.72 | | 第一大股东 | ACM RESEARCH, | | INC. | | 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 盛美上海(688082) 证券研究报告：电子 | 公司点评报告 股票投资评级 指引强劲增长 l 投资要点 产品平台化持续推进，2026 年营收指引高增。截至 2025 年 9 月 29 日，公司在手订单总金额为 90.72 亿元，与上年同期已自愿 性披露的在手订单数据相比，在手订单总金额同比增加 34.10%。 公司销售交货及调试验收工作持续高效推进，有效保障了经 ...

| 最新收盘价（元） | 199.89 | | --- | --- | | 总股本/流通股本（亿股）4.80 | / 4.36 | | 总市值/流通市值（亿元）960 | / 872 | | 52 周内最高/最低价 | 212.45 / 92.60 | | 资产负债率(%) | 36.8% | | 市盈率 | 75.72 | | 第一大股东 | ACM RESEARCH, | | INC. | | 研究所 证券研究报告：电子 | 公司点评报告 股票投资评级 公司基本情况 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 盛美上海(688082) 指引强劲增长 l 投资要点 产品平台化持续推进，2026 年营收指引高增。截至 2025 年 9 月 29 日，公司在手订单总金额为 90.72 亿元，与上年同期已自愿 性披露的在手订单数据相比，在手订单总金额同比增加 34.10%。 公司销售交货及调试验收工作持续高效推进，有效保障了经 ...

Industry Insights - Samsung Electronics has raised NAND flash supply prices by over 100% in Q1 2026, significantly exceeding market expectations, highlighting a severe supply-demand imbalance in the semiconductor market [2] - The company has completed negotiations with major clients for new pricing, effective from January, following a nearly 70% increase in DRAM prices [2] - Samsung is preparing for a new round of negotiations for NAND prices in Q2, with expectations of continued price increases [2] Company Performance - Zhongwei Company (688012.SH) expects a net profit of 2.08 billion to 2.18 billion RMB for 2025, representing a year-on-year growth of approximately 28.74% to 34.93% [2] - The company's plasma etching equipment, a core semiconductor manufacturing tool, is gaining recognition both domestically and internationally, with significant increases in shipments for advanced logic and memory devices [2] - Shengmei Shanghai (688082.SH) forecasts revenue of 6.68 billion to 6.88 billion RMB for 2025, an increase of 18.91% to 22.47% year-on-year, driven by strong global semiconductor demand and successful customer expansion [3] - The company anticipates 2026 revenue to be between 8.2 billion and 8.8 billion RMB, reflecting ongoing business growth trends and order situations [3] Market Trends - The semiconductor equipment market is expected to continue growing, driven by sustained demand for AI computing power, an upward cycle in storage chips, and advancements in packaging technology [3] - TSMC projects capital expenditures of 52 to 56 billion USD for 2026, a significant increase from 40.9 billion USD in 2025, further highlighting market opportunities in semiconductor equipment [3] Related ETFs - The Sci-Tech Semiconductor ETF (588170) tracks the Sci-Tech Board semiconductor materials and equipment index, focusing on semiconductor equipment (60%) and materials (25%) [4] - The ETF benefits from the domestic substitution trend in the semiconductor industry, which has a low domestic replacement rate and high potential for growth, driven by the AI revolution and technological advancements [4] - The Huaxia Semiconductor Equipment ETF (562590) also emphasizes semiconductor equipment (63%) and materials (24%), targeting the upstream semiconductor sector [4]

Core Viewpoint - Shengmei Shanghai (688082.SH) has reported impressive revenue forecasts for 2025 and 2026, highlighting its growth in the semiconductor equipment industry and its ambition to compete globally [1][5]. Group 1: Company Performance - Shengmei Shanghai expects its revenue for 2025 to be between 6.68 billion and 6.88 billion yuan, representing a year-on-year growth of 18.91% to 22.47% [1]. - The company anticipates its revenue for 2026 to range from 8.2 billion to 8.8 billion yuan [1][6]. - In 2024, Shengmei Shanghai's revenue reached 5.618 billion yuan, with a net profit of 1.153 billion yuan [5]. Group 2: Market Position and Strategy - Shengmei Shanghai holds an 8.0% global market share in the semiconductor cleaning equipment sector, ranking fourth worldwide [1]. - The company aims to invest 5 billion yuan in R&D over the next three years to achieve breakthroughs in new areas such as coating and electroplating [1][6]. - Shengmei Shanghai has successfully entered key global semiconductor markets, including Korea and Japan, securing orders from overseas wafer fabs [6]. Group 3: Historical Development - Founded in 2005 by Wang Hui, Shengmei Shanghai has evolved from a domestic startup to a leader in the semiconductor cleaning equipment industry [3][4]. - The company has developed innovative cleaning technologies, including SAPS and TEBO, which have enabled it to break into markets previously dominated by international competitors [3][5]. - Shengmei Shanghai went public on NASDAQ in 2017 and later listed on the STAR Market in 2021, marking its dual listing in both US and Chinese markets [4].