Core Viewpoint - The company has developed the UltraLithTMTrack equipment for 300mm front-end integrated circuit manufacturing, which enhances production efficiency and reduces defect rates while optimizing costs [1] Group 1: Product Development - The UltraLithTMTrack equipment features uniform downward airflow, high-speed stable robotic arms, and a robust software system tailored to customer needs [1] - The equipment supports mainstream lithography machine interfaces and various lithography processes, including i-line, KrF, and ArF systems, ensuring compliance with process requirements [1] Group 2: Market Impact - After five years of dedicated research and development, the company plans to launch its first self-developed high-output (300WPH) KrF front-end coating and developing equipment, UltraLITHKrF, in Q3 2025 [1] - The UltraLITHKrF has already been successfully delivered to leading logic wafer manufacturers in China, showcasing the company's capability to expand into new product categories [1]

Group 1 - The core point of the article is that Shengmei Shanghai has two production plants in its Lingang factory area, with Plant A already in operation and nearing full capacity, while Plant B is expected to begin renovations this year [1] - Once both Plant A and Plant B are fully operational, the company anticipates an annual output value of 20 billion RMB [1]

Core Viewpoint - The company, Shengmei Shanghai, has reported that its production capacity utilization is currently high, with Factory A nearing full production and plans for Factory B to begin renovations this year [2]. Group 1: Production Capacity - Shengmei Shanghai operates two production facilities in its Lingang plant, with Factory A already in operation and close to full capacity [2]. - The company anticipates that once both Factory A and Factory B are fully operational, they will achieve an annual output value of RMB 20 billion [2]. Group 2: Future Plans - The company has indicated that any future expansion plans will be disclosed in public announcements [2].

Core Viewpoint - The company has confirmed that its production capacity utilization is currently high, with one factory nearing full production and another set to begin renovations soon [1] Group 1 - The company operates two production plants in the Lingang area, with Plant A already in operation and close to full capacity [1] - Plant B is expected to start renovations this year, which will contribute to the overall production capacity [1] - Once both plants are fully operational, the company anticipates an annual output value of RMB 20 billion [1]

Group 1 - The core viewpoint of the article highlights that Shengmei Shanghai (688082.SH) is committed to a "globalization of customers" strategy, actively expanding its international market presence while serving domestic clients [1] - Shengmei has established stable partnerships with numerous leading companies in the semiconductor industry, including Changxin Technology in Hefei, after years of effort [1] - The company's international clients are spread across the United States, South Korea, Taiwan, and Southeast Asia [1]

Group 1 - The core viewpoint of the article highlights that Shengmei Shanghai (688082.SH) is committed to a "globalization of customers" strategy, actively expanding its international market presence while serving domestic clients [1] - Shengmei has established stable partnerships with numerous leading companies in the semiconductor industry, including Changxin Technology in Hefei, after years of effort [1] - The company's international clients are spread across the United States, South Korea, Taiwan, and Southeast Asia [1]

Group 1 - The core point of the news is that Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. experienced a stock price increase of 5.39%, reaching 199.50 CNY per share, with a trading volume of 323 million CNY and a turnover rate of 0.38%, resulting in a total market capitalization of 95.793 billion CNY [1] - Shengmei Shanghai specializes in the research, development, production, and sales of semiconductor equipment, with 99.72% of its revenue coming from product sales and 0.28% from services [1] Group 2 - According to data from the top ten circulating shareholders of Shengmei Shanghai, the Nuoan Growth Mixed Fund A (320007) reduced its holdings by 754,100 shares in the third quarter, now holding 2,468,600 shares, which represents 0.57% of the circulating shares [2] - The Nuoan Growth Mixed Fund A has a current scale of 18.468 billion CNY and has achieved a year-to-date return of 11.92%, ranking 447 out of 8,838 in its category, while its one-year return is 59.27%, ranking 1,529 out of 8,089 [2] - The fund manager, Liu Huiying, has been in charge for 3 years and 166 days, with the fund's total asset scale at 23.634 billion CNY, achieving a best return of 94.73% and a worst return of 26.25% during her tenure [2]

Group 1 - The semiconductor equipment market is experiencing significant growth driven by the demand for AI-related investments, particularly in advanced logic circuits, memory, and packaging technologies [2][3] - The global semiconductor equipment sales are projected to reach a record $133 billion in 2025, with a year-on-year growth of 13.7%, and expected to continue rising to $145 billion in 2026 and $156 billion in 2027 [2] - The wafer fabrication equipment (WFE) sector is anticipated to achieve a sales record of $104 billion in 2024, with an 11% increase to $115.7 billion in 2025, reflecting higher-than-expected investments in DRAM and HBM [2] Group 2 - Major global memory manufacturers are expanding production and upgrading technology, which is a key driver for semiconductor equipment demand [3][4] - Samsung and SK Hynix are accelerating memory capacity expansion, with Samsung focusing on high-end products and SK Hynix preparing to complete a new factory by 2027 [4] - By 2026, South Korea is expected to reclaim the second position in global chip equipment spending, reaching approximately $29.66 billion, a 27.2% increase from 2025 [4] Group 3 - The evolution of storage chips, particularly 3D NAND and DRAM, is driving demand for etching and deposition equipment, with significant increases in the number of layers and complexity of structures [5][6] - The demand for etching equipment is expected to rise sharply as 3D NAND layers increase from 32 to 128, with etching equipment usage rising from 34.9% to 48.4% [10] - The global spending on storage-related equipment is projected to reach $136 billion between 2026 and 2028, with over 40% attributed to 3D NAND investments [11] Group 4 - The demand for deposition equipment is also surging, with the need for more steps in the deposition process as the number of 3D NAND layers increases [11] - Advanced technologies such as atomic layer deposition (ALD) are becoming more critical, with ALD equipment's share in capital expenditures rising from 18% in the 2D era to 26% in the 3D era [11] - HBM technology is increasing the demand for lithography and hybrid bonding equipment due to the need for high-density interconnections and precision [12] Group 5 - Domestic companies are making significant progress in the production of core semiconductor equipment, including etching, deposition, and hybrid bonding devices [14][15] - Companies like Zhongwei, Northern Huachuang, and Yitang Semiconductor are leading in etching equipment, while Northern Huachuang and TuoJing Technology are notable in deposition equipment [14][15] - The hybrid bonding sector is also seeing advancements, with companies like Qinghe Crystal and TuoJing Technology developing innovative bonding solutions for various applications [16][17]

Group 1 - The core announcement from Shengmei Shanghai is the approval of several key proposals during the first extraordinary shareholders' meeting of 2026, including changes to registered capital and related documents [2] - The company also approved a proposal regarding the execution of related party transactions for the year 2025 and the expected related party transactions for 2026 [2]

致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2026 年 1 月 8 日召开的 2026 年第一次临时股东会（以下简称本 次股东会），并就本次股东会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 1. 经公司 2025 年第四次临时股东会审议通过的《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）； 2. 公司 2025 年 12 月 13 日刊登于上海证券交易所网站的《盛美半导体设备 （上海）股份有限公司第三届董事会第二次会议决议 ...