每经AI快讯，八亿时空（688181.SH）2月26日在投资者互动平台表示，公司密切关注6G、卫星通信等 相关领域的发展机遇，针对微波液晶、液晶相控阵天线等高端应用材料已开展技术研发与产品布局，正 与相关企业及科研机构协同推进。 （文章来源：每日经济新闻） ...

（记者 曾健辉） 每经AI快讯，有投资者在投资者互动平台提问：贵公司在高端液晶材料上面有进展吗？ 八亿时空（688181.SH）2月26日在投资者互动平台表示，公司持续关注AI算力与光通信领域的发展机 遇，目前公司正与下游相关企业及科研机构合作开发WSS用高端液晶材料。 ...

经济观察网 八亿时空（688181）近期股价表现活跃，近5个交易日累计上涨3.75%。 以上内容基于公开资料整理，不构成投资建议。 股票近期走势八亿时空（688181）在近一周内股价表现活跃。2026年2月25日，该股收盘报36.00元，单 日涨幅1.90%，成交金额约2.02亿元，换手率达4.22%。近5个交易日累计上涨3.75%，但近20日仍下跌 3.49%。资金流向方面，2月25日主力资金净流出511.23万元，散户资金呈净流入状态。公司主营业务为 液晶材料，所属电子板块近期整体上涨，光学光电子板块近5日涨幅0.85%。 近期事件A股市场在2026年2月25日前后热度回升，成交额放量至2.46万亿元，周期品如有色金属、化工 等板块集体上涨，受福建、河南等多地发布汽车以旧换新补贴细则等政策推动。公募基金高管对2026年 A股结构性机会持乐观态度，强调科技成长、能源转型等领域潜力，可能间接利好科技类股票。 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market sizes and growth rates anticipated [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: expected to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. - The investment landscape is characterized by a shift towards domestic production, with numerous Chinese companies emerging as competitors to established foreign firms [7][8]. Industry Trends - The article emphasizes the trend of domestic substitution in advanced materials, particularly in sectors heavily reliant on imports from countries like Japan [7][8]. - It highlights the importance of innovation and R&D in maintaining competitive advantages within the industry [7][8]. Strategic Insights - Investment strategies vary across different stages of company development, from seed rounds to pre-IPO phases, with a focus on team capabilities, market potential, and product maturity [10]. - The article suggests that the current market conditions present a favorable environment for investments in advanced materials, particularly for companies that can demonstrate strong growth potential and innovative capabilities [10].

Group 1 - The company has recently initiated a share buyback program and plans to utilize idle raised funds for cash management [1] - As of December 31, 2025, the company has repurchased a total of 477,000 shares, representing 0.35% of the total share capital, with a total expenditure of approximately 13.37 million yuan, at a buyback price range of 27.69 yuan to 28.20 yuan per share [2] - The buyback plan is set to continue until May 15, 2026, with the company indicating that it will proceed based on market conditions for employee stock ownership plans or equity incentives [2] Group 2 - On December 23, 2025, the company announced plans to use up to 25 million yuan of temporarily idle raised funds for cash management, investing in safe and liquid principal-protected financial products [3] - The investment authorization is valid for 12 months from the date of board approval [3]

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulant market is anticipated to grow to $9.9 billion by 2027, indicating strong demand for these materials in the electronics sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and JSR dominate certain segments, while domestic firms are emerging as strong competitors [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to successfully compete against established international players [8].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are identified as key growth areas, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article outlines various advanced packaging materials and their projected market sizes, indicating significant growth potential in areas like conductive adhesives, chip bonding materials, and epoxy encapsulants [8]. - For instance, the conductive adhesive market is expected to reach 3 billion yuan by 2026, while the epoxy encapsulant market is projected to grow to 99 million USD by 2027 [8]. Competitive Landscape - The article lists both domestic and international players in the advanced packaging materials market, emphasizing the competitive nature of the industry [8]. - Companies such as Fujifilm, Toray, and domestic firms like Dinglong Co. and Guofeng New Materials are highlighted as key competitors [8]. Investment Strategies - Different investment stages in the new materials industry are discussed, with a focus on the importance of team assessment, industry analysis, and market entry strategies [10]. - The article suggests that early-stage investments carry high risks but can yield significant returns if the right resources and teams are in place [10].

Group 1 - The company, 8 Billion Space (688181.SH), announced a share buyback program, having repurchased a total of 573,900 shares, which represents 0.43% of its total share capital [1] - The highest price paid for the repurchased shares was 33.91 CNY per share, while the lowest price was 27.69 CNY per share [1] - The total amount spent on the share buyback was 16,644,523.73 CNY, excluding transaction fees such as stamp duty and trading commissions [1]

证券代码：688181 证券简称：八亿时空 公告编号：2026-002 北京八亿时空液晶科技股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/5/17 | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 月 2025 5 16 5 | 日~2026 | 年 | 月 | 15 | 日 | | 预计回购金额 | 5,000万元~10,000万元 | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | | | | | 累计已回购股数 | □为维护公司价值及股东权益 573,900股 | | | | | | | 累计已回购股数占总股本比例 | 0.43% | | | | | | | 累计已回购金额 | 16,644,523.73元 | | | | | | | 实际回购价格 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Group 1: Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and conductive adhesives are identified as key growth areas, with PSPI's market size in China expected to increase from 7.12 billion yuan in 2021 to 9.67 billion yuan by 2025 [8]. Group 2: Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, indicating significant investment potential in sectors like semiconductor materials and new display materials [8]. - Companies such as 鼎龙股份, 国风新材, and 三月科 are highlighted as domestic players poised to benefit from the shift towards local sourcing of advanced materials [8]. Group 3: Future Projections - The market for conductive adhesives is expected to reach $3 billion by 2026, while the market for chip bonding materials is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The article emphasizes the importance of innovation and R&D in maintaining competitive advantages in the rapidly evolving materials landscape [8].