Group 1 - The company Yuyuan Powder Materials (688456.SH) has indicated that its copper powder products can be used in the heat dissipation substrates of automotive IGBT modules [1] - Currently, the company has not established substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]

Group 1 - The company Yuyuan Powder Materials (688456.SH) has indicated that its copper powder products can be used in the heat dissipation substrates of automotive IGBT modules [1] - Currently, the company has not established substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]

Core Viewpoint - The metal new materials sector experienced a decline of 0.96% on September 24, with Jiangnan New Materials leading the drop, while the overall market indices showed positive performance with the Shanghai Composite Index rising by 0.83% and the Shenzhen Component Index increasing by 1.8% [1]. Group 1: Market Performance - The Shanghai Composite Index closed at 3853.64, up 0.83% [1]. - The Shenzhen Component Index closed at 13356.14, up 1.8% [1]. Group 2: Sector Performance - The metal new materials sector saw a net outflow of 380 million yuan from main funds, while retail investors contributed a net inflow of 451 million yuan [2]. - Jiangnan New Materials (603124) closed at 86.15, down 2.67% with a trading volume of 26,100 shares and a transaction value of 227 million yuan [2]. Group 3: Individual Stock Performance - Fuda Alloy (603045) had the highest increase, closing at 20.38, up 9.98% with a trading volume of 76,600 shares and a transaction value of 151 million yuan [1]. - Other notable performers included Ni'an New Materials (688786) at 28.38, up 6.17%, and Yunlu Co. (688190) at 113.69, up 5.70% [1].

Market Performance - The semiconductor industry index rose by 1.43% as of September 23, 2025, with notable gains from companies like Changchuan Technology (up 20.00%) and Huafeng Measurement Control (up 8.54%) [1] - The semiconductor industry ETF (159582) increased by 1.42%, reaching a price of 2.07 yuan, and has seen a cumulative increase of 9.79% over the past week [1] - The ChiNext chip index experienced a slight decline of 0.05%, with mixed performance among constituent stocks [3] - The new materials index on the ChiNext fell by 0.58%, with some stocks like Tonglian Precision gaining while others like Debang Technology declined [5] Investment Trends - Nvidia and OpenAI announced a partnership, with Nvidia planning to invest up to $100 billion in data centers, leading to a nearly 4% increase in Nvidia's stock price [6] - Domestic chip companies are making progress, with Moer Thread set to debut on the ChiNext and Muxi Co. entering the second round of inquiries for its IPO, focusing on high-performance GPU development [6] Technology Advancements - DeepSeek announced an upgrade to its model, enhancing language consistency and agent capabilities, while Yushu Technology showcased its humanoid robot's strong anti-interference abilities [7] - The continuous iteration of AI and robotics technology indicates ongoing optimization in AI application capabilities [8] ETF Insights - The semiconductor industry ETF has a recent scale of 255 million yuan, marking a six-month high, despite a net outflow of 602.22 million yuan recently [9] - The ChiNext chip ETF has seen a net outflow of 337.66 million yuan, with a total inflow of 334 million yuan over the past 21 trading days [10] - The new materials ETF has experienced a significant scale increase of 212 million yuan over the past year, ranking first among comparable funds [10]

Group 1 - The stock price of Youyan Powder Materials increased by 4.97%, reaching 55.5 yuan per share, marking a new high [1] - The total market capitalization of the company surpassed 5.753 billion yuan [1] - The trading volume amounted to 83.1976 million yuan [1]

Group 1 - The core viewpoint is that 有研粉材's metal powder materials have potential applications in consumer electronics, particularly in Apple's iPhone 17, which utilizes aluminum alloy and copper alloy VC thermal plates [1] - Aluminum alloy offers advantages in weight reduction and heat dissipation, while copper alloy excels in thermal management, highlighting the relevance of these materials in the industry [1]

Core Viewpoint - The stock of Youyan Powder Materials increased by 5.07% on September 16, reaching a price of 51.44 CNY per share, with a total market capitalization of 5.332 billion CNY [1] Company Overview - Youyan Powder Materials Co., Ltd. is located in Beijing and was established on March 4, 2004, with its listing date on March 17, 2021. The company specializes in the research, production, and sales of non-ferrous metal powder materials [1] - The revenue composition of the company includes: 59.04% from copper-based metal powder materials, 29.39% from microelectronics tin-based solder powder materials, 6.78% from other sources, 2.54% from electronic pastes, 1.48% from 3D printing powder materials, and 0.77% from other supplementary materials [1] Shareholder Information - Huashang Fund's Huashang Lexiang Flexible Allocation Mixed A Fund (001959) is among the top ten circulating shareholders of Youyan Powder Materials. In the second quarter, it reduced its holdings by 298,100 shares, maintaining 621,600 shares, which accounts for 0.6% of the circulating shares. The estimated floating profit today is approximately 1.5415 million CNY [2][4] - The fund was established on December 18, 2015, with a current scale of 612 million CNY. Year-to-date returns are 33.13%, ranking 2261 out of 8174 in its category; the one-year return is 92.22%, ranking 636 out of 7982; and since inception, the return is 173.04% [2] Fund Management - The fund manager of Huashang Lexiang Flexible Allocation Mixed A Fund is Yu Yi, who has been in the position for 3 years and 5 days. The total asset size of the fund is 5.867 billion CNY, with the best fund return during the tenure being 77.4% and the worst being 0.15% [3]

Group 1 - The company held its third extraordinary general meeting of shareholders in 2025, with no resolutions being rejected [2] - The meeting was convened by the board of directors and chaired by Chairman He Huijun [3] - All current directors (7), supervisors (3), and key executives attended the meeting, ensuring full representation [4] Group 2 - Two non-cumulative voting proposals were approved: the addition of the 2025 financial budget and the performance salary for the chairman for 2024 [5] - The meeting was held on September 15, 2025, at the company's conference room in Beijing [5] - The voting process complied with the Company Law and the company's articles of association, with more than half of the voting rights present approving the resolutions [6]

证券代码：688456 证券简称：有研粉材 公告编号：2025-037 有研粉末新材料股份有限公司 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 45 | | --- | --- | | 普通股股东人数 | 45 | | 2、出席会议的股东所持有的表决权数量 | 41,310,241 | | 普通股股东所持有表决权数量 | 41,310,241 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 39.8517 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 39.8517 | 2025年第三次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 9 月 15 日 （二） 股东大会召开的地点：北京市怀柔区雁栖经济开发区雁栖路 3 号 1 幢有 研粉材二 ...

北京市金杜律师事务所 关于有研粉末新材料股份有限公司 2025 年第三次临时股东会的法律意见书 致：有研粉末新材料股份有限公司 北京市金杜律师事务所（以下简称本所）接受有研粉末新材料股份有限公司 （以下简称公司）委托，根据《中华人民共和国证券法》（以下简称《证券法》）、 《中华人民共和国公司法》（以下简称《公司法》）、中国证券监督管理委员会《上 市公司股东会规则》（以下简称《股东会规则》）等中华人民共和国境内（以下简 称中国境内，为本法律意见书之目的，不包括中国香港特别行政区、中国澳门特 别行政区和中国台湾省）现行有效的法律、行政法规、规章和规范性文件和现行 有效的《有研粉末新材料股份有限公司章程》（以下简称《公司章程》）有关规定， 指派律师出席了公司于 2025 年 9 月 15 日召开的 2025 年第三次临时股东会（以下 简称本次股东会），并就本次股东会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 1. 公司 2023 年年度股东大会审议通过的《公司章程》； 2. 公司董事会于 2025 年 8 月 26 日作出的《有研粉末新材料股份有限公司第 三届董 ...