Core Viewpoint - The company has confirmed that it is the sole supplier of high-performance thermal copper powder used in the Ascend series 910 chips [1] Company Summary - The company, Youyan Powder Materials (stock code: 688456), has engaged with investors regarding its product supply [1] - The specific product in question is high-performance thermal copper powder, which is critical for the performance of the Ascend series 910 chips [1]

Core Viewpoint - The company has successfully developed high-performance thermal copper powder that meets current market demands and is being utilized in GPUs and NPUs, with plans to collaborate with complete thermal solution manufacturers for diverse applications [1] Group 1 - The company's high-performance thermal copper powder is designed to satisfy current market needs [1] - The product has already been successfully applied in GPUs and NPUs [1] - The company has sufficient production capacity to meet market demand [1]

Core Viewpoint - The company indicates that aluminum alloys and copper alloys possess application potential in consumer electronics due to their weight reduction and heat dissipation properties, respectively. The company is not a supplier of Apple's 17 metal powder materials [1]. Group 1 - The potential association described by the company refers to the application of aluminum alloys in weight reduction and heat dissipation, as well as the excellent heat dissipation characteristics of copper alloys [1]. - The company currently does not supply metal powder materials for Apple's 17 series [1].

Core Viewpoint - The company has stated that it currently does not have materials for advanced packaging, but its products are essential in the electronic packaging and assembly industry, widely used in electronic manufacturing components and semiconductor packaging [1] Group 1: Company Products - The company's products are crucial materials for the electronic packaging and assembly industry [1] - Applications of the company's products include consumer electronics, communications, calculators, automotive electronics, industrial uses, and other purposes [1] Group 2: Industry Context - The company's materials are extensively utilized in the manufacturing of electronic components and semiconductor packaging [1]

Core Insights - The company, Youyan Powder Materials (688456.SH), is currently focusing on high-performance heat dissipation copper powder primarily for air cooling applications [1] - The company is actively exploring the application of its products in liquid cooling fields, including 3D printing, MIM, and PM processes, to meet customer and market demands [1] - Currently, the company has not engaged with microchannel liquid cooling customers [1]

Core Viewpoint - The company has confirmed that its thermal copper powder is utilized in Huawei's Ascend 910 chip series [1] Group 1 - An investor inquired whether the company's thermal copper powder is applied in Huawei's Ascend chips [1] - The company responded affirmatively, stating that its thermal copper powder is indeed used in the Ascend 910 chip [1]

Core Viewpoint - The company is exploring the potential for its powder technology platform to expand into the solid-state battery and new energy sectors, although no substantial transactions with solid-state battery manufacturers have been established yet [1] Group 1 - An investor inquired about the possibility of the company's powder technology, such as ultrafine copper powder and low-oxygen powder preparation capabilities, being applied to solid-state batteries [1] - The company confirmed that its copper powder products are currently used in vehicle IGBT heat dissipation modules [1] - The company indicated that there are no current substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]

Core Viewpoint - The company is focusing on the development of copper powder and other high thermal conductivity materials for MIM and 3D printing processes, targeting industrial applications with strong heat dissipation needs [1] Company Summary - The company has research and development plans to continuously develop copper powder and other high thermal conductivity materials for various industrial fields [1] - Currently, the company's products are not directly used in humanoid robot thermal management modules, but the company is closely monitoring market demand to expand into related application areas [1] Industry Summary - Heat dissipation is a critical issue for humanoid robot systems, especially as they evolve towards greater intelligence and performance [1] - The development of sensors, chips, controllers, and actuators in humanoid robots will require higher heat dissipation efficiency, indicating a growing demand for high thermal conductivity materials and advanced processing methods like MIM and 3D printing [1] - The humanoid robot industry is at a stage where market opportunities and technological challenges coexist, with expectations for rapid market growth as related technologies continue to evolve [1]

Group 1 - The company Youyan Powder Materials (688456.SH) has announced that its heat dissipation copper powder is being used in the Ascend series 910 chips [1]

Core Viewpoint - The company is focusing on developing copper powder and other high thermal conductivity materials for MIM and 3D printing processes to meet the strong heat dissipation demands across various industrial sectors, particularly in humanoid robotics [1] Company Developments - The company has ongoing R&D plans to create high thermal conductivity materials aimed at industrial applications, including humanoid robots [1] - Currently, the company's products are not directly used in the thermal management modules of humanoid robots, but the company is closely monitoring market demands to expand into related application areas [1] Industry Insights - Heat dissipation is a critical issue for humanoid robot systems, especially as they evolve towards greater intelligence and performance, necessitating improved thermal efficiency for sensors, chips, controllers, and actuators [1] - The market for humanoid robots is expected to experience rapid growth due to the coexistence of market opportunities and technological challenges, driven by continuous updates and iterations in related technologies [1] - High-performance materials and precision processing methods represent significant technical barriers in the thermal management of humanoid robot structures [1]