GRIPM(688456)
Search documents
有研粉材(688456.SH):没有用于先进封装的浆料
Ge Long Hui· 2025-09-30 07:43
Core Viewpoint - The company has stated that it currently does not have materials for advanced packaging, but its products are essential in the electronic packaging and assembly industry, widely used in electronic manufacturing components and semiconductor packaging [1] Group 1: Company Products - The company's products are crucial materials for the electronic packaging and assembly industry [1] - Applications of the company's products include consumer electronics, communications, calculators, automotive electronics, industrial uses, and other purposes [1] Group 2: Industry Context - The company's materials are extensively utilized in the manufacturing of electronic components and semiconductor packaging [1]
有研粉材(688456.SH):目前未接洽微流道液冷客户
Ge Long Hui· 2025-09-30 07:43
Core Insights - The company, Youyan Powder Materials (688456.SH), is currently focusing on high-performance heat dissipation copper powder primarily for air cooling applications [1] - The company is actively exploring the application of its products in liquid cooling fields, including 3D printing, MIM, and PM processes, to meet customer and market demands [1] - Currently, the company has not engaged with microchannel liquid cooling customers [1]
公司问答丨有研粉材:公司散热铜粉已用于昇腾系列910芯片
Ge Long Hui· 2025-09-28 08:08
Core Viewpoint - The company has confirmed that its thermal copper powder is utilized in Huawei's Ascend 910 chip series [1] Group 1 - An investor inquired whether the company's thermal copper powder is applied in Huawei's Ascend chips [1] - The company responded affirmatively, stating that its thermal copper powder is indeed used in the Ascend 910 chip [1]
公司问答丨有研粉材:公司的铜粉产品可用于车载IGBT散热模块的散热基板中
Ge Long Hui A P P· 2025-09-28 07:41
Core Viewpoint - The company is exploring the potential for its powder technology platform to expand into the solid-state battery and new energy sectors, although no substantial transactions with solid-state battery manufacturers have been established yet [1] Group 1 - An investor inquired about the possibility of the company's powder technology, such as ultrafine copper powder and low-oxygen powder preparation capabilities, being applied to solid-state batteries [1] - The company confirmed that its copper powder products are currently used in vehicle IGBT heat dissipation modules [1] - The company indicated that there are no current substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]
有研粉材(688456.SH):有研发计划持续开发MIM、3D打印等工艺用铜粉及其他高导热材料
Ge Long Hui· 2025-09-26 07:44
Core Viewpoint - The company is focusing on the development of copper powder and other high thermal conductivity materials for MIM and 3D printing processes, targeting industrial applications with strong heat dissipation needs [1] Company Summary - The company has research and development plans to continuously develop copper powder and other high thermal conductivity materials for various industrial fields [1] - Currently, the company's products are not directly used in humanoid robot thermal management modules, but the company is closely monitoring market demand to expand into related application areas [1] Industry Summary - Heat dissipation is a critical issue for humanoid robot systems, especially as they evolve towards greater intelligence and performance [1] - The development of sensors, chips, controllers, and actuators in humanoid robots will require higher heat dissipation efficiency, indicating a growing demand for high thermal conductivity materials and advanced processing methods like MIM and 3D printing [1] - The humanoid robot industry is at a stage where market opportunities and technological challenges coexist, with expectations for rapid market growth as related technologies continue to evolve [1]
有研粉材(688456.SH):散热铜粉已用于昇腾系列910芯片
Ge Long Hui· 2025-09-26 07:44
Group 1 - The company Youyan Powder Materials (688456.SH) has announced that its heat dissipation copper powder is being used in the Ascend series 910 chips [1]
有研粉材:有研发计划持续开发MIM、3D打印等工艺用铜粉及其他高导热材料
Ge Long Hui· 2025-09-26 07:42
Core Viewpoint - The company is focusing on developing copper powder and other high thermal conductivity materials for MIM and 3D printing processes to meet the strong heat dissipation demands across various industrial sectors, particularly in humanoid robotics [1] Company Developments - The company has ongoing R&D plans to create high thermal conductivity materials aimed at industrial applications, including humanoid robots [1] - Currently, the company's products are not directly used in the thermal management modules of humanoid robots, but the company is closely monitoring market demands to expand into related application areas [1] Industry Insights - Heat dissipation is a critical issue for humanoid robot systems, especially as they evolve towards greater intelligence and performance, necessitating improved thermal efficiency for sensors, chips, controllers, and actuators [1] - The market for humanoid robots is expected to experience rapid growth due to the coexistence of market opportunities and technological challenges, driven by continuous updates and iterations in related technologies [1] - High-performance materials and precision processing methods represent significant technical barriers in the thermal management of humanoid robot structures [1]
有研粉材:暂未同固态电池厂家建立实质性的交易
Ge Long Hui· 2025-09-26 07:39
Group 1 - The company Yuyuan Powder Materials (688456.SH) has indicated that its copper powder products can be used in the heat dissipation substrates of automotive IGBT modules [1] - Currently, the company has not established substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]
有研粉材(688456.SH):暂未同固态电池厂家建立实质性的交易
Ge Long Hui· 2025-09-26 07:38
Group 1 - The company Yuyuan Powder Materials (688456.SH) has indicated that its copper powder products can be used in the heat dissipation substrates of automotive IGBT modules [1] - Currently, the company has not established substantial transactions with solid-state battery manufacturers, but it encourages stakeholders to pay attention to future announcements [1]
金属新材料板块9月24日跌0.96%,江南新材领跌,主力资金净流出3.8亿元
Zheng Xing Xing Ye Ri Bao· 2025-09-24 08:39
Core Viewpoint - The metal new materials sector experienced a decline of 0.96% on September 24, with Jiangnan New Materials leading the drop, while the overall market indices showed positive performance with the Shanghai Composite Index rising by 0.83% and the Shenzhen Component Index increasing by 1.8% [1]. Group 1: Market Performance - The Shanghai Composite Index closed at 3853.64, up 0.83% [1]. - The Shenzhen Component Index closed at 13356.14, up 1.8% [1]. Group 2: Sector Performance - The metal new materials sector saw a net outflow of 380 million yuan from main funds, while retail investors contributed a net inflow of 451 million yuan [2]. - Jiangnan New Materials (603124) closed at 86.15, down 2.67% with a trading volume of 26,100 shares and a transaction value of 227 million yuan [2]. Group 3: Individual Stock Performance - Fuda Alloy (603045) had the highest increase, closing at 20.38, up 9.98% with a trading volume of 76,600 shares and a transaction value of 151 million yuan [1]. - Other notable performers included Ni'an New Materials (688786) at 28.38, up 6.17%, and Yunlu Co. (688190) at 113.69, up 5.70% [1].