截至12月16日，昂瑞微股东户数1.74万，较上期增加24398.59%；人均流通股693股，较上期增加 0.00%。2025年1月-9月，昂瑞微实现营业收入13.35亿元，同比减少20.69%；归母净利润-6277.19万元， 同比减少426.66%。 声明：市场有风险，投资需谨慎。本文基于第三方数据库自动发布，不代表新浪财经观点，任何在本文 出现的信息均只作为参考，不构成个人投资建议。如有出入请以实际公告为准。如有疑问，请联系 biz@staff.sina.com.cn。 融券方面，昂瑞微2月25日融券偿还0.00股，融券卖出0.00股，按当日收盘价计算，卖出金额0.00元；融 券余量0.00股，融券余额0.00元。 资料显示，北京昂瑞微电子技术股份有限公司位于北京市海淀区东北旺西路8号院23号楼5层101，成立 日期2012年7月3日，上市日期2025年12月16日，公司主营业务涉及主要从事射频前端芯片、射频SoC芯 片及其他模拟芯片的研发、设计与销售。主营业务收入构成为：射频前端芯片78.54%，射频SOC芯片 20.78%，其他产品和服务0.69%。 责任编辑：小浪快报 2月25日，昂瑞微涨2.21 ...

2月25日，昂瑞微盘中上涨2.07%，截至10:54，报147.60元/股，成交4582.37万元，换手率2.61%，总市 值146.91亿元。 昂瑞微所属申万行业为：电子-半导体-模拟芯片设计。所属概念板块包括：SOC芯片、北斗导航、荣耀 概念、荣耀手机、阿里概念等。 资金流向方面，主力资金净流入414.64万元，特大单买入110.36万元，占比2.41%，卖出0.00元，占比 0.00%；大单买入1332.56万元，占比29.08%，卖出1028.29万元，占比22.44%。 截至12月16日，昂瑞微股东户数1.74万，较上期增加24398.59%；人均流通股693股，较上期增加 0.00%。2025年1月-9月，昂瑞微实现营业收入13.35亿元，同比减少20.69%；归母净利润-6277.19万元， 同比减少426.66%。 昂瑞微今年以来股价跌0.12%，近5个交易日涨0.24%，近20日跌6.64%。 资料显示，北京昂瑞微电子技术股份有限公司位于北京市海淀区东北旺西路8号院23号楼5层101，成立 日期2012年7月3日，上市日期2025年12月16日，公司主营业务涉及主要从事射频前端芯片、射频So ...

Core Insights - The RF front-end module is a critical subsystem that directly impacts terminal communication quality, driven by the acceleration of global 5G commercialization and the increasing demand for multi-band compatibility in terminals [1][5] - The global market for RF front-end modules is projected to reach $14.881 billion by 2025, with modules accounting for nearly 70% of the market share [5] - China's RF front-end market is expected to grow from 22.9 billion yuan in 2020 to 33.6 billion yuan in 2024, and is projected to exceed 53 billion yuan by 2029, becoming the largest regional market globally [6][7] Industry Overview - RF front-end modules (RFFE) serve as the core components in wireless communication systems, integrating multiple RF devices into a single package to perform essential tasks such as signal processing [2][4] - The classification of RF front-end modules includes power amplifiers, low-noise amplifiers, filters, RF switches, and duplexers, among others, catering to various application scenarios [3] Market Dynamics - The demand for RF front-end devices is increasing due to the rapid commercialization of 5G, with a notable rise in the need for high-end products associated with key technologies like millimeter-wave communication [5] - The global RF front-end market is expected to grow at a compound annual growth rate (CAGR) of approximately 3.4% from 2025 to 2030, reaching $17.5 billion by 2030 [5] China's Market Growth - China's RF front-end market is experiencing rapid growth, driven by the acceleration of 5G commercialization, the rise of domestic smartphone brands, and the expansion of emerging applications like IoT [6][10] - The domestic market's growth is supported by policies promoting the semiconductor industry, which have created a robust support system for the RF front-end module sector [4] Industry Chain Analysis - The RF front-end module industry chain in China includes upstream suppliers of EDA design software and semiconductor materials, with domestic breakthroughs in certain areas [8] - Midstream focuses on module design, manufacturing, and testing, with local companies narrowing the technology gap with international giants [8] Competitive Landscape - The current market landscape shows a coexistence of international dominance and domestic breakthroughs, with major international companies holding about 76% of the global market share [12] - Domestic companies like Weijie Chuangxin, Huizhiwei, and Zhuoshengwei are gradually increasing their market share through continuous R&D and technological advancements [12] Future Development Trends - The RF front-end module industry in China is expected to develop along three main lines: technology, industry, and application, focusing on high integration and energy efficiency [13] - The trend of domestic substitution will deepen, with local companies aiming to penetrate high-end markets and enhance their competitiveness [14] - Application scenarios are expanding from consumer electronics to various fields, including smart vehicles and satellite internet, creating new growth opportunities [16]

证券日报网讯2月6日，昂瑞微在互动平台回答投资者提问时表示，公司卫星通信产品具备卫星直联功 能，不涉及卫星组网通信。公司卫星通信产品可同时支持北斗、天通和低轨三种卫星通信系统。凭借深 厚的技术积累与产品创新能力，公司卫星通信产品已于多家品牌手机终端客户的高端机型实现量产出 货。未来，公司将继续深耕卫星通信射频芯片技术研发，加大相关产品的创新与迭代力度，拓展更多元 化的应用场景，助力我国卫星通信产业发展，为构建空天地一体化通信网络贡献力量。 ...

Core Viewpoint - The article highlights the significant increase in IPO applications on the Sci-Tech Innovation Board, with 48 companies accepted in 2025 compared to only 6 in 2024, particularly emphasizing the semiconductor sector with 20 companies [1]. Group 1: Company Summaries - Angrui Micro, based in Beijing, focuses on RF and analog integrated circuit design and has successfully completed its IPO process, emphasizing domestic substitution in RF and analog chips [1]. - Shanghai Super Silicon specializes in the R&D and production of 300mm and 200mm semiconductor silicon wafers, which are critical substrates for chip manufacturing [1]. - Hengyun Chang, located in Shenzhen, develops plasma RF power systems and devices, essential for advanced chip manufacturing processes [1]. - Chipmi Technology, based in Shanghai, focuses on semiconductor-grade perfluoroether rubber materials, crucial for sealing in semiconductor production [1]. - Zhaoxin Integrated, also in Shanghai, develops high-end general-purpose processors and supporting chips, aiding in domestic chip substitution [2]. - Shanghai Superconductor specializes in high-temperature superconducting materials, enhancing semiconductor device performance [2]. - Youxun Co., based in Xiamen, is a leader in optical communication front-end transceiver chips, recognized as a national champion in manufacturing [2]. - Yadian Technology, located in Jiangsu, develops wet cleaning equipment for silicon-based and compound semiconductors, vital for chip manufacturing precision [3]. - Moer Thread, based in Beijing, focuses on GPU and related products, aligning with high-end industry development needs [3]. - Muxi Co., located in Shanghai, specializes in full-stack GPU products, supporting AI training and general computing [3]. - Qinheng Micro, based in Nanjing, develops interface chips and interconnect MCUs, essential for embedded systems [4]. - Youyan Composite Materials, located in Beijing, produces special non-ferrous metal alloy products for semiconductor packaging [4]. - Lianxun Instruments, based in Suzhou, develops electronic measurement instruments and semiconductor testing equipment [4]. - Lepu Technology, based in Chengdu, focuses on high-end semiconductor equipment, crucial for chip manufacturing [4]. - Zhongke Kehua, located in Jiangsu, specializes in semiconductor packaging materials, impacting chip packaging quality [5]. - Pinzhun Laser, based in Shanghai, develops precision lasers for semiconductor production processes [5]. - Changxin Technology, located in Anhui, focuses on DRAM products, contributing to domestic storage chip production [5]. - Ruishi Chuangxin, based in Chongqing, develops RF front-end chips and modules for various applications [5]. - Taosheng Technology, based in Shanghai, specializes in semiconductor testing interfaces, crucial for product quality assurance [6]. - Zhongtu Technology, located in Dongguan, develops GaN substrates, essential for high-end chips and new energy applications [6]. Group 2: Market Trends and Characteristics - The 20 companies show a significant regional concentration in Shanghai, Jiangsu, Beijing, and Guangdong, indicating a well-developed semiconductor industry ecosystem in these areas [12]. - The companies cover a comprehensive industry chain, including upstream materials, midstream chip design, and downstream testing and packaging, aligning with collaborative industry development trends [12]. - There is a notable profit disparity among the companies, with many in the high R&D investment sectors like chip design operating at a loss, while those in testing and materials are achieving profitability [12].

（编辑 王雪儿） 证券日报网1月30日讯 ，昂瑞微在接受调研者提问时表示，行业竞争格局的演变将受到整体市场环境与 新产品迭代速度等多重因素的影响，长期看会逐步从无序竞争回归到有序竞争。未来行业核心竞争力源 于客户合作粘性、产品创新、海外拓展及细分领域突破。在此背景下，公司将专注于核心技术的研发、 产品线的布局完善、客户和市场的开拓，以确保在激烈的市场角逐中稳固自身竞争优势。 ...

Core Viewpoint - The company, Angrui Micro, is focusing on expanding its applications in the fields of smart automobiles, IoT modules, and smart wearables, while its RF front-end chip products are primarily used in the mobile smart terminal industry [1] Industry Overview - The market share of domestic RF front-end manufacturers in China is relatively low, accounting for approximately 20% in terms of value, indicating significant potential for domestic substitution in key technology areas [1] Company Developments - The company's RF SoC chip products are mainly applied in wireless keyboards and mice, smart home devices, health care, and smart logistics [1] - The company is making continuous breakthroughs in emerging application areas with broad market prospects [1]

证券日报网1月30日讯，昂瑞微在接受调研者提问时表示，公司产品战略聚焦射频前端，把握"模组 化"趋势，持续迭代L-PAMiD等高端模组。协同发展射频SoC，重点拓展智能零售、智慧物流、物联网 模块、智能寻物、健康医疗、车载出行等专业类应用场景，并加速出海进程。布局其他模拟芯片，形成 协同矩阵。前瞻性布局卫星通信、车载通信等增量市场，筑牢长期发展壁垒。 ...

Core Viewpoint - The company, Angruiwei, has successfully achieved mass production and shipment of satellite communication products that are compatible with Beidou, Tiantong, and low-orbit satellite communication systems for high-end mobile terminal clients [1] Group 1 - The company is advancing its research on future products, including sixth-generation mobile communication and highly integrated RF front-end chips for satellite communication that combine Tiantong and Beidou low-orbit systems [1] - The company is enhancing horizontal technical cooperation with industry chain enterprises and research institutions to maintain a forward-looking perspective [1]

Core Viewpoint - The company, Angrui Micro, outlines its future development focus on six key areas to enhance its market position and product offerings [1] Group 1: Development Focus Areas - Strengthening R&D investment to promote upgrades of high-integration products like RF front-end L-PAMiD and enhancing low power consumption and high integration advantages of RF SoC [1] - Deepening engagement in the mobile smart terminal market while expanding into emerging application scenarios such as automotive communication and satellite communication [1] - Enhancing supply chain security and cost advantages [1] Group 2: Strategic Initiatives - Deepening strategic cooperation with major clients to expand the quality customer base and increase market share [1] - Improving talent system construction to support sustainable business development [1] - Expanding overseas markets to build international competitive capabilities [1]