第四届董事会第十三次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 1、本次董事会由董事长郎晓刚先生召集，会议通知于 2023 年 7 月 27 日以 专人送达、电话、电子邮件等方式发出。 2、本次董事会于 2023 年 8 月 8 日在公司会议室召开，采取现场结合通讯投 票表决方式投票表决。 3、本次董事会应参加表决 7 人，实进行表决 7 人。 4、本次董事会由董事长郎晓刚先生主持，高级管理人员列席了本次董事会。 证券代码：300493 证券简称：润欣科技 公告编号：2023-039 上海润欣科技股份有限公司 5、本次董事会会议的召集、召开符合《公司法》《公司章程》及相关法规的 规定。 二、董事会会议审议情况 1、审议通过《关于 2023 年半年度报告及其摘要的议案》 经审议，董事会认为：公司2023年半年度报告的编制和审核程序符合法律、 行政法规和中国证监会的规定，报告内容真实、准确、完整地反映了公司2023 年上半年实际经营情况，不存在任何虚假记载、误导性陈述或重大遗漏。公司 《2023年半年度报告》《2023年半 ...

证券代码：300493 证券简称：润欣科技 公告编号：2023-043 上海润欣科技股份有限公司 关于控股股东部分股份质押的公告 公司控股股东上海润欣信息技术有限公司保证向本公司提供的信息内容的 真实、准确和完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 上海润欣科技股份有限公司（以下简称"润欣科技"或"公司"）近日接到公司 控股股东上海润欣信息技术有限公司（以下简称"润欣信息"）的通知，润欣信息 将其持有的公司部分股份办理了质押，现将有关情况公告如下： 一、 股东股份质押的基本情况 | | 是否为控 股股东或 | | 占其所 | 占公 司总 | 是否为 限售股 | 是否 | 质押 | 质押 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 股东 | | 本次质押 | | | （如 | 为补 | | | 质权 | | | 名称 | 第一大股 | 数量（股） | 持股份 | 股本 | 是，注 | 充质 | 起始 | 到期 | 人 | 用途 | | ...

证券代码：300493 证券简称：润欣科技 公告编号：2023-042 上海润欣科技股份有限公司 关于 2023 年半年度计提资产减值准备的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 二、本次计提资产减值准备的审批程序 上海润欣科技股份有限公司（以下简称"公司"）于2023年8月8日召开第四 届董事会第十三次会议及第四届监事会第十一次会议，审议通过了《关于2023 年半年度计提资产减值准备及核销坏账的议案》，2023年半年度公司拟计提资产 减值准备共计647.25万元（以下简称"本次计提资产减值准备"）。根据《深圳 证券交易所创业板股票上市规则》《深圳证券交易所创业板上市公司自律监管指 南第1号——业务办理》等相关法律法规的规定，现将本次计提资产减值准备的 具体情况公告如下： 一、本次计提资产减值准备情况概述 根据《企业会计准则》及公司会计政策等相关规定，公司本着谨慎性原则， 对合并财务报表范围内截至 2023 年 6 月 30 日的应收账款、其他应收账款、应收 票据、存货、固定资产、无形资产等资产进行了减值测试，判断存在可能发生减 值的迹象，确定了 ...

Financial Performance - In 2022, the company's operating revenue reached ¥2,101,534,485.44, an increase of 13.13% compared to ¥1,857,606,310.03 in 2021[22]. - The net profit attributable to shareholders was ¥54,111,778.10, a decrease of 7.10% from ¥58,247,279.87 in the previous year[22]. - The net cash flow from operating activities was -¥148,389,196.02, representing a decline of 39.46% compared to -¥106,400,902.61 in 2021[22]. - The total assets increased by 24.80% to ¥1,593,214,681.66 at the end of 2022, up from ¥1,276,585,576.59 in 2021[22]. - The net profit after deducting non-recurring gains and losses was ¥48,928,012.43, down 15.32% from ¥57,777,726.46 in 2021[22]. - The weighted average return on net assets decreased to 5.90%, down 1.65 percentage points from 7.55% in the previous year[22]. - The total operating revenue for 2022 was CNY 2,101,534,485.44, representing a 13.13% increase from CNY 1,857,606,310.03 in 2021[49]. - The company reported a significant increase in revenue, reaching $500 million, representing a 25% year-over-year growth[109]. Dividend and Profit Distribution - The company plans to distribute a cash dividend of 0.35 CNY per 10 shares to all shareholders, based on a total of 504,751,147 shares[5]. - The cash dividend distribution accounted for 100% of the total profit distribution amount, ensuring full protection of shareholder interests[129]. - The total distributable profit for the year was RMB 242,525,121.47, indicating a stable profit situation[129]. - The company’s dividend distribution policy includes a cash dividend of no less than 30% of the distributable profit if total asset transactions are below 15% of the latest audited total assets[156]. Market and Industry Position - The company is focused on expanding its market presence and enhancing its product offerings in the semiconductor industry[4]. - The global semiconductor sales reached $574 billion in 2022, with a growth of 3.3% compared to 2021, despite a slowdown in the integrated circuit industry[31]. - The company maintained a leading position in the domestic wireless communication IC and AIOT smart IoT sectors, focusing on self-developed designs for wireless chips and mixed-signal chips[32]. - The company aims to expand its customer base and product application areas in the AIOT and automotive electronics sectors[32]. Research and Development - The company is actively involved in research and development of integrated circuit technologies, including AI and IoT applications[15]. - The company has developed new product lines including micro energy harvesting chips and AI smart speaker chips, enhancing its market expansion capabilities[35]. - The number of R&D personnel increased by 21.15% from 52 in 2021 to 63 in 2022, with R&D personnel accounting for 31.19% of the total workforce[61]. - R&D investment amounted to ¥44,649,919.58 in 2022, representing 2.12% of total revenue, slightly down from 2.13% in 2021[61]. Risks and Challenges - The company acknowledges potential risks from core personnel turnover and supplier changes that could impact future operations[5]. - The company faces risks from market fluctuations, particularly in the digital communication, IoT, and automotive electronics sectors[36]. - The company is exposed to foreign exchange risks due to its involvement in international trade, particularly with USD and HKD[43]. Corporate Governance - The company has a governance structure that complies with legal requirements, ensuring independent operations and protecting shareholder interests[94]. - The board of directors consists of 7 members, including 3 independent directors, ensuring compliance with governance standards[95]. - The company has implemented transparent performance evaluation and incentive mechanisms for senior management, aligning with legal regulations[96]. - The company’s board of directors has not raised any objections to company matters during the reporting period[118]. Strategic Partnerships and Collaborations - The company has established partnerships with various technology firms, including Qualcomm and Skyworks, to enhance its product capabilities[15]. - The company signed a strategic cooperation agreement with the National Intelligent Sensor Innovation Center to develop an AIOT joint laboratory and promote integrated chip design[87]. Employee Engagement and Welfare - The company actively engages in employee welfare programs, including commercial insurance and annual health check-ups[125]. - The training program in 2022 focused on enhancing employees' professional skills and overall quality through diverse online courses and external training[126]. - The company has established a competitive and fair compensation scheme, linking employee salaries closely to company performance[125]. Financial Management and Investments - The company raised a total of ¥139,999,965.30 through a private placement, with a net amount of ¥130,804,396.93 after deducting fees[75]. - The company has committed to ensuring that the fundraising investment plans align with its core business operations[156]. - The company will consider investor returns when determining the annual cash dividend distribution[156]. Community Engagement and Sustainability - The company donated RMB 20,000 to support community health initiatives in Shanghai during the pandemic[152]. - The company contributed RMB 20,000 to a poverty alleviation project in Yunnan Province, supporting rural revitalization efforts[153]. - The company promotes green office practices, including reducing paper usage and encouraging public transportation[150].

Financial Performance - The company's revenue for Q1 2023 was ¥413,764,616.35, a decrease of 2.30% compared to ¥423,517,904.22 in the same period last year[4] - The net profit attributable to shareholders was ¥7,956,484.37, down 38.97% from ¥13,037,107.94 year-on-year[4] - The net profit after deducting non-recurring gains and losses was ¥6,539,563.88, a decline of 49.72% compared to ¥13,005,168.85 in the previous year[4] - The basic earnings per share were ¥0.02, down 33.33% from ¥0.03 in the same period last year[4] - In Q1 2023, the company reported a net profit of CNY 7,404,391.81, a decrease of 42.0% compared to CNY 12,945,176.47 in the same period last year[19] - Operating profit for Q1 2023 was CNY 10,025,109.75, down 39.5% from CNY 16,466,411.22 in Q1 2022[19] - The company’s total comprehensive income for Q1 2023 was CNY -4,661,390.71, compared to CNY 8,530,762.65 in Q1 2022[20] - Basic and diluted earnings per share for Q1 2023 were both CNY 0.02, down from CNY 0.03 in the previous year[20] Cash Flow and Liquidity - The net cash flow from operating activities was ¥20,034,345.13, an increase of 213.43% from -¥17,662,044.05 in the same period last year[4] - Cash flow from operating activities generated a net inflow of CNY 20,034,345.13, compared to a net outflow of CNY 17,662,044.05 in the same quarter last year[23] - The cash and cash equivalents increased by ¥43,073,615.58, a decrease of 71.88% compared to ¥153,153,888.66 in the previous year[10] - The company’s cash and cash equivalents at the end of Q1 2023 totaled CNY 184,035,898.59, a decrease from CNY 316,938,894.88 at the end of Q1 2022[23] Assets and Liabilities - The total assets at the end of the reporting period were ¥1,550,564,965.56, a decrease of 2.68% from ¥1,593,214,681.66 at the end of the previous year[4] - Total assets as of March 31, 2023, were RMB 1,550,564,965.56, down from RMB 1,593,214,681.66 at the beginning of the year[17] - Total liabilities decreased to RMB 529,783,202.02 from RMB 568,840,832.03, showing a reduction in financial obligations[17] - The equity attributable to shareholders was RMB 1,017,049,090.55, slightly down from RMB 1,020,013,774.27[17] Operational Efficiency - The total operating revenue for Q1 2023 was RMB 413,764,616.35, a decrease of 2.3% compared to RMB 423,517,904.22 in the same period last year[18] - The total operating costs for Q1 2023 were RMB 403,370,321.94, down from RMB 407,007,452.13 in the previous year, indicating a cost reduction strategy[18] - Accounts receivable decreased to RMB 456,712,782.12 from RMB 581,954,819.19, reflecting improved collection efforts[16] - Inventory levels slightly increased to RMB 430,878,356.79 from RMB 425,566,285.95, indicating stable stock management[16] Government Support and Future Outlook - The company recognized government subsidies of ¥1,760,966.68 related to normal business operations, confirming a government subsidy income of ¥1.6 million[7] - The company reported a net profit margin improvement, with net profit figures to be detailed in future reports[18] - Future outlook includes potential market expansion and new product development strategies, although specific figures were not disclosed in this report[18] Research and Development - The company’s R&D expenses amounted to CNY 7,403,307.46, a decrease of 15.7% from CNY 8,784,306.11 in Q1 2022[19] Financial Expenses - The company incurred a tax expense of CNY 2,588,081.95, down from CNY 3,458,981.98 in the same period last year[19] - The company’s financial expenses included interest expenses of CNY 1,803,478.87, an increase from CNY 953,285.70 in Q1 2022[19] Receivables Financing - The company reported a significant increase in receivables financing, which rose by 241.10% to ¥80,402,599.57 from ¥23,571,419.98 at the beginning of the year[9]

证券代码：300493 证券简称：润欣科技 公告编号：2023-026 上海润欣科技股份有限公司（以下简称"公司"）将于 2023 年 4 月 28 日在 巨潮资讯网上披露《2022 年年度报告》全文及《2022 年年度报告摘要》。为便 于广大投资者更加全面深入地了解公司经营业绩、发展战略等情况，公司定于 2023 年 5 月 16 日（星期二）15:00-17:00 在"价值在线"（www.ir-online.cn）举 办公司 2022 年度网上业绩说明会，与投资者进行沟通和交流，广泛听取投资者 的意见和建议。 会议召开时间：2023 年 5 月 16 日（星期二）15:00-17:00 会议召开方式：网络互动方式 会议召开地点：价值在线（www.ir-online.cn） 一、说明会召开的时间、地点和方式 会议召开时间：2023 年 5 月 16 日（星期二）15:00-17:00 会议召开地点：价值在线（www.ir-online.cn） 上海润欣科技股份有限公司 关于举办2022年度网上业绩说明会的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 ...

Group 1: Company Overview and Collaboration - Shanghai Runxin Technology Co., Ltd. is collaborating with Qiyimoer to develop customized Chiplet chip design services, leveraging their respective customer and technical advantages [1][2]. - The partnership aims to enhance the Chiplet industry ecosystem, focusing on applications in smart cities, automotive electronics, and wearable technology [2][4]. Group 2: Technical Insights and Innovations - The current trend in semiconductor technology is shifting towards heterogeneous integration, with Chiplet architecture allowing for modular designs that can achieve high performance while reducing costs [3][4]. - Chiplet designs can support various applications, including AI, smart cities, and autonomous driving, by providing flexible and scalable solutions [3][5]. Group 3: Market Trends and Projections - According to data from Chip Origin and Yole, a significant portion of chip deliveries will adopt Chiplet technology by 2035, with a projected double-digit CAGR starting this year [4][5]. - The demand for high-performance chips in sectors like AI and automotive is driving the need for advanced Chiplet solutions, with specific performance requirements ranging from 100 TOPS to 2000 TOPS depending on the application [2][3]. Group 4: Challenges and Solutions - Heat dissipation remains a challenge in heterogeneous chip stacking, but Chiplet architecture can improve data scheduling and processing efficiency, thereby reducing unnecessary heat generation [3][4]. - The industry faces challenges in adapting software solutions to various application scenarios, highlighting the importance of tailored Chiplet designs [4][6]. Group 5: Future Directions - The collaboration between Qiyimoer and Runxin is expected to lead to the production of low-end products by the end of the year, focusing on applications in AIOT and MEMS sensors [5][6]. - The Chiplet market is anticipated to evolve with increasing automation and efficiency in manufacturing processes, allowing for cost-effective production despite the diversity of applications [6].

Company Overview - Shanghai Runxin Technology Co., Ltd. was established in 2000 and is a leading IC product distributor in China, focusing on communication connection chips and sensor chips [3]. - The company has partnerships with renowned IC design and manufacturing companies such as Qualcomm, NXP, and AVX/Kyocera, and serves clients including ZTE, Gongjin Electronics, and DJI [3]. - In 2015, the company's sales exceeded 1 billion RMB [3]. Market Position and Growth - The company is among the top ten domestic IC distributors in China, with significant growth potential in a market valued at over 1 trillion RMB [6]. - The company sells over 10 million pieces of Synopsys chips annually, with a focus on touch chips and fingerprint recognition starting this year [4][5]. - The domestic chip self-sufficiency rate is currently below 10%, with a target of around 30% in developed regions like Japan and Korea, presenting growth opportunities for local distributors [5]. Product and Service Offering - Approximately 70% of the company's sales come from chips that require design solutions [6]. - The company maintains a high chip yield rate, with minimal quality issues reported [7]. - The company provides technical support and training from chip manufacturers, which is crucial for maintaining competitive pricing and service quality [10][11]. Strategic Development - The company is exploring mergers and acquisitions to optimize product structure and enhance growth, although no specific direction has been determined yet [8]. - The company emphasizes the importance of capital in the IC distribution industry, as it affects operational capacity and inventory management [9]. - The company plans to adjust its workforce and technical support based on market and client growth, with an increase in technical personnel post-IPO [12][13]. Challenges and Industry Dynamics - The company faces competition from both domestic and international distributors, with a need to differentiate through technical distribution rather than catalog distribution [6]. - The increasing technical capabilities of clients may lead to a shift where manufacturers provide direct support, potentially impacting distributor market share [9].

Company Overview - Shanghai Runxin Technology Co., Ltd. was established in 2000 and is a leading distributor of IC products and solutions in China, providing technical support services including IC application solutions [2] - The company primarily distributes communication connection chips, wireless RF, and sensor chips, representing renowned global IC manufacturers such as Qualcomm and AVX/Kyocera [2] - In 2016, the company achieved sales exceeding 1.5 billion RMB and has been recognized as a "Top 10 Local Distributor" by International Electronic Business for four consecutive years [2] Product Applications - The distributed products include wireless connection and RF chips, WiFi and network processor chips, and sensor chips, which are used in various applications such as smart appliances, security, drones, and automotive electronics [3][4] - The company is focusing on new business growth in RF and power amplifier devices, wireless and sensor system modules, and intelligent processing modules [3] Competitive Advantages - The company benefits from the rapid development of the semiconductor industry in emerging fields such as smart cities, smart homes, and automotive electronics, with significant growth in its IOT wireless chip solutions and RF components [4] - Future plans include expanding into new areas such as NB-IOT modules and high-end intelligent processing modules [4] Partnerships and Projects - In 2016, the company signed an MCPLA agreement with Qualcomm, becoming a partner for low-end processors and IoT application solutions [5] - The main products involved in the Qualcomm Snapdragon processor project include highly integrated wireless and mobile processing platforms, applicable in drones, smart cities, and wearable devices [5] Market Trends - The demand for wireless connection ICs is expected to grow due to the maturation of IoT and smart technologies, alongside significant investments in the industry [6] - The company is also involved in projects related to integrated metal casing products, which enhance the quality and performance of smartphones [6] Technical Support and Consultation - The company provides technical consultation and support as part of its service, integrating various technologies from IC manufacturers and electronic product manufacturers to meet customer needs [7] - Technical support is currently provided without separate charges, emphasizing the company's role in facilitating technology transfer and implementation [7]

Market Overview and Growth Potential - Global MEMS sensor market in 2021 was approximately $30 billion, with the Chinese market at 45 billion RMB, showing a compound annual growth rate (CAGR) of 13% [4] - MEMS speakers are expected to rapidly replace traditional speakers, similar to how silicon microphones replaced traditional microphones in just 3 years [7] - MEMS speakers have significant advantages in TWS earphones, hearing aids, AR/VR glasses, and smart home devices due to their small size and low power consumption [7][10] Technological Advancements and Innovations - MEMS (Micro-Electro-Mechanical Systems) integrate micro-mechanical structures, sensors, actuators, and communication into a single system, offering small size, lightweight, and low power consumption [4] - The National Intelligent Sensor Innovation Center has developed a 12-inch sensor pilot line, with 80% of the equipment being domestically produced, achieving world-leading process levels [4] - MEMS speakers use piezoelectric materials, with PZT (lead zirconate titanate) being a key material. The center has developed a unique PZT wafer and a MEMS process platform compatible with CMOS, enabling multi-layer film stacking and high-performance film preparation [6][9] Applications and Market Opportunities - MEMS speakers are particularly advantageous in TWS earphones, where they can replace traditional planar drivers and balanced armature units, offering better performance in high-frequency ranges [10] - In AR/VR glasses, MEMS speakers provide directional sound, enhancing the immersive experience. They can also be used in smart home devices like TVs and smart speakers [9][10] - MEMS speakers are expected to enter the smartphone market, with potential applications in replacing traditional speakers for improved sound quality and cost efficiency [11] Production and Cost Considerations - The current production capacity is 10,000 wafers per year, with each wafer yielding approximately 8,000 MEMS speakers. The yield rate is 98%, and production can be scaled up based on market demand [11] - The initial cost of MEMS speakers is higher than traditional speakers, with a target price of $2 per unit. However, costs are expected to decrease as production scales up and technology matures [8][11] - MEMS speakers require specialized ASIC (Application-Specific Integrated Circuit) development for driving piezoelectric elements, which is currently in progress [11][12] Future Outlook and Challenges - MEMS speakers are expected to achieve mass production by the second half of 2023, with a projected market price of 4-5 RMB per unit [12] - The main challenges include optimizing the production process, reducing costs, and developing compatible ASIC chips for different applications [11][12] - The MEMS speaker market is expected to grow rapidly, with potential applications in various industries, including consumer electronics, automotive, and healthcare [9][10][11]