广东美联新材料股份有限公司 第五届董事会第七次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 广东美联新材料股份有限公司（以下简称"公司"）于 2025 年 8 月 25 日在 汕头市美联路 1 号公司会议室以现场结合通讯表决方式召开了第五届董事会第 七次会议。会议通知已于 2025 年 8 月 14 日以邮件方式送达公司全体董事和高级 管理人员。本次会议应出席董事 7 名，实际出席会议董事 7 名（其中：以通讯 表决方式出席会议董事 1 人）。独立董事沈忆勇以通讯表决方式出席会议。 本次会议由董事长黄伟汕先生主持，高级管理人员列席了会议。本次会议的 召开和表决程序符合《中华人民共和国公司法》等法律、法规以及公司章程的有 关规定，合法有效。 二、董事会会议审议情况 本次会议以书面记名投票方式进行表决，议案审议表决情况如下： 证券代码：300586 证券简称：美联新材 公告编号：2025-059 （二）审议通过《关于 2025 年度日常关联交易预计的议案》 公司第五届董事会独立董事第四次专门会议对本议案进行了前置审核，同意 ...

广东美联新材料股份有限公司 2025 年半年度报告 2025 年 8 月 1 广东美联新材料股份有限公司 2025 年半年度报告全文 广东美联新材料股份有限公司 2025 年半年度报告全文 第一节 重要提示、目录和释义 公司董事会及董事、高级管理人员保证半年度报告内容的真实、准确、 完整，不存在虚假记载、误导性陈述或者重大遗漏，并承担个别和连带的法 律责任。 公司负责人黄伟汕、主管会计工作负责人易东生及会计机构负责人(会计 主管人员)刘志裕声明：保证本半年度报告中财务报告的真实、准确、完整。 所有董事均已出席了审议本次半年报的董事会会议。 公司半年度报告中涉及的未来计划等前瞻性陈述，不构成公司对投资者 的实质承诺，投资者及相关人士均应当对此保持足够的风险认识，并请理解 计划、预测与承诺之间的差异。 公司目前不存在影响公司正常经营的重大风险。公司日常经营中可能面 临的风险因素详见"第三节 管理层讨论与分析"之"十、公司面临的风险和 应对措施"。 公司计划不派发现金红利，不送红股，不以公积金转增股本。 2 | | | 五、备查文件备置地点：公司董事办。 4 广东美联新材料股份有限公司 2025 年半年度报告全文 ...

Market Overview - The plastic sector experienced a decline of 1.1% on August 26, with Zhongyan Co. leading the drop [1] - The Shanghai Composite Index closed at 3868.38, down 0.39%, while the Shenzhen Component Index closed at 12473.17, up 0.26% [1] Stock Performance - Notable gainers in the plastic sector included: - Nengzhiguang (33.00, +8.73%, 154,800 shares, 517 million CNY) - Haizheng Biomaterials (15.10, +7.63%, 111,100 shares, 164 million CNY) - Ping An Electric (59.13, +4.56%, 118,400 shares, 707 million CNY) [1] - Major decliners included: - Zhongyan Co. (49.95, -6.90%, 110,900 shares, 563 million CNY) - Runyang Technology (54.77, -6.22%, 45,900 shares, 257 million CNY) - Henghe Precision (29.78, -5.04%, 170,900 shares, 515 million CNY) [2] Capital Flow - The plastic sector saw a net outflow of 834 million CNY from major funds, while retail investors contributed a net inflow of 853 million CNY [2] - Specific stock capital flows included: - Sidi Ke (1.39 billion CNY net inflow from major funds, -839,760 CNY from retail) - Anli Co. (58.86 million CNY net inflow from major funds, -13.28 million CNY from retail) [3]

Core Viewpoint - Meilian New Materials has shown a significant stock price increase of 60.57% year-to-date, indicating strong market performance and investor interest [1][2]. Financial Performance - For the period from January to March 2025, Meilian New Materials reported a revenue of 448 million yuan, representing a year-on-year growth of 6.54%. However, the net profit attributable to shareholders decreased by 64.54% to 9.40 million yuan [2]. - Cumulative cash dividends since the company's A-share listing amount to 121 million yuan, with 35.56 million yuan distributed over the past three years [3]. Shareholder Information - As of August 20, 2025, the number of shareholders for Meilian New Materials increased to 23,100, up by 1.54% from the previous period. The average number of circulating shares per shareholder decreased by 1.52% to 23,099 shares [2]. - The eighth largest circulating shareholder is Hong Kong Central Clearing Limited, which holds 3.57 million shares as a new shareholder [3]. Market Activity - On August 26, Meilian New Materials' stock price rose by 2.19% to 13.07 yuan per share, with a trading volume of 116 million yuan and a turnover rate of 1.67%. The total market capitalization reached 9.296 billion yuan [1]. - The stock has experienced a recent net inflow of main funds amounting to 3.76 million yuan, with significant buying and selling activity from large orders [1].

Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Market Overview - The plastic sector increased by 0.63% on August 25, with Anli Co. leading the gains [1] - The Shanghai Composite Index closed at 3883.56, up 1.51%, while the Shenzhen Component Index closed at 12441.07, up 2.26% [1] Stock Performance - Anli Co. (300218) closed at 23.80, with a rise of 11.74% and a trading volume of 284,000 shares [1] - Ping An Electric (001359) saw a 10.00% increase, closing at 56.55 with a trading volume of 108,900 shares [1] - Wankai New Materials (301216) rose by 7.20%, closing at 17.27 with a trading volume of 370,600 shares [1] - Other notable performers include Huibai New Materials (301555) up 5.80% and Meilian New Materials (300586) up 4.84% [1] Capital Flow - The plastic sector experienced a net outflow of 676 million yuan from institutional investors, while retail investors contributed a net inflow of 545 million yuan [2] - The overall capital flow indicates a mixed sentiment, with institutional investors withdrawing funds while retail investors increased their positions [2] Individual Stock Capital Flow - Anli Co. had a net outflow of 85.33 million yuan from institutional investors, with retail investors contributing a net inflow of 73.18 million yuan [3] - Wankai New Materials saw a net inflow of 34.44 million yuan from institutional investors, while retail investors had a slight net inflow of 456,780 yuan [3] - Ping An Electric experienced a net inflow of 33.79 million yuan from institutional investors, but a net outflow of 51.52 million yuan from retail investors [3]

Group 1 - The core viewpoint of the article highlights the growth in the rubber and plastic products industry in China, with an increase in the number of enterprises and a significant contribution to the industrial sector [1][3]. - As of the first half of 2025, there are 28,268 enterprises in the rubber and plastic products industry, which is an increase of 1,503 enterprises compared to the same period last year, representing a year-on-year growth of 5.62% [1]. - The rubber and plastic products industry accounts for 5.43% of the total industrial enterprises in China [1]. Group 2 - The report referenced is titled "2025-2031 China Plastic Products Industry Market Status Analysis and Future Outlook Report" published by Zhiyan Consulting [1]. - Zhiyan Consulting is recognized as a leading industry consulting firm in China, specializing in in-depth industry research and providing comprehensive consulting services [2].

证券日报网讯 8月22日晚间，美联新材发布公告称，公司及其控股子公司无逾期对外担保、无涉及诉讼 的对外担保及因担保被判决败诉而应承担损失的情形。 （文章来源：证券日报） ...

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

证券代码：300586 证券简称：美联新材 公告编号：2025-058 广东美联新材料股份有限公司（以下简称"公司"）分别于： 近日，公司与金融机构签署了相关保证担保和质押担保合同：1、与中国农 业银行股份有限公司汕头龙湖支行、中国银行股份有限公司达州分行、中国建设 银行股份有限公司达州分行、交通银行股份有限公司汕头分行（以下简称"银团"） 签订了《最高额保证合同》，担保的债权最高余额折合人民币 2,490,750,000.00 元整，保证方式为连带责任保证，保证期间为主合同约定的债务履行期限届满之 日起三年；2、与中国农业银行股份有限公司汕头龙湖支行（以下简称"汕头农 行"）签署了《最高额权利质押合同》，公司以持有的四川美联 100%股权为四川 美联向银团申请的综合授信额度提供质押担保，担保的债权最高余额折合人民币 本担保事项经公司股东会审批通过之日起生效。 广东美联新材料股份有限公司 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 三、累计对外担保及逾期担保的数量 一、担保情况概述 全资子公司提供担保的议案》，同意公司为全资子公司美联新材料（四川）有限 公 ...