Core Viewpoint - The company has accumulated significant technology in the HDI field over the years and has sufficient equipment inventory, with limited impact expected from the need to supplement certain equipment [1] Group 1 - The company has a long-standing technological accumulation in the HDI sector [1] - The equipment inventory is relatively adequate, indicating a strong operational capacity [1] - Only specific equipment such as electroplating and testing devices require supplementation, which is not expected to significantly affect the company [1]

Core Viewpoint - The company is in the process of applying for a simplified procedure to issue shares to specific investors, which will support the establishment of a high-end server PCB production capacity of 100,000 square meters per year at Zhien Electronics [1] Group 1 - The company has over 10 years of technical accumulation in the HDI field and is fully committed to entering the AI sector [1] - The company plans to upgrade its production line next year based on order conditions [1]

证券日报网讯科翔股份（300903）2025年12月2日发布公告，公司在回答调研者提问时表示，目前全球 都在拥抱AI产业发展。在PCB领域，已经有参与较早的厂商享受到了AI发展带来的红利。科翔股份已在 PCB行业深耕20余年，于2020年上市，PCB产品应用于汽车电子、新能源、通讯设备、低空飞行等领 域。AI产业领域公司也有布局，目前已锚定AI这个巨大的增长赛道，增加投资。 ...

证券日报网讯科翔股份（300903）2025年12月2日发布公告，公司在回答调研者提问时表示，目前正在 推进的有智恩电子高端服务器用PCB产线升级项目。公司的土地、厂房储备足以满足未来2-3年需求， 因此资源调动较为灵活，未来将根据服务器客户订单进度，决定是否新建服务器PCB专用生产线。 ...

证券日报网讯 科翔股份（300903）2025年12月2日发布公告，公司在回答调研者提问时表示，公司将主 要从两个维度改善经营业绩。一方面，公司在保证核心产品订单稳定的前提下，通过拓展高端定位、高 附加值的产品订单，并逐步升级对应产线，同时逐步减少甚至剥离低附加值、负毛利率的订单，提升综 合毛利率；另一方面，公司从今年开始实行严格的成本控制措施，推行采购、产线和销售团队的三位一 体联动，实现标准化和降本增效。 ...

Core Insights - The company, Kexiang Co., announced on December 2, 2025, that it is focusing on addressing the heat dissipation challenges in the AI server market [1] - Kexiang is collaborating with a major North American manufacturer to develop ceramic boards suitable for AI servers [1] Company Summary - Kexiang Co. is actively engaged in research and development to enhance AI server technology [1] - The partnership with a North American company indicates a strategic move to leverage external expertise in tackling industry-specific challenges [1] Industry Summary - The AI server market is currently facing significant technical challenges, particularly in heat management [1] - The development of specialized materials, such as ceramic boards, is crucial for the advancement of AI server capabilities [1]

Core Viewpoint - The company has commenced mass production of its 800G optical module products and has received medium-sized orders, while the 1.6T optical module is currently under development [1] Group 1 - The company announced that its 800G optical module products have achieved mass production [1] - The company has received medium-sized orders for its 800G optical modules [1] - The development of the 1.6T optical module is ongoing [1]

证券日报网讯科翔股份（300903）2025年12月2日发布公告，公司在回答调研者提问时表示，公司子公 司华宇华源从事的PLP面板级芯片封装业务，主要应用于电源芯片领域。目前研发进展顺利，已有技术 积累，计划在明年增加产能。 ...

Core Viewpoint - The company, Kexiang Co., announced its strength in the power PCB segment, highlighting its leading position in the PCB industry and its capability to produce thick copper boards and aluminum substrates [2]. Group 1: Company Overview - Kexiang Co. identifies power PCB as one of its main and advantageous products, positioning itself among the top players in the PCB industry [2]. - The production of power PCBs primarily takes place at the company's facility in Ganzhou, where it specializes in thick copper boards and aluminum substrates [2]. - The company has achieved the capability for mass production of 12oz thick copper boards, indicating a significant manufacturing advancement [2].

Core Viewpoint - The company has categorized its server PCB products into three distinct types, indicating a strategic focus on various market segments, including AI applications [2] Group 1: Product Categories - The first category includes high-layer, through-hole boards used in standard servers [2] - The second category consists of mid-range products, primarily 2-3 layer HDI boards, which support server applications [2] - The third category features high-end server PCBs designed for AI computing, mainly 6-8 layer HDI boards, along with ceramic boards currently in small batch testing for enhanced heat dissipation [2]