中信证券股份有限公司 2025年半年度跟踪报告 | 保荐人名称：中信证券股份有限公司 | 被保荐公司简称：鼎泰高科（301377） | | --- | --- | | 保荐代表人姓名：万俊 | 联系电话：0755-23835238 | | 保荐代表人姓名：曾劲松 | 联系电话：0755-23835238 | 一、保荐工作概述 | 项目 | 工作内容 | | --- | --- | | 1.公司信息披露审阅情况 | | | （1）是否及时审阅公司信息披露文件 | 是 | | （2）未及时审阅公司信息披露文件的次数 | 无 | | 2．督导公司建立健全并有效执行规章制度的情况 | | | （1）是否督导公司建立健全规章制度（包括但不 | | | 限于防止关联方占用公司资源的制度、募集资金 管理制度、内控制度、内部审计制度、关联交易 | 是 | | 制度） | | | （2）公司是否有效执行相关规章制度 | 是 | | 3.募集资金监督情况 | | | （1）查询公司募集资金专户次数 | 6次 | | （2）公司募集资金项目进展是否与信息披露文件 | 是 | | 一致 | | | 4.公司治理督导情况 | | | ...

Group 1 - The A-share market showed mixed performance on August 28, with the Shanghai Composite Index down by 0.36%, while sectors like telecommunications, electronics, and banking saw gains [1] - The machine tool sector exhibited stock performance divergence, with the machine tool ETF (159663.SZ) down by 0.81%, while individual stocks like Qiaofeng Intelligent, Haimeixing, and Dingtai High-tech saw increases of 12.46%, 7.19%, and 7.13% respectively [1] - The human-shaped robot market in China is projected to grow significantly, with the market size expected to reach approximately 20 to 50 billion yuan by 2028, and potentially 10 trillion yuan by 2045 [1] Group 2 - The robotics sector is experiencing a transformative shift from virtual to reality, driven by events like the World Artificial Intelligence Conference and the World Robot Conference, indicating a potential upward trend in new application scenarios and orders [2] - The machine tool ETF (159663) closely tracks the China Machine Tool Index, which is crucial for the high-end equipment manufacturing sector, encompassing laser equipment, machine tools, robots, and industrial control equipment [2]

Market Overview - In 2024, the overall packaging market is expected to grow by 16% year-on-year to reach $105.5 billion, with the advanced packaging market growing by 20.6% to $51.3 billion, accounting for nearly 50% of the total [2][14]. - By 2030, the overall packaging market is projected to reach $160.9 billion, with advanced packaging expected to grow to $91.1 billion, resulting in a compound annual growth rate (CAGR) of 10% from 2024 to 2039 [2][14]. - The high-end market share is anticipated to increase from 8% in 2023 to 33% by 2029, driven by the demand from generative AI, edge computing, and intelligent driving ADAS [2][16]. Need for Advanced Packaging - The end of Moore's Law for advanced processes marks the beginning of the packaging Moore's Law, focusing on achieving higher performance at lower costs through system-level packaging techniques [3][30]. - The increasing demand for diverse functionalities leads to more frequent interactions between functional devices, necessitating efficient high-speed interconnections between chips to enhance overall system performance [3][30]. Need for Panel-Level Packaging (PLP) - PLP technology offers higher cost-effectiveness, greater design flexibility, and superior thermal and electrical performance, with significant potential to replace traditional packaging methods [4][42]. - The traditional packaging market is projected to reach $54.2 billion in 2024 and $69.8 billion by 2030, indicating a broad space for PLP to replace existing solutions [4][42]. - The wafer-level packaging market is expected to be $2.1 billion in 2024, with the FO/2.5D organic interposer market at $1.8 billion, potentially reaching $8.4 billion by 2030 [4][42]. Importance of Substrates in High-End Markets - Packaging substrates play a crucial role in signal transmission, heat dissipation, protection, and functional integration, with low-loss transmission being a key property [5][36]. - The increasing I/O density requirements driven by trends in mobile devices, 5G, data centers, and high-performance computing necessitate advancements in substrate technology to meet higher resolution demands [5][36]. COWOP and Substrate-Less Concepts - The Chip on Wafer on PCB (COWOP) concept blurs the definitions between PCB and substrate, focusing on transferring substrate functions to PCB while maintaining compatibility with existing technologies [6][36]. - Current PCB wiring density and I/O density are insufficient to match interposer requirements, necessitating the development of materials that can achieve high-density I/O [6][36]. Related Companies - Key players in the packaging substrate and materials sector include companies like Unimicron, BOE, and Corning, which are diversifying their businesses to capture opportunities in PLP and glass substrate applications [45].

Core Viewpoint - The company reported strong financial performance for the first half of 2025, with significant growth in revenue and net profit, driven by the demand for AI servers and high-end PCB products [1][2]. Financial Performance - For the first half of 2025, the company achieved operating revenue of 904 million yuan, a year-on-year increase of 27%, and a net profit attributable to shareholders of 160 million yuan, up 80% year-on-year [1]. - The gross profit margin reached 39.24%, an increase of 5 percentage points year-on-year, while the net profit margin was 17.57%, also up 5 percentage points year-on-year [1]. - In Q2 2025, the company reported operating revenue of 481 million yuan, a year-on-year increase of 27% and a quarter-on-quarter increase of 14% [1]. - The net profit attributable to shareholders for Q2 was 87 million yuan, reflecting an 80% year-on-year increase and a 20% quarter-on-quarter increase [1]. Business Segments - The PCB tool segment generated revenue of 746 million yuan in the first half of 2025, representing a 38% year-on-year increase, with a gross profit margin of 38.67%, up 5 percentage points year-on-year [1]. - The company is focusing on high-end PCB product upgrades, driven by the demand for AI servers and high-speed switches, leading to increased sales of micro-drills and coated drill bits [1]. - The company has accelerated its production capacity, with monthly drill bit production exceeding 10 million units [1]. International Expansion - The company established a wholly-owned subsidiary in Germany and successfully acquired the German PCB tool manufacturer MPK, enhancing its core technology and market resources in micro-drills and milling cutters [2]. - The Thai production base has achieved mass production, contributing to the steady increase in overseas capacity and accelerating the company's globalization process [2]. Industry Outlook - The company anticipates continued growth in revenue and net profit from 2025 to 2027, projecting revenues of 2.067 billion yuan, 2.712 billion yuan, and 3.265 billion yuan, with net profits of 390 million yuan, 569 million yuan, and 733 million yuan, respectively [2]. - The company maintains a diverse product matrix in drill bits and is positioned for ongoing positive development across its business segments [2].

Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Group 1 - The global server market is entering a new growth cycle starting in 2024, driven by the increasing demand for AI computing power, with an expected CAGR of 18.8% from 2024 to 2029 [2] - The PCB industry is recovering from a phase of adjustment due to weak consumer electronics and inventory cycles, with emerging demands from AI servers and high-performance infrastructure expected to drive growth from 2024 [2][3] - Domestic PCB manufacturers are actively expanding production and increasing capital expenditures, focusing on high-end products such as HDI and multi-layer boards [2][3] Group 2 - The global PCB equipment market is projected to reach 51 billion yuan in 2024, with a year-on-year growth of 9.0%, and a CAGR of 4.9% from 2020 to 2024 [3] - The demand for PCB equipment is significantly boosted by AI computing infrastructure, with the market expected to grow to 77.5 billion yuan by 2029, reflecting a CAGR of 8.7% from 2024 to 2029 [3] - Drilling, exposure, and testing equipment represent the highest value segments in the PCB equipment market, accounting for 20.75%, 16.99%, and 15.00% respectively in 2024 [3] Group 3 - The drilling equipment segment is expected to benefit from increased demand for high-end HDI, with both mechanical and laser drilling seeing growth due to the rising complexity of HDI designs [3] - The exposure equipment market is currently dominated by foreign brands, with low domestic penetration, particularly in LDI technology which is more suited for HDI [4] - The demand for plating equipment is increasing due to the higher number of plating cycles required for advanced HDI, alongside quality control pressures [5] Group 4 - Major equipment manufacturers are showing a clear upward trend, with expectations for accelerated performance in the future [6] - Key players in the drilling segment include Dazhu CNC (301200), while the exposure segment is led by Xinqi Micro (688630) and Tianzhun Technology (688003) [7] - The plating segment is highlighted by Dongwei Technology (688700), with Keg Precision (301338) noted for its role in the solder paste printing segment [7]

Core Insights - The company reported a significant increase in revenue and net profit for the first half of 2025, with revenue reaching 904 million yuan, a year-on-year growth of 26.90%, and net profit attributable to shareholders amounting to 160 million yuan, a substantial increase of 79.78% [1][2] Financial Performance - The company's core business, tool products, generated revenue of 746 million yuan, reflecting a growth of 38.08% [1] - Overseas revenue reached 78.73 million yuan, marking a remarkable year-on-year increase of 124.09% [1][2] - The net profit excluding non-recurring gains and losses was 148 million yuan, showing a year-on-year growth of 96.46% [1] Product Development - The sales volume of micro-drills with a diameter of 0.2mm and below increased to 28.09%, while the sales volume of coated drill needles reached 36.18%, indicating a continuous upgrade towards high-end product structures [1] - The company has expanded its R&D team to 408 personnel and invested 57.83 million yuan in R&D during the reporting period [1] - The establishment of a European R&D center in Germany focuses on cutting-edge technologies for tool grinding machines and tool products [1] Strategic Initiatives - The company has successfully launched production at its Thailand facility, contributing to the overseas revenue [2] - The acquisition of German PCB tool manufacturer MPK Kemmer GmbH has strengthened the company's presence in the European market [2] - The company is advancing its strategy for self-research and production of main materials, aiming to enhance capacity utilization through intelligent equipment upgrades [2]

Investment Rating - The investment rating for the company is "Buy" (maintained) [1] Core Views - The company reported a significant increase in revenue and net profit for H1 2025, with revenue reaching 904 million yuan, up 26.90% year-on-year, and net profit of 160 million yuan, up 79.78% year-on-year [6] - The growth is attributed to the surge in AI demand, with various product lines showing strong performance, particularly in tools and grinding materials [7] - The company is expected to achieve substantial revenue and profit growth in the coming years, with projected revenues of 2.15 billion yuan in 2025, 3.20 billion yuan in 2026, and 4.00 billion yuan in 2027, reflecting year-on-year growth rates of 36.00%, 48.96%, and 25.19% respectively [11] Summary by Sections Financial Performance - In H1 2025, the company achieved a gross margin of 39.24%, an increase of 4.58 percentage points year-on-year, driven by an optimized product mix [8] - The company’s net profit margin improved to 17.57%, up 5.08 percentage points year-on-year, aided by effective cost control measures [8] Product Performance - The revenue breakdown for H1 2025 shows that tools accounted for 82.55% of total revenue, with a year-on-year growth of 38.08% [7] - The company successfully launched new products in the automation equipment sector, including a five-axis tool grinding machine [7] Market Outlook - The company is expanding its market presence, particularly in overseas markets, with external sales revenue growing by 124.09% year-on-year [7] - The company is also focusing on new business areas, such as automotive light control films and intelligent automation solutions, indicating a strong future growth potential [10]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

证券之星消息，8月22日通用设备板块较上一交易日上涨1.0%，三川智慧领涨。当日上证指数报收于 3825.76，上涨1.45%。深证成指报收于12166.06，上涨2.07%。通用设备板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 300066 | 三川智慧 | 8.44 | 20.06% | 203.17万 | | 16.48亿 | | 301377 | 鼎泰高科 | 68.06 | 19.99% | 13.00万 | | 8.39亿 | | 605688 | 同惠电子 | 31.98 | 15.87% | 16.46万 | | 5.24亿 | | 301125 | 腾亚精工 | 22.27 | 13.68% | 15.41万 | | 3.27亿 | | 688577 | 新海德曼 | 94.71 | 13.62% | 6.20万 | | 5.71亿 | | 002871 | 伟隆股份 | 18.43 | 10.03% | 31.15万 | | 5.49亿 ...