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壁仞科技因超额配股权获悉数行使发行4272.68万股
Zhi Tong Cai Jing· 2026-02-02 15:04
Core Viewpoint - The company, Wallen Technology (06082), announced the issuance and allocation of 42.7268 million shares due to the full exercise of the over-allotment option on February 2, 2026 [1] Group 1 - The total number of shares issued and allocated is 42.7268 million [1]
壁仞科技(06082) - 翌日披露报表
2026-02-02 14:53
FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別: 股票 狀態: 新提交 公司名稱: 上海壁仞科技股份有限公司 呈交日期: 2026年2月2日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司(「香港聯交所」)證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露,必須填妥第一章節 。 | 第一章節 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 普通股 | 股份類別 H | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) 06082 | 說明 | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | 已發行股份(不包括庫存股份)變動 | | 庫存股份變動 | | | | | 事件 | 已發行股份(不包括庫存股份)數 目 | 佔有關事件前的現有已發 行股份(不包括庫存股 份 ...
壁仞科技(06082) - 章程
2026-02-02 14:46
上海壁仞科技股份有限公司 章程 公司系由上海壁仞智能科技有限公司整體改制變更,以發起方式設立,並於 2023年9月8日在上海市市場監督管理局註冊登記,取得營業執照,統一社會信用 代碼為91310115MA1HATB40R。 第三條 公司於2025年12月10日向中國證券監督管理委員會(以下簡稱「中 國證監會」)完成備案,並經香港聯合交易所有限公司(以下簡稱「香港聯交所」) 批准,首次向社會公眾公開發行284,846,600股(悉數行使超額配售權前)境外上市 股份並於2026年1月2日在香港聯交所上市,每股面值0.02元人民幣,全部為普通 股。 第四條 公司註冊名稱: 中文名稱:上海壁仞科技股份有限公司 (首次公開發行境外上市股份(H股)並上市後適用) 目錄 | 第一章 | 總則 | | 1 | | --- | --- | --- | --- | | 第二章 | 經營宗旨和範圍 | | 2 | | 第三章 | 股份 | | 3 | | 第一節 | | 股份發行 | 3 | | 第二節 | | 股份增減和回購 | 7 | | 第三節 | | 股份轉讓 | 9 | | 第四章 | | 股東和股東會 | 10 | | ...
壁仞科技(06082) - 修订组织章程细则
2026-02-02 14:36
香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責,對其準確性 或完整性亦不發表任何聲明,並明確表示概不就因本公告全部或任何部分內容而產生或因依賴 該等內容而引致的任何損失承擔任何責任。 Shanghai Biren Technology Co., Ltd. 上海壁仞科技股份有限公司 (於中華人民共和國註冊成立的股份有限公司) (股份代號:6082) 修訂組織章程細則 本公告乃根據香港聯合交易所有限公司(「聯交所」)證券上市規則第13.51(1)條作 出。 茲提述上海壁仞科技股份有限公司(「本公司」)日期為2026年1月28日的公告(「該 公告」),內容有關悉數行使超額配股權,涉及合共42,726,800股H股,佔全球發售 項下任何超額配股權獲行使前(已計及發售量調整權獲悉數行使)初步可供認購發 售股份總數約15%。除文義另有所指外,本公告所用詞彙與該公告所界定者具有 相同涵義。 完成悉數行使超額配股權後,本公司的註冊股本及股份總數分別變更為人民幣 48,777,170元及2,438,858,500股。為反映本公司註冊股本及股本結構的有關變 動,本公司的組織章程細則(「組織章程細則」)已作 ...
从5万亿之城到全球创新高地,上海乘势而上
Sou Hu Cai Jing· 2026-02-02 14:00
在上海,2026年的钟声仿佛与科创企业"敲钟"之声一同响起。这座经济总量跨入全球前五的大都会,正 加速迈向全球科技创新高地。 从AI企业陆续登陆资本市场,到"模速空间"创新生态蓬勃成势,国家所需即上海所向,为国担当、勇为 尖兵,是这座城市的使命所在。 在全球不确定性持续攀升的时代,上海维持确定性与可预期的竞争力。五年来,全市GDP接连迈上4万 亿元、5万亿元两个大台阶。在成为中国首个"5万亿之城"后,2025年上海经济继续向新向优,以5.4%的 GDP增速跑赢全国平均水平,经济结构优化、动能转换。 这是一座光荣的人民之城,跨越30多年的"拎马桶"改造已总体完成,"城中村"改造全面提速,遍布全市 的公园数量达到1100座。2025年,上海接待了入境游客936万人次,"中国入境游第一站"的新名片亮眼 夺目。 经济动能 "十五五"开局之年,上海经济站上新高度。 当外界还为"5万亿之城"的荣光赞叹,上海乘势而上,2025年全市地区生产总值达5.67万亿元,同比增 长5.4%,高于全国平均增速0.4个百分点,继续扛起经济大省的"大梁"。一个城市的经济规模,堪比瑞 典、比利时这样的欧洲国家。 作为外向型经济城市,上海能取 ...
壁仞科技、燧原科技完成阶跃星辰Step 3.5 Flash模型适配
Bei Jing Shang Bao· 2026-02-02 13:09
Core Insights - The article highlights the launch of the flagship base model Step 3.5 Flash by Jieyue Xingchen, which is designed for real-time agent workflow scenarios [1] - The announcement includes that Wallran Technology and Suiyuan Technology have completed adaptations to support this model, marking them as the first domestic computing power manufacturers to do so [1] - Both Wallran Technology's Bili 166 series and Suiyuan Technology's L600 chips have achieved rapid compatibility with the new model [1]
阶跃星辰发布开源基座模型 Step 3.5 Flash
Zheng Quan Ri Bao Wang· 2026-02-02 08:11
Group 1 - Shanghai Jiyue Xingchen Intelligent Technology Co., Ltd. launched the new generation open-source Agent base model Step3.5Flash, designed for real-time Agent workflow scenarios, balancing inference speed, intelligence level, and cost [1] - Step3.5Flash achieves a maximum inference speed of 350 tokens per second for single request code tasks, providing a "faster, stronger, and more stable" option for Agent base models [1] - The model utilizes a sparse MoE architecture, activating approximately 11 billion parameters per token out of a total of 196 billion parameters, significantly enhancing inference efficiency while maintaining model capability [1] Group 2 - Nearly 10 chip and infrastructure manufacturers, including Huawei Ascend and Alibaba Pingtouge, have completed adaptations for Step3.5Flash, enhancing model adaptability and computing efficiency through collaborative innovation [1] - The establishment of the "MoXin Ecological Innovation Alliance" in July 2025 aims to break down technical barriers between chips, models, and platforms, optimizing performance and accelerating the application of large models across various industries [2] - The industry recognizes that deep collaboration between models and computing power will be a crucial path for the large-scale application of inference models [2]
港股芯片股集体下挫,华虹半导体跌超12%,中芯国际跌超5%
Ge Long Hui A P P· 2026-02-02 07:05
Group 1 - The Hong Kong chip stocks experienced a collective decline, with notable drops in several companies' stock prices [1] - Hua Hong Semiconductor fell over 12%, while Zhaoyi Innovation dropped 11%, and Wallin Technology decreased by over 7% [1] - Other companies such as Shanghai Fudan and InnoCare also saw declines exceeding 6%, with SMIC, ASMPT, and Tianyu Semiconductor dropping more than 5% [1] Group 2 - Hua Hong Semiconductor's stock price decreased by 12.79%, reaching 101.600, with a total market capitalization of 176.54 billion and a year-to-date increase of 36.74% [2] - Zhaoyi Innovation's stock fell by 11.04% to 298.000, with a market cap of 207.64 billion and a year-to-date increase of 83.95% [2] - Wallin Technology's stock price dropped by 7.47% to 32.200, with a market cap of 78.53 billion and a year-to-date increase of 64.29% [2] - Shanghai Fudan's stock decreased by 6.85% to 48.440, with a market cap of 39.90 billion and a year-to-date increase of 6.88% [2] - InnoCare's stock fell by 6.17% to 54.000, with a market cap of 49.42 billion and a year-to-date decrease of 31.12% [2] - SMIC's stock price declined by 5.31% to 71.400, with a market cap of 571.23 billion and a year-to-date change of -0.07% [2] - ASMPT's stock decreased by 5.20% to 98.500, with a market cap of 411.51 billion and a year-to-date increase of 27.18% [2] - Tianyu Semiconductor's stock fell by 5.03% to 47.580, with a market cap of 18.71 billion and a year-to-date change of -0.88% [2]
阶跃星辰开源Step 3.5 Flash,华为昇腾等芯片完成适配
Feng Huang Wang· 2026-02-02 06:44
Core Viewpoint - The release of the new open-source Agent base model Step3.5Flash by Jumpsky is aimed at real-time Agent workflow scenarios, utilizing a sparse MoE architecture with a total parameter count of 196 billion, designed to balance inference speed and cost [1] Group 1: Model Specifications - Step3.5Flash achieves an inference speed of up to 350 tokens per second for single request code tasks [1] - The model activates approximately 11 billion parameters per token [1] Group 2: Industry Collaboration - Multiple chip manufacturers, including Huawei Ascend, Muxi Co., Biran Technology, Suiruan Technology, TianShu Zhixin, and Alibaba Pingtouge, have completed adaptations for the model [1] - Jumpsky previously initiated the "MoCore Ecological Innovation Alliance" in July 2025 with several chip and infrastructure companies to enhance computing efficiency and promote the application of large models [1] Group 3: Strategic Implications - The release of Step3.5Flash is viewed as a further practice in the collaboration between model and computing power [1]
阶跃星辰发布开源基座模型Step 3.5 Flash,多家头部芯片厂商完成适配
Feng Huang Wang· 2026-02-02 06:32
Core Viewpoint - The release of the new open-source Agent base model Step3.5Flash by Jumpsky is aimed at real-time Agent workflow scenarios, utilizing a sparse MoE architecture with a total parameter count of 196 billion, balancing inference speed and cost [1] Group 1: Model Specifications - Step3.5Flash achieves an inference speed of up to 350 tokens per second for single request code tasks [1] - The model activates approximately 11 billion parameters per token [1] Group 2: Industry Collaboration - Multiple chip manufacturers, including Huawei Ascend, Muxi Co., Biran Technology, and Suiruan Technology, have completed adaptations for the Step3.5Flash model [1] - Jumpsky previously initiated the "MoCore Ecological Innovation Alliance" in July 2025 with several chip and infrastructure manufacturers to enhance computing efficiency and promote the application of large models [1] - The model release is seen as a further practice in the direction of model and computing power collaboration [1]