本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 泰凌微电子(上海)股份有限公司（以下简称"公司"）于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会，审议通过了《关于取消监事会、变更注册 资本并修订<公司章程>的议案》。根据修订后的《公司章程》，公司董事会由 9 名董事组成，其中设职工代表董事 1 名。因此，公司对董事会成员结构进行调整。 公司于 2025 年 11 月 28 日收到董事 MINGJIAN ZHENG 先生提交的书面辞职报 告。同日，公司召开职工代表大会并作出决议，选举 MINGJIAN ZHENG 先生 为公司第二届董事会职工代表董事。现将相关情况公告如下： 证券代码：688591 证券简称：泰凌微 公告编号：2025-055 泰凌微电子(上海)股份有限公司 关于董事辞职暨选举职工代表董事的公告 公司于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会，审议通过了《关 于取消监事会、变更注册资本并修订<公司章程>的议案》。根据修订后的《公司 章程》，公 ...

北京市中伦（上海）律师事务所 关于泰凌微电子（上海）股份有限公司 2025 年第一次临时股东会的 法律意见书 二〇二五年十一月 法律意见书 北京市中伦（上海）律师事务所 关于泰凌微电子（上海）股份有限公司 2025 年第一次临时股东会的 法律意见书 致：泰凌微电子（上海）股份有限公司（以下简称"公司"） 北京市中伦（上海）律师事务所（以下简称"本所"）接受公司的委托，指 派律师出席并见证公司2025年第一次临时股东会（以下简称"本次会议"）。 本所律师根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中 华人民共和国证券法》（以下简称"《证券法》"）、《上市公司股东会规则》 （以下简称"《股东会规则》"）、《律师事务所从事证券法律业务管理办法》 （以下简称"《证券法律业务管理办法》"）、《律师事务所证券法律业务执业 规则（试行）》（以下简称"《证券法律业务执业规则》"）等相关法律、行政 法规、规章、规范性文件及《泰凌微电子（上海）股份有限公司章程》（以下简 称"《公司章程》"）的规定，就本次会议的召集与召开程序、召集人资格、出 席会议人员资格、会议表决程序及表决结果等事宜，出具本法律意见书。 对本法律 ...

证券代码：688591 证券简称：泰凌微 公告编号：2025-056 泰凌微电子（上海）股份有限公司 2025年第一次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 11 月 28 日 （二） 股东会召开的地点：中国（上海）自由贸易试验区盛夏路 61 弄 1 号 11 层 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 174 | | --- | --- | | 普通股股东人数 | 174 | | 2、出席会议的股东所持有的表决权数量 | 69,050,380 | | 普通股股东所持有表决权数量 | 69,050,380 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 29.1967 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 29.1967 ...

Core Points - The company announced that non-independent director Zheng Mingjian submitted a written resignation due to adjustments in the corporate governance structure [1] - Zheng Mingjian will continue to serve as the Vice General Manager and Chief Technology Officer (CTO) after his resignation [1] - As of the announcement date, Zheng Mingjian directly holds 4,740,820 shares of the company and will continue to adhere to the commitments made during the initial public offering and stock incentive plans [1]

Core Viewpoint - TaiLing Microelectronics (688591.SH) has launched the TC321X series of wireless SoCs aimed at entry-level IoT terminals, balancing computing power, power consumption, and cost to lower the development threshold for various wireless connection products [1][4]. Product Features - The TC321X series integrates a 32-bit MCU, 64KB SRAM, and up to 1MB Flash, enabling protocol stack, application, and multiple peripheral coordination on a single chip [3]. - The chip supports full-stack Bluetooth Low Energy (BLE) functionality, including LE 2M PHY, -97 dBm receiving sensitivity, and up to 10 dBm transmitting power, with a one-click switch between BLE and 2.4GHz private protocols [3]. - It is optimized for battery-powered devices, compatible with small power sources like button batteries, aiming to extend terminal battery life [3]. Development Support - To reduce development complexity, the company has introduced a one-stop SDK and evaluation board support, with the SDK containing various example projects for quick customization and performance validation [3]. - The TC321X EVK board supports Type-C power supply, RF conduction testing, audio loop, and external Flash, with reserved programming and debugging interfaces [3]. Market Positioning - The TC321X series offers differentiated packaging options such as QFN and TSSOP, along with 512KB and 1MB Flash configurations to meet varying cost and functionality needs [4]. - Industry experts believe that as the application of Bluetooth and 2.4GHz private protocols expands in smart homes, consumer electronics, asset tracking, and wearable devices, competition in low power and cost control for wireless SoCs will intensify [4].

Core Insights - 泰凌微's stock increased by 1.63% on November 26, with a trading volume of 351 million yuan [1] - The company reported a financing buy-in of 38.64 million yuan and a net financing outflow of 13.09 million yuan on the same day [1] - As of November 26, the total financing and securities lending balance for 泰凌微 was 504 million yuan, representing 6.87% of its market capitalization [1] Financing and Securities Lending - On November 26, 泰凌微's financing buy-in was 38.64 million yuan, while the financing balance stood at 504 million yuan, exceeding the 70th percentile of the past year [1] - There were no securities lent or sold on that day, with a securities lending balance of 0 yuan, indicating a high level of inactivity in this area [1] Company Overview - 泰凌微电子 (Shanghai) Co., Ltd. was established on June 30, 2010, and went public on August 25, 2023 [1] - The company specializes in the research, design, and sales of wireless IoT system-level chips, with 87.62% of its revenue coming from IoT products [1] Financial Performance - For the period from January to September 2025, 泰凌微 achieved a revenue of 766 million yuan, marking a year-on-year growth of 30.49% [2] - The net profit attributable to shareholders for the same period was 140 million yuan, reflecting a significant year-on-year increase of 117.35% [2] Shareholder Information - As of September 30, 2025, 泰凌微 had 21,600 shareholders, an increase of 19.07% from the previous period [2] - The average number of circulating shares per shareholder decreased by 14.80% to 7,815 shares [2] - The company has distributed a total of 65.87 million yuan in dividends since its A-share listing [3]

Core Viewpoint - The company is progressing with its listing on the Hong Kong Stock Exchange and is actively developing edge AI chips that enhance local computing and self-learning capabilities, aiming to integrate AI from cloud to edge devices [1][4]. Group 1: Company Developments - The company confirmed that its listing on the Hong Kong Stock Exchange is still in progress and will provide updates as required by regulatory standards [1][4]. - The edge AI chips developed by the company enable low-power wireless IoT chips to perform local computations and self-learning, moving beyond traditional transmission roles [3]. Group 2: Technology and Applications - The edge AI chips can interface with cloud-based large models and execute inference tasks locally, transforming communication chips into intelligent nodes [3]. - The company has established partnerships with leading domestic and international clients and is integrating its chips with major AI model platforms, facilitating easier deployment in smart homes, wearables, and industrial IoT applications [3]. Group 3: Strategic Focus - The core strategy of the company is to bring AI capabilities from the cloud to edge devices, which can reduce latency, enhance privacy, and save bandwidth, particularly for IoT applications requiring high reliability [3]. - The company aims to create a unified AI service system through the collaboration of edge AI capabilities and cloud-based large models, promoting product implementation across diverse application scenarios [3].

Group 1 - The core viewpoint of the news is that TaiLing Microelectronics has shown a slight increase in stock price and has a significant market presence in the wireless IoT chip sector, with a focus on advanced technology development [1] - TaiLing Microelectronics was established on June 30, 2010, and went public on August 25, 2023, with its main business involving the research, design, and sales of wireless IoT system-level chips [1] - The company's revenue composition is primarily from IoT products (87.62%), followed by audio products (12.15%) and other sources (0.23%) [1] Group 2 - From the perspective of fund holdings, one fund under China Merchants Fund has a significant position in TaiLing Microelectronics, with the China Merchants CSI 2000 Index Enhanced A fund holding 178,800 shares, representing 0.62% of the fund's net value [2] - The China Merchants CSI 2000 Index Enhanced A fund has achieved a year-to-date return of 41.49% and a one-year return of 43.81%, ranking 513 out of 4206 and 416 out of 3983 respectively among its peers [2] Group 3 - The fund manager of the China Merchants CSI 2000 Index Enhanced A fund, Wang Ping, has a tenure of 15 years and 161 days, with a total fund asset size of 21.247 billion yuan and a best return of 247.72% during his tenure [3] - The other fund manager, Liu Hu, has a shorter tenure of 65 days, managing assets of 1.789 billion yuan, with a best return of 0.56% during his brief period [3]

Core Viewpoint - The 22nd China International Semiconductor Expo (IC China 2025) will be held from November 23 to 25, 2025, at the National Convention Center in Beijing, showcasing advancements in the semiconductor industry, particularly in AI chips and advanced manufacturing processes [2][3]. Industry Overview - IC China has been a significant event in the semiconductor industry since 2003, establishing itself as a top-tier industry brand and benchmark [3]. - The expo will focus on the entire integrated circuit industry chain, highlighting the latest technologies, products, and applications, with a theme of "Gathering Strength in Chips, Driving the Future" [4]. Exhibition Details - The expo will feature seven major exhibition areas, including IC design, industry chain, innovative applications, and components, with over 600 exhibitors expected [5]. - Notable companies participating include Yangtze Memory Technologies, Huada Jiutian, and Tongfu Microelectronics, among others [5]. Market Trends - China's semiconductor industry is projected to exceed $180 billion in sales by 2024, with a significant portion of this growth driven by domestic innovation and reduced reliance on imports [6]. - In the first ten months of this year, China's integrated circuit exports reached approximately $161.7 billion, indicating a year-on-year increase of over 23% [6][7]. Growth Projections - The semiconductor industry is expected to experience a dual breakthrough in technology and scale, with a compound annual growth rate (CAGR) of 19.6% in chip design from 2006 to 2025 [13]. - By 2026, the semiconductor industry is anticipated to maintain a CAGR of over 10% [14]. R&D Investments - A-share semiconductor companies are projected to invest over $80 billion in R&D in 2024, with a research intensity exceeding 13% [15]. - The highest growth in revenue from 2021 to 2024 is expected in semiconductor equipment, integrated circuit manufacturing, and discrete devices [15]. Investment Insights - The National Integrated Circuit Industry Investment Fund has significant holdings in 32 companies within the semiconductor industry, with many experiencing substantial increases in financing [17]. - Companies like Shengke Communication and Jiangbolong have seen financing balances increase by over 400% and 350%, respectively, indicating strong investor interest [18]. Stock Performance - Among the 32 companies with National Fund holdings, 12 have seen stock price increases of less than 30% this year, despite significant increases in financing [19]. - Notable companies include Hu Silicon Industry and Tai Ling Microelectronics, with financing balances increasing by over 85% and 187%, respectively [19][20].

（文/罗叶馨梅）11月20日，国家集成电路产业投资基金有限公司（下称"大基金"）正在加速推进退出早期投资项目。本周，科创板半导体公司燕东微 （688172.SH）与拓荆科技（688072.SH）相继披露大基金减持计划，按公告日收盘价估算，本次拟减持金额合计或超31亿元，引发市场对其资本运作节奏 的关注。 公告显示，拓荆科技于11月20日晚间收到大基金发来的减持计划告知函。大基金拟于2025年12月12日至2026年3月11日期间，通过大宗交易方式减持不超过 843.5万股，占公司总股本比例不超过3%。截至三季度末，大基金持有拓荆科技5502.67万股，持股比例19.57%，为公司第一大股东，本次减持全部采用大宗 交易方式，被认为有助于降低对二级市场的短期冲击。 在此之前的11月19日晚间，燕东微公告称，持股5%以上股东大基金因自身经营管理需要，计划于2025年12月11日至2026年3月11日，通过大宗交易或集中竞 价方式，减持不超过2141.43万股股份，即不超过公司总股本的1.5%。同时，股东北京京国瑞国企改革发展基金（有限合伙）亦拟在同一时间窗口内减持 1427.62万股。以公告日收盘价测算，大基金此次 ...