Summary of the Conference Call on the Heat Dissipation Industry Industry Overview - The heat dissipation industry is experiencing significant growth driven by the surge in AI mobile demand, leading to an increase in the application of vapor chamber (VC) heat spreaders, with larger areas being adopted to enhance heat dissipation efficiency [1][20] - Key players in the VC heat spreader market include Samsung and Xiaomi, who have implemented larger VC heat spreaders in their devices [1][8] Core Insights and Arguments - The demand for heat dissipation materials is rising due to increased power consumption from AI applications in smartphones, PCs, glasses, servers, and automobiles [2][20] - The transition from traditional thermal interface materials (TIM) to more advanced solutions like graphite films and VC heat spreaders is evident, with high-end smartphones utilizing a combination of these materials [2][4] - The market for graphite materials is benefiting from the increase in domestic production rates and cost reductions, with companies like Siquan and Zhongshi seeing positive impacts [1][10] - The overall heat dissipation industry is gaining attention, with expectations for new devices from North American clients to feature VC heat spreaders in the latter half of the year [2][20] Company-Specific Developments - **Suzhou Tianmai**: - Core business focuses on VC wafers, accounting for over 60% of revenue, with high gross and net profit margins [1][12] - The company employs a small-batch, multi-batch production model to cater to diverse design needs [1][13] - **Lingyi Zhizao**: - Successfully bound to major North American clients, expanding into humanoid robots, foldable screens, and AI glasses [1][11] - Anticipates continued growth in high-end smartphone VC product shipments [1][11] - **Feirongda**: - Specializes in electromagnetic shielding and thermal materials, with a growing contribution from data center and base station products [1][14] - Experienced a recovery in profitability since 2023, maintaining good relationships with domestic and international clients [1][14] - **Zhongshi Technology**: - Entered the North American supply chain, with significant growth expected in 2024, primarily from graphite materials and die-cutting processes [1][15] - Progressing well in optical modules and servers, with deep ties to overseas clients [1][15] - **Siyuan New Materials**: - Achieved significant revenue growth in 2024 after successfully breaking into the North American market [1][16] - **Jieban Technology**: - Focuses on providing structural and functional components for North American clients, with a successful acquisition enhancing its capabilities [1][19] Emerging Trends and Innovations - The evolution of heat dissipation technology is marked by a shift from traditional solutions to ultra-thin VC heat spreaders to meet the demands for lightweight and high-performance designs [2][7] - The automotive sector is seeing increased demand for new heat dissipation materials due to enhanced computing power in smart driving systems [2][6] - The industry is expected to see a rise in the use of multi-layer or thicker graphite structures to meet higher heat dissipation needs [1][10] Conclusion - The heat dissipation industry is poised for growth, driven by AI advancements and increasing performance requirements across various sectors, including smartphones, PCs, and automotive applications [2][20] - Companies within the industry are actively adapting to these changes, positioning themselves for future opportunities as demand for innovative heat management solutions continues to rise [2][21]

Group 1: Market Overview - The liquid cooling server market in China is projected to reach $3.39 billion by 2025, representing a growth of 42.6% compared to 2024 [1] - From 2025 to 2029, the market is expected to have a compound annual growth rate (CAGR) of approximately 48%, with an estimated market size of around $16.2 billion by 2028 [1] Group 2: Technological Advancements - The integration of liquid cooling technology with AI and cloud computing is accelerating, providing extensive expansion opportunities in high-performance and edge computing applications [3] - Innovations such as phase change cooling plates are enhancing market growth potential, while the demand for green transformation in data centers is increasing [3] - Liquid cooling systems can significantly reduce the Power Usage Effectiveness (PUE) value, with cold plate liquid cooling achieving a PUE of 1.1 to 1.2, and immersion cooling potentially below 1.05 [3] Group 3: Company Performance - Shenzhen Feirongda Technology Co., Ltd. expects a net profit of between 155 million to 170 million yuan in the first half of 2025, a year-on-year increase of 103.95% to 123.69% [4] - Shanghai Jialeng Songzhi Automotive Air Conditioning Co., Ltd. anticipates a net profit of 140 million to 170 million yuan in the first half of 2025, reflecting a growth of 53.58% to 86.49% [4] - Zhongshi Technology expects a net profit of 116 million to 129 million yuan in the first half of 2025, with a year-on-year increase of 85.01% to 105.75% [4]

Industry Overview - The liquid cooling server sector is gaining significant market attention, with 32 listed companies in the A-share market focusing on this concept [1] - As of August 4, the liquid cooling concept index has increased by 12.02% over the past 20 trading days [1] - IDC forecasts that the Chinese liquid cooling server market will reach a size of $3.39 billion in 2025, representing a 42.6% growth compared to 2024 [1] - The compound annual growth rate (CAGR) for the Chinese liquid cooling server market is expected to be around 48% from 2025 to 2029, with a projected market size of approximately $16.2 billion by 2028 [1] Company Performance - Shenzhen Feirongda Technology Co., Ltd. anticipates a net profit of between 155 million to 170 million yuan for the first half of 2025, reflecting a year-on-year growth of 103.95% to 123.69% [2] - Shanghai Jialeng Songzhi Automotive Air Conditioning Co., Ltd. expects a net profit of 140 million to 170 million yuan for the first half of 2025, indicating a year-on-year increase of 53.58% to 86.49% [2] - Zhongshi Technology forecasts a net profit of 116 million to 129 million yuan for the first half of 2025, with a year-on-year growth of 85.01% to 105.75% [3] - The demand for cooling materials from major clients and the rapid iteration of new products in emerging sectors like AI and digital infrastructure are driving revenue growth for Zhongshi Technology [3] Market Trends - The integration of liquid cooling technology with AI, cloud computing, and other fields is expected to expand its application in high-performance and edge computing [1] - Innovations such as immersion cooling and intelligent temperature control systems are anticipated to further enhance the growth potential of liquid cooling servers [1] - The strong demand for green transformation in data centers is positioning liquid cooling servers as an efficient and energy-saving solution, indicating a broad market development outlook [1]

Group 1 - The company, Zhongshi Technology, announced a share buyback plan, intending to repurchase 461,500 shares through a special securities account via centralized bidding [2] - The repurchased shares represent 0.15% of the company's total share capital as of the announcement date [2]

格隆汇8月1日丨中石科技(300684.SZ)公布，截至2025年7月31日，公司通过回购专用证券账户以集中竞 价交易方式回购公司股份461,500股，占公司目前总股本的0.15%，最高成交价为21.93元/股，最低成交 价为21.15元/股，成交总金额为996.4023万元(不含交易费用)。 ...

证券代码：300684 证券简称：中石科技 公告编号：2025-047 北京中石伟业科技股份有限公司（以下简称"公司"或"中石科技"）于 2025 年 4 月 14 日召开了第五届董事会第二次会议以及第五届监事会第二次会议，审 议并通过了《关于回购公司股份方案的议案》，同意公司使用自有资金以集中竞 价交易的方式回购公司部分股份，用于实施股权激励或员工持股计划。本次回购 股份的资金总额不低于人民币1,500万元（含），且不超过人民币3,000万元（含）， 回购股份的价格不超过 30.00 元/股；回购期限自公司董事会审议通过本次回购股 份方案之日起 12 个月内。具体内容详见公司分别于 2025 年 4 月 14 日、2025 年 4 月 15 日在巨潮资讯网（www.cninfo.com.cn）披露的《关于回购公司股份方案 的公告》（公告编号：2025-009）和《回购报告书》（编号：2025-010）。 因实施 2024 年年度权益分派，公司本次回购股份价格上限由不超过人民币 30.00 元/股（含）调整为不超过人民币 29.35 元/股（含）。具体内容详见公司于 2025 年 5 月 21 日在巨潮资讯网 ...

根据IDC数据，2025全年中国液冷服务器市场规模将达到33.9亿美元，与2024年相比增长42.6%。IDC预 计，2025—2029年，中国液冷服务器市场年复合增长率将达到约48%，2028年市场规模将达到约162亿 美元。 开源证券研报认为，AI时代液冷从可选项走向必选项，原因包括主流计算芯片功耗不断增加、AI集群 功率密度提升、单机柜功率持续增长、双碳时代严控PUE（电能利用效率）。在数据中心高密度化时 代，液冷优势日益凸显。 5只概念股上半年盈利向好 据证券时报·数据宝统计，A股中布局液冷服务器的概念股共有32只，业绩上来看，9股发布了上半年业 绩预告、业绩快报或半年报，其中，飞荣达、中石科技、松芝股份、领益智造、飞龙股份5股归母净利 润预增或增长。 飞荣达预计今年上半年实现归母净利润1.55亿元—1.7亿元，同比增长103.95%—123.69%。上半年公司 AI服务器散热相关业务与部分重要客户的合作有序推进中，营业收入显著增长。公司在投资者问答平 台上表示，公司在液冷散热领域也已展现出显著的技术优势，在业务推进上取得了显著进展。 液冷服务器概念连续上涨 8月1日早盘，A股液冷服务器概念持续强势， ...

Core Viewpoint - The article emphasizes the critical role of thermal management in the performance and reliability of electronic devices, driven by increasing power density due to advancements in technologies like 5G, AI, and IoT. Effective heat dissipation solutions are essential to prevent device failures and ensure optimal operation [7][10][15]. Group 1: Thermal Density and Management - The rise in power density of electronic components necessitates advanced thermal management solutions, as temperature increases can significantly reduce system reliability [7][10]. - The failure rate of electronic components increases exponentially with temperature, with a 50% reduction in reliability for every 10°C increase [7][8]. - The thermal flow density has surged from under 10W/cm² to nearly 100W/cm², driven by both increased power and reduced chip sizes [11][15]. Group 2: Passive Cooling Solutions - Passive cooling methods, which do not use active components, include materials like metal heat sinks, graphite films, and heat pipes, relying on thermal interface materials (TIMs) to transfer heat away from components [23][26]. - Metal heat sinks are effective for low-power devices but face limitations in high-power applications due to their thermal transfer rates [28][31]. - Graphite films have been widely adopted in consumer electronics for their high thermal conductivity in the X-Y plane, although their Z-axis conductivity is limited [32][33]. Group 3: Active Cooling Solutions - Active cooling methods, such as forced air cooling and liquid cooling, are becoming necessary as device power levels increase beyond the capabilities of passive systems [68][69]. - Liquid cooling systems can achieve heat dissipation rates of 10-1000W/cm², significantly outperforming air cooling methods [73][74]. - Data centers are increasingly adopting liquid cooling solutions to manage the rising power density of servers, with some configurations exceeding 30kW per cabinet [80][81]. Group 4: Market Opportunities and Beneficiaries - Companies involved in the development of advanced thermal management solutions, such as VC (vapor chamber) technology and liquid cooling systems, are positioned to benefit from the growing demand for efficient heat dissipation in high-performance electronics [49][54]. - Key players in the market include companies like Feirongda, Suzhou Tianmai, and others that are innovating in thermal management technologies [5][6].

Market Performance - The electronic chemicals sector declined by 1.53% on July 31, with Rongda Photoelectric leading the drop [1] - The Shanghai Composite Index closed at 3573.21, down 1.18%, while the Shenzhen Component Index closed at 11009.77, down 1.73% [1] Stock Performance - Siquan New Materials (301489) saw a significant increase of 20.00%, closing at 103.66 with a trading volume of 66,300 shares and a transaction value of 667 million [1] - Tiancheng Technology (688603) increased by 1.97%, closing at 65.26 with a trading volume of 98,000 shares and a transaction value of 659 million [1] - Other notable performances include Tongyu New Materials (301630) up by 0.91%, Guanghua Technology (002741) up by 0.61%, and Zhongshi Technology (300684) up by 0.50% [1] Capital Flow - The electronic chemicals sector experienced a net outflow of 795 million from institutional investors, while retail investors saw a net inflow of 851 million [3] - Speculative funds had a net outflow of 56.71 million [3]

Investment Rating - The report maintains an investment rating of "Outperform the Market - A" [7] Core Viewpoints - The report highlights that the increasing power density of electronic devices, driven by the proliferation of technologies such as 5G, AI, and IoT, is leading to significant thermal management challenges. The thermal flow density is approaching 100W/cm², necessitating advanced thermal management solutions to ensure system reliability [1][16][24]. Summary by Sections 1. Thermal Management Challenges - The report discusses the exponential increase in electronic component failure rates with rising temperatures, noting that a 10°C increase can lead to a 50% increase in failure rates [1][16]. - It emphasizes that traditional thermal management systems are nearing their physical limits, making the development of efficient thermal management solutions critical for the evolution of computing power [24]. 2. Passive Cooling Solutions - The report identifies limitations in traditional passive cooling methods, such as metal heat sinks and graphite materials, which struggle with heat transfer efficiency in high-density applications [2][33]. - Vapor Chamber (VC) technology is highlighted as a promising passive cooling solution due to its superior thermal conductivity and ability to meet the demands of increasingly compact electronic devices [2][33]. 3. Active Cooling Solutions - Liquid cooling is presented as a viable solution to overcome the limitations of forced air cooling, with applications in both cloud data centers and consumer electronics [3][4]. - The report notes that the liquid cooling market for data centers is projected to reach $9.231 billion by 2031, indicating significant growth potential [4]. 4. Market Size and Industry Chain - The global market size for VC technology is projected to be $1.089 billion in 2024, with substantial applications across consumer electronics and data centers [4]. - The report outlines the industry chain for VC technology, including upstream raw materials and production equipment, and downstream applications in various sectors [4]. 5. Beneficiary Companies - The report lists several companies that are expected to benefit from advancements in thermal management technologies, including Feirongda, Suzhou Tianmai, and others [5].