Core Viewpoint - The commercialization of glass substrates, a key technology for next-generation semiconductor packaging, is accelerating, with companies like SK, LG, and Samsung rapidly expanding partnerships with material and process suppliers [1] Group 1: Industry Trends - The competitive landscape has shifted from pure technology research to a value chain battle aimed at large-scale production [1] - Glass substrates are viewed as an ideal alternative for next-generation packaging due to their advantages such as low thermal expansion coefficient, high surface flatness, low signal loss, and high energy efficiency [1] - The increasing prevalence of high-performance, high-integration chips, particularly in artificial intelligence semiconductors, has heightened the importance of precision and stability during the packaging phase [1] Group 2: Company Strategies - SKC, through its subsidiary Absolics, is accelerating preparations for mass production of glass substrates, viewing it as a high-value packaging material that can grow alongside AI semiconductor business [1][2] - Absolics is diversifying its supply sources for photoresists by introducing domestic suppliers and is seeking more partners for glass through-hole (TGV) and electroplating processes [2] - Samsung is actively developing key components for glass substrates through a joint venture with Sumitomo Chemical and has invested in JWMT to support factory expansion and capacity enhancement [2] - LG Innotek is evaluating the glass substrate business as an extension of its existing substrate and packaging operations, collaborating with UTI to develop technology for enhancing glass substrate strength [2] Group 3: Production Challenges - The complexity of glass substrate processes, which include photoresists, glass core materials, hot pressing, electroplating, and tempered glass processing, makes it difficult for a single company to complete all processes independently within a limited timeframe [3] - As mass production plans become clearer, the demand for establishing partnerships to stabilize output and yield is increasing [3] - The competition in the glass substrate field is not about who masters the technology first, but rather who completes the mass-producible structural design first [3]

Core Viewpoint - The article discusses the future development of silicon-based semiconductor technology as outlined in the "2026 Semiconductor Technology Roadmap" by the Korean Semiconductor Engineers Society, predicting advancements in semiconductor manufacturing processes over the next 15 years, with a focus on achieving below 1 nanometer wafer processes and enhancing the industry's long-term competitiveness [1][2]. Group 1: Semiconductor Technology Advancements - Samsung has recently launched the world's first 2-nanometer Gate-All-Around (GAA) chip, Exynos 2600, and plans to upgrade this technology with a third-generation 2-nanometer GAA process, SF2P+, within two years [2]. - The roadmap anticipates that by 2040, semiconductor processes will reach 0.2 nanometers, utilizing a new transistor architecture called Complementary FET (CFET) alongside a monolithic 3D chip design [2]. - Samsung aims to achieve mass production of 1-nanometer chips by 2029, which will enhance both system-on-chip (SoC) for mobile devices and memory chips, reducing DRAM process from 11 nanometers to 6 nanometers and upgrading high-bandwidth memory (HBM) from 12-layer stacking with 2TB/s bandwidth to 30-layer stacking with 128TB/s bandwidth [2]. Group 2: NAND Flash Memory and AI Chip Development - SK Hynix has developed a 321-layer stacked QLC technology in the NAND flash memory sector, with predictions of achieving 2000-layer stacking in the future [3]. - Current AI processors can reach a maximum computing power of 10 TOPS, but the roadmap forecasts that in 15 years, chips for model training will achieve 1000 TOPS, while chips for inference tasks will reach 100 TOPS [3].

Market Overview - The Japanese stock market showed mixed results, with the Nikkei 225 index experiencing a slight decline of 0.02% as of the report [3] - The South Korean KOSPI index increased by 0.29%, reaching 3124.07 points [9] Individual Stock Performance - Sumitomo Pharma saw a significant increase of over 8%, while Omron, Seiko, and Casio rose by more than 5% [5] - Notable declines were observed in companies such as Fujitsu, Nintendo, and Mitsubishi Heavy Industries [5] - Specific stock performance data includes: - Sumitomo Pharma: 987.0 JPY, up 8.82%, market cap 392.7 billion JPY [6] - Omron: 4048.0 JPY, up 6.86%, market cap 834.9 billion JPY [6] - Seiko: 1180.5 JPY, up 5.54%, market cap 413.4 billion JPY [6] - Casio: 1161.5 JPY, up 5.50%, market cap 276.1 billion JPY [6] - Nissan Motor experienced a sharp decline, dropping over 3% [5] Economic Insights - Former Deputy Governor of the Bank of Japan, Nakaso Hiroshi, emphasized the need for vigilance regarding inflation risks, suggesting that there is still room for further interest rate hikes [7] - New Bank of Japan committee member, Junko Koizumi, hinted at a possible upward adjustment of inflation expectations this month, which could pave the way for another interest rate increase this year [8] Trade and Export Concerns in South Korea - A trade expert in South Korea predicted a significant reduction in exports of major products if the U.S. tariff policy is implemented as planned [9] - Forecasts indicate that exports in the automotive and steel sectors may decline by 7.1% and 7.2%, respectively, from July to December [10] - The expert urged South Korean companies to consider relocating production bases overseas or adjusting export prices to mitigate the impact of high tariffs [10] - There is a call for the South Korean government and industries to reduce reliance on the U.S. market and expand exports to regions such as the EU, ASEAN, and India, while accelerating the transition to high-tech industries [10]