Core Viewpoint - The company, Maiwei Co., has indicated that its high selectivity etching equipment and hybrid bonding equipment can be utilized in the DRAM (High Bandwidth Memory, HBM) process [1] Group 1 - The company's etching and thin film deposition equipment are widely used in the manufacturing of storage chips and logic chips [1]

Core Viewpoint - Dinglong Co., Ltd. is positioned as a leading platform enterprise in key innovative materials in China, focusing on products applicable to storage chip manufacturing [1] Group 1: Product Offerings - The company has developed multiple products for storage chip manufacturing, including CMP polishing materials such as polishing pads, polishing liquids, and cleaning liquids, which are essential consumables in wafer manufacturing [1] - The company has laid out nearly 30 types of high-end wafer photoresists applicable to storage chip manufacturing, with over 15 products already sent for sample verification [1] - Advanced packaging materials, including semiconductor packaging PI for bumping and redistribution layer (RDL) processes, as well as temporary bonding adhesives for ultra-thin wafer thinning processes, are also part of the company's offerings, suitable for advanced packaging of storage chips [1] Group 2: Market Position - As a leading semiconductor materials enterprise in China, the company's core products have been applied and are in stable mass production supply at several mainstream wafer manufacturers in the country [1] - The company refrains from disclosing specific customer cooperation details due to commercial confidentiality principles [1]

Group 1 - The core viewpoint of the article is that Guolin Technology's ozone generators and various functional water devices are applicable in the cleaning and film deposition processes of storage chip manufacturing [2] Group 2 - Guolin Technology responded to investor inquiries on November 27, indicating the relevance of their products in semiconductor manufacturing [2]