Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Group 1: Market Size and Growth Projections - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as Al-X photoresist are forecasted to grow from $2.64 billion in 2022 to $5.93 billion in 2028 [8]. - The conductive adhesive market is anticipated to reach $3 billion by 2026, indicating significant growth potential [8]. Group 2: Key Players and Competitive Landscape - Major international players in the advanced packaging materials market include Fujifilm, Toray, and Dow, while domestic companies such as Dinglong Co., Guofeng New Materials, and SanYue Technology are emerging as strong competitors [8]. - The article lists various domestic companies involved in different segments of the advanced packaging materials market, indicating a robust competitive landscape [8]. Group 3: Investment Strategies - Investment strategies vary by stage, with early-stage companies requiring thorough team and industry assessments due to high risks [10]. - As companies mature, the focus shifts to evaluating sales growth and market share, with later stages presenting lower risks and higher potential returns [10]. - The article emphasizes the importance of understanding the industry landscape and the specific needs of companies at different development stages for effective investment [10].

证券日报网讯1月9日，飞凯材料（300398）在互动平台回答投资者提问时表示，存储芯片市场价格上 涨，通常是其下游应用需求复苏以及行业供需关系变化的体现，这种趋势预计将推动存储芯片制造商及 封装测试厂商对产能和先进技术的投入。作为产业链上游的材料供应商，公司生产的先进封装材料是下 游封装环节的关键材料。相关市场需求的扩大，有望带动公司产品订单及销售增长，或将对公司先进封 装材料的业绩产生积极影响。 ...

中银证券表示，AI等领域快速发展带动材料需求提升，关键材料自主可控重要性日益增强。预计2029 年全球半导体材料市场规模有望超过870亿美元，2024-2029年CAGR为4.5%。在CMP抛光材料、光刻 胶、前驱体、电子特气、先进封装材料等多种关键半导体材料方面，我国企业稳健布局产能与技术研 发，未来有望逐步实现规模增长与技术迭代，半导体材料国产化率有望持续提升。 （声明：文章内容仅供参考，不构成投资建议。投资者据此操作，风险自担。） 1月7日，A股三大指数冲高回落，上证指数微涨录得14连阳。板块上，光刻胶强势拉涨，佳先股份涨超 25%领涨，高盟新材、华融化学、南大光电、安达智能、芯源微、恒坤新材均20cm涨停，普利特斩获 三连板。 ...

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Core Viewpoint - Dinglong Co., Ltd. is positioned as a leading platform enterprise in key innovative materials in China, focusing on products applicable to storage chip manufacturing [1] Group 1: Product Offerings - The company has developed multiple products for storage chip manufacturing, including CMP polishing materials such as polishing pads, polishing liquids, and cleaning liquids, which are essential consumables in wafer manufacturing [1] - The company has laid out nearly 30 types of high-end wafer photoresists applicable to storage chip manufacturing, with over 15 products already sent for sample verification [1] - Advanced packaging materials, including semiconductor packaging PI for bumping and redistribution layer (RDL) processes, as well as temporary bonding adhesives for ultra-thin wafer thinning processes, are also part of the company's offerings, suitable for advanced packaging of storage chips [1] Group 2: Market Position - As a leading semiconductor materials enterprise in China, the company's core products have been applied and are in stable mass production supply at several mainstream wafer manufacturers in the country [1] - The company refrains from disclosing specific customer cooperation details due to commercial confidentiality principles [1]

Group 1 - The article emphasizes that the advanced packaging equipment industry is entering a golden era driven by the AI wave and domestic substitution, with significant growth opportunities arising from the demand for advanced packaging technologies [1][8]. - The global advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with a compound annual growth rate (CAGR) of 37% for 2.5D/3D packaging technologies from 2023 to 2029 [7][8]. - The Chinese semiconductor packaging equipment market is expected to reach a sales revenue of 28.27 billion yuan in 2024, reflecting an 18.93% year-on-year growth [12]. Group 2 - The article discusses the rapid development of domestic semiconductor packaging equipment manufacturers in China, such as North Huachuang and Shengmei Shanghai, amidst a competitive landscape dominated by international giants [8][9]. - The demand for advanced packaging technologies is driven by the need for high-density integration and improved chip performance, particularly in AI models, data centers, and high-end consumer electronics [7][8]. - The article highlights the evolution of bonding technologies, with a significant shift towards advanced techniques that enhance integration density and performance, such as hybrid bonding and laser debonding [13][16]. Group 3 - The article outlines the critical role of various semiconductor equipment types, including thinning machines, dicing machines, and die bonders, in the advanced packaging process, emphasizing the need for precision and efficiency [27][28]. - It notes that the laser cutting technology is gaining traction due to its advantages in energy efficiency and adaptability to complex packaging requirements, with the global wafer cutting equipment market expected to grow significantly [26]. - The article also mentions the importance of surface functionalization technologies in enhancing the performance of advanced packaging, particularly in applications like chip-on-wafer and fan-out packaging [35][39].

Event Overview - The 2025 Guangdong Province Live Job Recruitment event will conduct 40 online job fairs from July to December 2025, guided by the China Small and Medium Enterprises Development Promotion Center and co-hosted by various provincial departments [2]. Live Event Details - The 34th session of the event is a special session for universities, scheduled for November 14, 2025, from 10:00 to 12:00 at Guangdong Science and Technology Vocational College (Zhuhai Campus) [4]. Company Profiles - **Dongguan Xingteng Technology Co., Ltd.**: Established in December 2019, the company aims to become China's largest new retail company in the "people, car, home" ecosystem, with over 130 offline stores and a cumulative investment of 160 million yuan. The company plans to achieve over 3 billion yuan in revenue within three years [5]. - **Zhuhai Guanyu Power Co., Ltd.**: A subsidiary of Guanyu Group, specializing in lithium battery R&D, production, and sales, with a focus on polymer lithium-ion batteries and expanding into power battery fields [6]. - **Zhongshan Duomei Chemical Co., Ltd.**: Founded in 1989, the company has evolved into a significant player in the daily chemical industry, focusing on oral care and personal care products [7]. - **Shenzhen No. 79 Fishing Boat Holdings Co., Ltd.**: Established in 2015, the company operates 18 branches in Shenzhen and 2 in Guangzhou, focusing on fresh seafood dining with a total operating area of approximately 54,179 square meters [8]. - **Haoji (Zhuhai) Semiconductor Co., Ltd.**: Founded in 2024, it is the first domestic company to integrate R&D, production, sales, and technical services in semiconductor packaging and precision probe manufacturing [9]. - **Guangdong Guangsheng Warehousing Management Co., Ltd.**: Established in 1984, the company has a registered capital of 100 million yuan and is expanding its warehousing network across multiple provinces, with plans for international market expansion [10]. Job Opportunities - **Dongguan Xingteng Technology Co., Ltd.**: Hiring for positions including Xiaomi Home Sales (30 positions), After-sales Service Specialist (8 positions), and Management Trainees (10 positions) with salaries ranging from 5,000 to 10,000 yuan [6]. - **Zhuhai Guanyu Power Co., Ltd.**: Seeking 100 skilled workers in smart manufacturing with salaries ranging from 2,440 to 7,500 yuan [6]. - **Zhongshan Duomei Chemical Co., Ltd.**: Open positions include Equipment Maintenance Workers, Quality Inspectors, R&D Staff, and Production Management Trainees, with salaries from 4,000 to 6,200 yuan [7]. - **Shenzhen No. 79 Fishing Boat Holdings Co., Ltd.**: Hiring Front Hall Reserve Cadres across various service roles, with salaries between 4,500 and 6,200 yuan [8]. - **Haoji (Zhuhai) Semiconductor Co., Ltd.**: Looking for Production Management Trainees with salaries from 5,000 to 6,000 yuan [10]. - **Guangdong Guangsheng Warehousing Management Co., Ltd.**: Recruiting Warehouse Managers with salaries ranging from 4,100 to 7,500 yuan [10].

Financial Performance - In the first three quarters of 2025, the company achieved operating revenue of 26.98 billion yuan, a year-on-year increase of 11.23% [2] - The net profit attributable to shareholders was 2.08 billion yuan, up 38.02% compared to the same period last year [2] - The operating cash flow for the same period was 7.7 billion yuan, reflecting a growth of 26.55% [3] Semiconductor Business - The semiconductor segment generated a revenue of 15.34 billion yuan, marking a year-on-year growth of 41.27% [2] - CMP polishing pad sales reached 7.95 billion yuan, with a 52% increase year-on-year [4] - CMP polishing liquid and cleaning liquid sales totaled 2.03 billion yuan, up 45% year-on-year [8] - The semiconductor display materials segment achieved sales of 4.13 billion yuan, a 47% increase year-on-year [9] R&D and Innovation - R&D investment for the first three quarters was 3.89 billion yuan, a 16% increase year-on-year, accounting for 14.41% of operating revenue [3] - The company has two subsidiaries recognized as "specialized and innovative" enterprises, reflecting its innovation capabilities [3] Market Outlook - The semiconductor and new display industries maintained a positive outlook, with good capacity utilization rates [4] - The company plans to expand its market for innovative materials in the fourth quarter of 2025 and into 2026 [4] Product Development - The high-end wafer photoresist project is progressing well, with over 10 products in testing and a new production line expected to begin trial operations [5] - The CMP polishing pad production capacity is set to increase to 60,000 units per month by the end of Q1 2026 [7] Challenges and Strategies - The printing and copying consumables business saw a revenue decline of 13% to 11.53 billion yuan due to market demand fluctuations [11] - The company is focusing on cost reduction, quality improvement, and risk management to maintain its market position [11] Future Goals - The company aims for a net profit target of 1 billion yuan for the next year, with confidence in achieving this through strong R&D and market expansion strategies [11]

Core Insights - The construction of the Guangzhou Zengcheng High-end Electronic Information New Materials Industrial Park has made significant progress with the launch of three key projects: an innovation research and development center, a dedicated wastewater treatment plant, and a fire station [1][2] - The park aims to address upstream material bottlenecks in the "chip" and "display" industries, enhancing the resilience of the industrial and supply chains in the Guangdong-Hong Kong-Macao Greater Bay Area [1][2] Group 1: Project Details - The innovation research and development center will cover approximately 76 acres with a total construction area of about 100,000 square meters, serving as a bridge connecting research institutions, universities, and enterprises [1] - The wastewater treatment plant will utilize advanced processing technology with an initial treatment capacity of 4,000 cubic meters per day, ensuring compliance with national standards and aiming for "zero pollution" [1][2] - The fire station will be built according to the standards of a first-level fire rescue station, covering about 10.2 acres and providing emergency support for the safety of enterprises within the park [2] Group 2: Strategic Importance - The industrial park spans approximately 1,649 acres and is managed by the Zengcheng Development Zone Management Bureau, with the Zengcheng Investment Group leading its development and operation [2] - It is designated as a key construction project in Guangdong Province and is the first industrial park in Guangzhou specifically designed for upstream support of the chip and new display industries [2] - The park focuses on six core areas: electronic gases, wet electronic chemicals, photoresists, chemical mechanical polishing materials, advanced packaging materials, and polarizer film materials, aiming to become a national-level innovation production base for electronic information new materials [2] Group 3: Market Context - The current global chip supply chain is volatile, with significant changes in market share for companies like Nvidia, which has seen its share in the high-end chip market in China drop from 95% to 0% [3] - The U.S. semiconductor export control list has expanded significantly, indicating a challenging environment for foreign chip suppliers [3] - The Zengcheng Industrial Park is positioned to benefit from the rapid development of emerging industries and the acceleration of domestic substitution, providing ample growth opportunities [3]

Group 1 - The company has completed the construction of the first phase of its advanced packaging materials project [2] - The second phase of construction has not yet started [2]