Financial Performance - In 2024, the company achieved a total revenue of 658 million CNY, with the power semiconductor business contributing 73 million CNY, accounting for 11.05% of total revenue [8] - The commercial operation service segment generated 355 million CNY in revenue, maintaining a gross margin of 90.56%, which is industry-leading [8] - The property management service business reported a revenue of 229 million CNY, with a gross margin of 32.78% [8] Debt and Asset Management - The company is currently in discussions regarding debt restructuring and significant asset sales, with no agreements signed yet, indicating uncertainty in implementation [2] - As of the end of 2024, the net assets attributable to shareholders decreased to 357,655,764.85 CNY, a decline of 64.03% compared to the end of 2023, primarily due to operating losses [2] - The company plans to accelerate debt resolution processes, leveraging favorable macroeconomic policies to mitigate debt risks [2] Business Strategy and Future Outlook - The company aims to enhance its profitability by focusing on the dual business model of "semiconductors + commercial management," with plans for product structure adjustments and new product development [9] - Future strategies include increasing investment in third-generation semiconductor chips and solutions, particularly in GaN and SiC technologies [2] - The company is optimistic about the power semiconductor industry, citing its essential role in the national economy and the high barriers to entry [6] Operational Efficiency and Innovation - The company is implementing digital tools for refined operations, optimizing merchant management, and enhancing marketing decisions through data-driven strategies [5] - Plans for online-offline integration include developing a membership service system via apps and mini-programs to boost customer engagement and sales [5] - The company is committed to improving operational efficiency through internal management optimization and cost control measures [7]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 来自 士兰微 ，谢谢。 2024 年，公司加快推进"士兰明镓 6 英寸 SiC 功率器件芯片生产线"项目的建设。截至目前， 士 兰 明 镓 已 形 成 月 产 9,000 片 6 吋 SiC MOS 芯 片 的 生 产 能 力 。 基 于 公 司 自 主 研 发 的 Ⅱ 代 SiC-MOSFET 芯片生产的电动汽车主电机驱动模块在 4 家国内汽车厂家累计出货量 5 万只，客 户端反映良好，随着 6 吋 SiC 芯片生产线产能释放，已实现大批量生产和交付。目前，公司已完 成第Ⅳ代平面栅SiC-MOSFET 技术的开发，性能指标接近沟槽栅 SiC 器件的水平。第Ⅳ代 SiC 芯片与模块已送客户评测，基于第Ⅳ代SiC芯片的功率模块预计将于2025年上量。 同时，公司加快推进"士兰集宏 8 英寸 SiC 功率器件芯片生产线"项目的建设。截至 2024 年 底，士兰集宏 8 吋 SiC mini line 已实现通线，公司Ⅱ代 SiC 芯片已在 8 吋 mini line 上试流 片成功，其参数与公司 6 吋产品匹配，良品率明显高于 6 吋。士兰集宏主厂房及其他建筑 ...