本文为IPO早知道原创 作者｜C叔 据IPO早知道消息，摩尔线程智能科技（北京）股份有限公司（以下简称"摩尔线程"）于11月13日晚间披露招股意向书，宣布正 式启动科创板IPO发行，股票代码为"688795"。最新公告显示，其将在11月24日进行申购，之后拟在上交所科创板上市。 这意味着，高端GPU芯片领域即将迎来"国产GPU第一股"，中国在构建自主可控算力体系的征程上迈出了坚实一步。 成立于2020年的摩尔线程始终专注于全功能GPU的自主研发与设计，是国内高端AI芯片领域极为稀缺的领军企业，其发展路径 与国家推动高水平科技自立自强的战略方向高度同频。基于其完全自主研发的MUSA统一系统架构，摩尔线程实现了单芯片同 时支持AI计算加速、图形渲染、物理仿真和科学计算、超高清视频编解码的技术突破，为国产高端AI芯片自主化进程树立了关 键技术标杆。 自2021年至2024年，摩尔线程每年推出一代GPU架构芯片，至今已推出"苏堤""春晓""曲院""平湖"四代芯片。2024年，摩尔线程 还推出了智能SoC芯片"长江"。其中，"苏堤""春晓"主要用于专业图形加速及桌面图形加速产品，"曲院""平湖"主要用于AI智算 产品， ...

Core Insights - Huawei unveiled the complete development roadmap for its Ascend AI chips at the Global Connectivity Conference, establishing a self-controlled computing foundation for China's AI industry amid manufacturing constraints [2] - The domestic AI chip ecosystem is evolving with multiple players like Alibaba, Baidu, Tencent, and ByteDance adopting different strategies for market entry, creating a multi-path domestic substitution landscape [3][6] Huawei's Asymmetric Innovation Path - Huawei acknowledges that its single-chip computing power still lags behind Nvidia but opts for an asymmetric innovation path, focusing on system architecture and interconnection technology to compensate for performance gaps [3] - The key breakthrough is the Lingqu interconnection protocol, which addresses long-distance, high-reliability, and low-latency challenges, achieving significant improvements in reliability and bandwidth [3] Future Roadmap for Ascend Chips - Huawei's roadmap includes the launch of Ascend 950PR in Q1 2026, focusing on inference pre-fill scenarios, and Ascend 950DT in Q4 2026, which will shift to SIMD/SIMT architecture for general AI tasks [4] - The Ascend 960, set for Q4 2027, will double specifications, while the Ascend 970 in Q4 2028 will achieve significant increases in computing power and memory access bandwidth [4] Competitive Edge of Huawei's SuperNodes - Huawei's Atlas 950 SuperPoD and Atlas 960 SuperPoD support 8192 and 15488 Ascend cards respectively, leading in key metrics compared to Nvidia's upcoming NVL144S [4] - The Atlas 950 SuperCluster and Atlas 960 SuperCluster boast computing power exceeding 500,000 and 1 million cards respectively, marking a significant advancement in the industry [4] Software and Ecosystem Development - Huawei is enhancing its software and ecosystem by open-sourcing the CANN compiler and virtual instruction set interface, with plans to open-source the Mind series application enablement suite by the end of 2025 [5] - The company aims to build a competitive technology alliance against Nvidia's CUDA ecosystem through the open release of Lingqu 2.0 technology specifications [5] Other Players in the AI Chip Ecosystem - Alibaba is diversifying its AI chip strategy with self-developed inference chips and ARM architecture CPUs, while Baidu's Kunlun series has gained market recognition with significant contracts [8] - Tencent is optimizing software-hardware collaboration through cloud services and investments in AI chip companies, while ByteDance is engaging in supply chain partnerships to procure domestic AI chips [8] Policy and Patent Support - The Chinese government has implemented policies to support the chip industry, aiming for a 70% self-sufficiency rate by 2025, with various tax incentives for chip manufacturers [10] - Patent accumulation is crucial for technological breakthroughs, with Huawei holding over 150,000 global patents, including significant numbers in AI and communication fields [11][12] Conclusion - The advancements in Huawei's Ascend chips and the collaborative efforts of other domestic players are driving the growth of a self-controlled AI chip ecosystem in China, supported by robust government policies and patent strategies [12]