Core Viewpoint - TSMC's 2nm process is set to begin mass production in the second half of this year, with strong demand from major clients like Apple, AMD, and Intel, leading to significant capacity expansion plans [1][2][3] Group 1: Production Capacity Expansion - TSMC plans to increase its 2nm monthly production capacity from 40,000 wafers at the end of this year to 100,000 wafers by next year, representing a 150% increase [1] - By 2027, TSMC anticipates further increasing the capacity to between 160,000 and 180,000 wafers, with the potential to reach 200,000 wafers if demand exceeds expectations [1][2] - The majority of the new capacity will be established at TSMC's Kaohsiung F22 facility [1] Group 2: Market Position and Client Demand - The 2nm process is expected to become TSMC's largest advanced process node by 2027, surpassing the current 7nm and 5nm processes, which have monthly capacities of approximately 160,000 wafers [2][3] - TSMC's advanced process expansion is a key driver for its performance, as more advanced nodes command higher prices, benefiting both volume and pricing [2][3] - Major clients expected to adopt TSMC's 2nm technology include Apple, AMD, Intel, Qualcomm, MediaTek, and NVIDIA [2][3] Group 3: Technological Advancements - TSMC's 2nm process technology is designed to provide significant performance and power efficiency advantages, with speed increases of 10% to 15% at the same power level, or a 25% to 30% reduction in power consumption at the same speed [3] - The company plans to introduce the N2P process technology, an extension of the N2 family, which will offer even better performance and power efficiency, expected to begin mass production in the second half of 2026 [4]

Core Viewpoint - TSMC's 2nm process is set to begin mass production in the second half of this year, with strong demand from major clients like Apple, AMD, and Intel, leading to significant capacity expansion plans [1][2] Group 1: Production Capacity - TSMC plans to increase its 2nm monthly production capacity from 40,000 wafers by the end of this year to 100,000 wafers next year, representing a 150% increase [1] - By 2027, TSMC aims to further expand its 2nm capacity to between 160,000 and 180,000 wafers, with the potential to reach 200,000 wafers if demand exceeds expectations [1][2] - Currently, TSMC's advanced process capacities include approximately 160,000 wafers for the 7nm process, slightly over 160,000 for the 5nm process, and about 130,000 wafers for the 3nm process, with potential adjustments to reach 160,000 wafers [2] Group 2: Client Demand and Market Position - Major clients expected to adopt TSMC's 2nm process include Apple, AMD, Intel, Qualcomm, MediaTek, and NVIDIA, indicating a broad market interest [1][2] - TSMC's advanced process expansion is anticipated to drive revenue growth, as newer processes command higher pricing, benefiting the company's operational performance [2] - The company expects that the number of product designs utilizing its 2nm technology in the first two years will surpass those for the 3nm and 5nm processes during their respective initial periods [2]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自中央社 。 网传台积电工程师不仅工时过长且需24小时待命，是血汗工厂，对此台积电董事长暨总裁魏哲家 今天澄清，不会有9万名员工都在血汗中过活，他更自嘲说，"我看起来像流了血汗吗，这么胖， 怎么可能"。 台积电今天召开股东常会，魏哲家会后受访说，台积电现在1年大概有9000名新进员工，台积电选 择的是志同道合的人。 魏哲家强调，台积电对员工的要求，首先是诚信、正直，其次是要创新和承诺，在公司里面工作， 公司对员工有一定承诺，也希望员工对公司同样有承诺。 至于外界所说血汗工厂，魏哲家说，不会有9万人都在血汗中过活。他看起来像流了血汗吗，并自 嘲"这么胖，怎么可能"。 魏哲家表示，他在公司讲求的是自动自发及生活快乐，因为这样才有办法在半导体产业继续发展， 家庭也才会快乐。 至于台积电如何对待新创小公司，这些小公司很可能是明天的英伟达（NVIDIA），魏哲家说，台 积电希望每一家小公司都成功，希望明年有很多英伟达。 至于当前经济情势具有不确定性，魏哲家表示，作为一名企业家，最怕的是不确定性，不知道应该 投资或不投资，投资怕搞错了，不投资又怕输人家。 魏哲家说，台 ...

来源：内容来自 联合报 ，谢谢。 台积电规划下半年量产2纳米制程，近期相关客户陆续浮上台面，继超微宣布下单台积电2纳米 后，市场传出，英特尔也加入台积电2纳米首批客户行列，将用于生产下世代PC处理器，现正于台 积电新竹厂区紧锣密鼓准备试产，以利后续调整良率。 对此，台积电表示不评论市场传闻，也不评论特定客户业务。英特尔也不对相关消息置评。法人看 好，随着2纳米客户订单持续涌进，将助益台积电下半年业绩持续热转。 如果您希望可以时常见面，欢迎标星收藏哦~ 英特尔已是台积电先进制程主要客户之一，去年2月，英特尔当时执行长基辛格证实，已把两款处 理器关键的运算芯片块（Compute tile）首度交给台积电生产，这两款产品就是后来的Intel Core Ultra 200V系列笔电处理器（代号Lunar Lake），与该公司首款AI PC桌上型处理器Intel Core Ultra 200S系列（代号Arrow Lake）。 其中，运算芯片块以台积电N3B制程生产，GPU芯片块以台积电N5P制程生产，SoC与I／O芯片块 则以台积电N6制程生产。 如今英特尔执行长改由陈立武领军，最新传出该公司会在自家产品内接续采用台 ...