Core Viewpoint - The report from Goldman Sachs indicates that China's domestic lithography machines can only produce chips with a 65nm process, lagging approximately 20 years behind international leader ASML [1][3]. Group 1: Current State of Chinese Semiconductor Technology - Although China can produce 7nm process chips, it likely relies on older DUV lithography machines from ASML, as China lacks the capability to manufacture such equipment [3]. - The latest High-NA EUV lithography machines from ASML are crucial for processes below 1.4nm and have begun delivery to major companies like Intel, TSMC, and Samsung [3]. - ASML's lithography machines have taken 20 years and $40 billion in R&D and capital expenditures to evolve from 65nm to 3nm and below [3]. Group 2: Market Dynamics and Competition - The global lithography machine market is dominated by ASML, which holds over 80% market share, and 100% of the advanced EUV lithography machine market [4]. - The relationship between lithography machines and chip manufacturing processes is direct, with specific machines designed for corresponding process nodes [4]. Group 3: Lithography Machine Classification - The classification of lithography machines includes various generations, with the current domestic machines being ArF type, suitable for 90nm process chips, indicating a significant technological gap compared to ASML [5]. - The table of lithography machine classifications shows the evolution from G-line machines for processes greater than 350nm to EUV machines for processes below 7nm [5].