公众号记得加星标⭐️，第一时间看推送不会错过。 混合键合(HB: Hybrid Bonding)技术现在在长江存储YMTC、KIOXIA和Western Digital(SanDisk)等3D NAND 制 造 商 中 很 常 见 。 长 江 存 储 YMTC 将 其 命 名 为 Xtacking （ Xtacking1.0 至 Xtacking4.x ） ， 而 KIOXIA/Western Digital将其命名为CBA(BiCS8)。 HB技术有什么好处？在HB工艺技术中，存储器阵列和外围电路分别在两个不同的晶圆（NAND 阵列晶圆 和外围逻辑晶圆）上制造，然后通过数百万对小间距金属通孔键合在一起。使用HB可显著提高存储密 度，并提供更高的I/O速度。Micron、Samsung和SK hynix的当前CuA、COP和4D PUC NAND器件将很快转 向HB结构。未来，HB技术还可用于DRAM微缩，例如混合键合3D DRAM和先进HBM器件(HB-HBM)。 微凸块Microbumping广泛应用于HBM DRAM芯片管芯多层堆叠的HBM器件，例如8Hi、12Hi 或16Hi。三 大HBM制造商对HB ...

Core Viewpoint - SMIC reported a revenue of approximately 32 billion RMB for the first half of the year, which is significantly lower than TSMC's 425.8 billion RMB, highlighting a 12-fold revenue gap attributed to the lack of advanced EUV lithography machines [1][3][5]. Group 1: Revenue Comparison - SMIC's revenue of 32 billion RMB is substantial but pales in comparison to TSMC's 425.8 billion RMB, indicating a significant disparity in earnings [1][3]. - The 12-fold difference in revenue is primarily due to the advanced EUV lithography technology that TSMC possesses, which is crucial for manufacturing high-end chips [3][5]. Group 2: Technology and Supply Chain Challenges - The inability to acquire EUV lithography machines, due to international agreements like the Wassenaar Arrangement and the US-Japan-Netherlands pact, restricts SMIC to producing only mature process chips (14nm and above) [5][9]. - EUV lithography machines are complex systems requiring contributions from multiple countries, making it difficult for any single nation to produce them independently [5][7]. Group 3: Future Prospects and Strategies - Despite current limitations, SMIC and other Chinese companies are aggressively expanding in the mature process segment, aiming to dominate this market by 2030 [9][10]. - The industry is exploring alternative technologies, such as DUV lithography and chip stacking, to produce competitive 7nm chips, as demonstrated by Huawei's Kirin 9000S and 9010 chips [10][12]. - A fully domestic chip supply chain is being established, with advancements in design software, chip design, manufacturing, and packaging, indicating a strong foundation for future growth [12][14].