Core Viewpoint - Huawei is leading a new paradigm in AI infrastructure with its innovative supernode interconnection technology, emphasizing the importance of computing power in artificial intelligence development [2][3]. Group 1: Ascend Chip Development - Huawei has made significant progress in its Ascend chip series, with the upcoming Ascend 950 series expected to enhance AI computing capabilities [3][4]. - The Ascend 950 series includes two chips: Ascend 950PR and Ascend 950DT, which will improve training efficiency and inference throughput [5][6]. - The Ascend 950PR chip targets inference prefill and recommendation scenarios, while the Ascend 950DT focuses on inference decode and training, with significant improvements in memory bandwidth and capacity [6][7]. Group 2: Supernode Products - The Atlas 950 supernode, based on the Ascend 950DT chip, will support 8192 Ascend 950DT chips, significantly increasing computing power and interconnection bandwidth [9][10]. - The Atlas 960 supernode, set to launch in 2027, will further enhance performance with a maximum support of 15488 cards, doubling the capabilities of the Atlas 950 [11][12]. - The Atlas 950 SuperCluster will consist of 64 Atlas 950 supernodes, achieving a total computing power of 524 EFLOPS, making it the world's strongest computing cluster [21][22]. Group 3: Interconnection Technology - Huawei has developed a new interconnection protocol, "Lingqu," to support large-scale supernode architectures, enhancing reliability and bandwidth [20][23]. - The interconnection technology addresses challenges in long-distance, high-reliability connections and aims to achieve TB-level bandwidth with low latency [19][20]. - The Lingqu protocol will be open for industry partners to foster collaboration and innovation in interconnection technology [20][23].

Core Viewpoint - Huawei emphasizes the importance of computing power as a key driver for artificial intelligence (AI) development in China, introducing innovative solutions to meet the growing demand for computing resources [2]. Group 1: Product Launches - Huawei launched the latest supernode products, Atlas 950 SuperPoD and Atlas 960 SuperPoD, which support 8192 and 15488 Ascend cards respectively, showcasing significant advancements in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [2]. - The company also introduced supernode clusters, Atlas 950 SuperCluster and Atlas 960 SuperCluster, with computing power exceeding 500,000 cards and reaching one million cards respectively [2]. Group 2: Technological Innovations - Huawei has developed a new interconnect protocol called Lingqu (UnifiedBus) to address the challenges of large-scale supernode interconnect technology, leveraging over 30 years of connectivity expertise [3]. - The company plans to open the Lingqu 2.0 technical specifications to industry partners, encouraging collaborative development of related products and components to build an open ecosystem [3]. Group 3: Strategic Vision - Huawei aims to lead a new paradigm in AI infrastructure through its innovative Lingqu supernode interconnect technology, continuously meeting the rapid growth in computing power demand and driving sustainable AI development [3].