这一奖项旨在表彰产品、设计、广告、渠道、技术、创意等任一维度具有突破性表现的品牌，而这次的"骁龙主题馆"，高通则携手运营商、手机、PC及XR 等终端厂商、顶尖游戏工作室、游戏技术厂商和发行商、电商等75家行业重量级合作伙伴，呈现出一场融合前沿技术创新、潮流游戏装备和沉浸数字娱乐体 验的夏日盛宴，形成跨界创新的惊艳瞬间。 这已是成立40年、植根中国发展30年的高通第六次打造"骁龙主题馆"了。骁龙一直是数字娱乐新潮装备的开拓者，也是新趣体验的赋能者。从智能手机、平 板、PC、手持游戏设备，到XR和汽车，高通持续推出面向不同终端的骁龙平台，为多品类终端带来顶级性能和体验，全面助力数字娱乐体验升级与生态繁 荣。 今年的ChinaJoy骁龙主题馆内，骁龙赋能的各类智能终端——智能手机、平板、AI PC、智能汽车、游戏掌机等设备也带来了跨端协同游戏体验，推动多设 备无缝互联成为现实。玩家也在骁龙展台亲自体验了它们的出色性能。 在第一财经2025年度品牌力量评选中，高通旗下的骁龙成功斩获"品牌力量·年度Aha瞬间"奖。 在第一财经2025年度品牌力量评选中，全球科技创新企业高通旗下的骁龙，依托在终端侧AI、高性能低功耗计算 ...

Core Viewpoint - Nanjing Qinheng Microelectronics Co., Ltd. has officially submitted its IPO application to the Shanghai Stock Exchange, aiming to raise 932 million yuan for the development and industrialization of various chip projects [1][2] Group 1: Company Overview - Qinheng Micro focuses on connection technology and microprocessor research, specializing in integrated circuit design based on self-developed interface IP and core IP [1] - The company's main products include interface chips and interconnection MCU chips, which are essential for information exchange and data processing in electronic devices [1] Group 2: IPO Details - The company plans to use the raised funds for projects related to USB chip development, network chip development, and full-stack MCU chip development [1][2] - The IPO aims to enhance the company's capabilities in producing competitive interface chips and interconnection MCU chips [2] Group 3: Future Development Plans - Post-IPO, the company intends to increase R&D investment in connection technology and microprocessor cores, focusing on high-speed USB, Ethernet, and low-power wireless communication technologies [2] - Qinheng Micro aims to expand its product matrix by developing high-performance RISC-V processor IP and various network chips, including high-speed Ethernet SoC chips and low-power multi-mode wireless SoC chips [2]

Core Viewpoint - The company, AVIC Optoelectronics, has established itself as a leading player in the automotive connector market, particularly in the context of the rapid evolution towards electric and intelligent vehicles, showcasing its innovative technologies and strategic positioning at the Shanghai Auto Show [2][3][10]. Group 1: Technological Innovation and Market Position - AVIC Optoelectronics entered the automotive connector market early, filling a significant gap with its first-generation high-voltage connectors during the nascent stage of the domestic electric vehicle industry [3]. - The company has developed a comprehensive product matrix and established a dedicated New Energy Vehicle Division, enhancing its role as a key participant in the industry's transformation [5][10]. - The company has achieved a domestic market share exceeding 30% in high-voltage connectors, with annual sales surpassing 30 million sets, solidifying its leadership position [10]. Group 2: Product Development and Industry Trends - AVIC Optoelectronics has launched a series of innovative products, including high-power fast-charging connectors and Busbar solutions, addressing the stringent requirements of 800V high-voltage platforms [6][10]. - The company has introduced a full aluminum high-voltage solution, significantly reducing weight by over 20% while maintaining current-carrying capacity, thus addressing the industry's lightweight demands [6][10]. - The company has developed a smart networking system that covers the entire "vehicle-road-cloud" ecosystem, providing low-latency and high-reliability signal transmission for intelligent driving and connected vehicles [6][10]. Group 3: Strategic Vision and Future Outlook - The company aims to leverage its advanced connection technologies to create a seamless integration between vehicles, charging facilities, smart grids, and the internet, fostering a smart and efficient travel ecosystem [10][16]. - AVIC Optoelectronics is committed to expanding its international market presence, focusing on partnerships with leading global automotive manufacturers to enhance its competitive edge [16]. - The company recognizes the importance of addressing industry pain points, such as the reliability of high-voltage systems and the challenges of lightweight materials, as key drivers for innovation and industry advancement [14][16].