Investment Rating - The report maintains a "Recommended" investment rating for the company [1][12]. Core Views - The company is experiencing strong growth driven by robust demand in AI and high-speed communication sectors, with a significant increase in revenue and net profit in the first half of 2025 [4][7]. - The company is expanding its high-end PCB production capacity, which is expected to further enhance its profitability and competitive position in the market [8]. Summary by Sections Company Overview - The company, Hu Dian Co., Ltd. (002463.SZ), operates in the electronics industry and has a total market capitalization of 107 billion yuan [1]. Financial Performance - In the first half of 2025, the company achieved revenue of 8.494 billion yuan, a year-on-year increase of 56.59%, and a net profit attributable to shareholders of 1.683 billion yuan, up 47.5% year-on-year [4][7]. - The company's PCB business revenue grew by 57.2% to 8.152 billion yuan in the same period [7]. Business Segments - The enterprise communication market segment saw revenue of 6.532 billion yuan, a 70.63% increase year-on-year, with high-speed network products being the fastest-growing area [7]. - The automotive segment generated revenue of 1.422 billion yuan, a 24.18% increase, with significant growth in emerging automotive products [8]. Future Outlook - The company is investing 4.3 billion yuan in high-end PCB expansion projects, which commenced in June 2025, with production expected to start in the second half of 2026 [8]. - The forecast for net profit attributable to shareholders for 2025-2027 has been adjusted upwards to 3.607 billion yuan, 4.829 billion yuan, and 5.858 billion yuan respectively [8]. Valuation Metrics - The projected P/E ratios for 2025, 2026, and 2027 are 29.7, 22.2, and 18.3 respectively, indicating a favorable valuation outlook as the company continues to grow [8][10].

（编辑 袁冠琳） 证券日报网讯 沪电股份8月22日在互动平台回答投资者提问时表示，通信通讯设备、高速运算服务器、 人工智能、数据中心基础设施、汽车电子等是公司产品的核心应用领域，公司与国内外众多终端客户展 开多领域深度合作，公司经营团队会坚持做好自己的事情，把握行业发展趋势，保持战略定力，积极应 对外部环境带来的挑战，坚持以技术创新和产品升级为内核，加快推进新项目的建设，甄别并抓牢目标 产品市场涌现的新业务机会，紧抓人工智能、高速网络等对高端PCB的结构性需求，大力开展相关业 务，以实现更长远的发展目标，为投资者创造更多价值。 ...

Core Viewpoint - Pengding Holdings reported strong financial performance for H1 2025, with significant growth in revenue and net profit, driven by demand in the PCB industry and advancements in AI and mobile devices [2][3][4]. Financial Performance - Revenue for H1 2025 reached 16,375,291,624.65 CNY, a year-on-year increase of 24.75% [3]. - Net profit attributable to shareholders was 1,233,023,885.96 CNY, up 57.22% compared to the same period last year [2][3]. - Net profit excluding non-recurring items was 1,148,508,663.87 CNY, reflecting a growth of 51.9% year-on-year [2][3]. - Operating cash flow for the period was 4,276,933,506.84 CNY, an increase of 53.29% from the previous year [3]. - Basic and diluted earnings per share were both 0.53 CNY, a rise of 55.88% [3]. Asset and Equity Position - Total assets as of the end of H1 2025 were 44,434,986,384.52 CNY, a slight decrease of 0.24% year-on-year [3]. - Net assets attributable to shareholders were 31,233,625,412.88 CNY, down 2.73% from the previous year [3]. Industry Growth - The global PCB industry experienced a year-on-year growth of 12.1% in Q1 2025 compared to Q1 2024, supported by strong demand for AI and high-speed network applications [3]. - The total market value of the PCB industry is projected to reach 79.128 billion USD in 2025, representing a 7.6% increase [3]. - The PCB market is expected to expand from 73.5 billion USD in 2024 to 94.6 billion USD by 2029 [3]. Product Development and Market Position - As the largest FPC product manufacturer globally, Pengding Holdings holds over 30% market share in FPC products, leveraging its extensive experience in R&D, design, and production [4]. - The company is focusing on high-end HDI products to penetrate the AI server market and is actively pursuing product certifications with well-known manufacturers [4]. - Pengding Holdings is expanding its collaboration with cloud server manufacturers on AI ASIC-related products to enhance competitiveness in the AI server market [4]. Capacity Expansion - The company is accelerating investments in high-end HDI and SLP products, with the first phase of its Thailand factory completed in May 2025, primarily serving AI servers and optical communication sectors [5]. - The second phase of the Thailand factory construction has also commenced, supporting the company's full-chain layout in AI cloud, edge, and terminal applications [5].