2纳米制程工艺
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高通CEO安蒙证实:正与三星洽谈2纳米芯片代工合作事宜
Sou Hu Cai Jing· 2026-01-07 13:18
若此次合作最终敲定,无疑是对三星晶圆代工技术实力的一次重磅背书。此前,受三星代工制程稳定性问题影响,高 通曾将旗下最尖端芯片的代工订单转交给台积电。此番选择重返三星,委托其代工 2 纳米产品,意味着三星 SF2P 制程 工艺在性能表现、能效水平及生产良率上,均已达到具备市场竞争力的水准。 倘若 SF2P 制程能够如约兑现技术承诺,且吸引更多大客户相继入局,那么三星晶圆代工的 2 纳米战略布局,或将成为 其在先进芯片制造领域蓄势已久的复兴起点。这不仅能为该公司在下一代芯片制程上的长期投入正名,更将进一步夯 实其雄心 —— 在半导体行业的顶级赛道上,与台积电展开正面角逐。 而今,又一家行业巨头似乎也准备加入这一阵营。据韩媒 Hankyung 报道,高通正与三星晶圆代工积极洽谈 2 纳米芯片 代工合作。高通首席执行官克里斯蒂亚诺・安蒙在 2026 年国际消费电子展(CES)期间接受记者采访时,也证实了双 方正在推进相关磋商。 安蒙表示:"在众多晶圆代工厂商中,我们率先与三星电子开启了基于最先进 2 纳米制程的代工合作洽谈。目前,相关 芯片的设计工作已全部完成,旨在推动产品尽快实现商业化落地。"尽管高通尚未正式公布这 ...
台积电泄密风波引关注 全球2纳米工艺规模量产在即
Zhong Guo Jing Ying Bao· 2025-08-08 14:41
Group 1: TSMC's 2nm Process Leak Incident - TSMC announced a leak of confidential information related to its 2nm chip process, resulting in the dismissal of involved employees and the initiation of legal proceedings [2] - TSMC's 2nm process is expected to enter mass production in the second half of this year, with the A20 chip for the iPhone 18 series being one of its first applications [2] - TSMC's 2nm process has achieved a yield rate exceeding 80%, which is sufficient for mass production and revenue generation [2][3] Group 2: Competitive Landscape - TSMC holds a significant market share of approximately 67.6%, while Samsung has about 7.7%, highlighting the competitive gap [3] - Samsung plans to start mass production of its 2nm process in the first half of 2026, despite initial yield rates being lower than TSMC's [3][5] - Intel aims to disrupt the market with its 18A process, which is equivalent to 1.8nm, but faces challenges with yield rates and production timelines [6][7] Group 3: Market Outlook and Applications - The global market for 2nm and similar processes is projected to exceed $50 billion by 2025, with an annual growth rate of over 20% [5] - The introduction of 2nm technology is expected to benefit downstream applications, particularly in consumer electronics, AI, and IoT [8][9] - Companies like Apple and NVIDIA are anticipated to leverage 2nm chips for enhanced performance in their next-generation products [8][9]