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拟募资80亿元!摩尔线程IPO获受理,系科创板年内最大IPO
Bei Jing Shang Bao· 2025-06-30 13:26
北京商报讯(记者 马换换 王蔓蕾)科创板再迎一家未盈利IPO企业。6月30日晚间,上交所官网显示, 摩尔线程智能科技(北京)股份有限公司(以下简称"摩尔线程")科创板IPO获得受理。 招股书显示,摩尔线程主要从事GPU及相关产品的研发、设计和销售。自2020年成立以来,公司以自主 研发的全功能GPU为核心,致力于为AI、数字孪生、科学计算等高性能计算领域提供计算加速平台。 本次冲击上市,摩尔线程拟募集资金约80亿元,拟投资于摩尔线程新一代自主可控AI训推一体芯片研 发项目、摩尔线程新一代自主可控图形芯片研发项目、摩尔线程新一代自主可控AI SoC芯片研发项 目、补充流动资金。 值得一提的是,经同花顺iFinD统计,截至目前,摩尔线程系科创板年内受理的最大IPO,同时系沪深北 交易所年内受理的第二大IPO。 业绩表现方面,报告期内,摩尔线程营收稳步增长,归属净利润逐年减亏。财务数据显示,2022—2024 年,公司实现营业收入分别约为4608.83万元、1.24亿元、4.38亿元;对应实现归属净利润分别约为-18.4 亿元、-16.73亿元、-14.92亿元。 冲击科创板上市背后,摩尔线程报告期内始终保持高比例 ...
黑芝麻智能签署意向书,拟收购一家AI SoC芯片公司
Ju Chao Zi Xun· 2025-06-18 15:00
Group 1 - The company announced a non-binding letter of intent to acquire a target company focused on developing and selling high-performance, low-power AI system-on-chip (SoC) solutions [2] - The target company has achieved self-research for most of its intellectual property, including ISP, NPU, and analog IP, and provides full-stack solutions primarily in automotive intelligence and edge AI applications [2] - The potential acquisition is expected to enhance the company's ability to offer a full range of automotive-grade computing chips and comprehensive solutions for smart vehicles, as well as expand into broader robotics applications [2] Group 2 - The company is one of the few in China to launch high-performance autonomous driving chip solutions, with its A1000 series chips already in mass production with major automakers like Geely, Dongfeng, and BYD [3] - The A1000 series chips support a high-speed NOA solution that has achieved nationwide highway coverage and coverage in major urban expressways [3] - The Wudang C1200 series chips have completed functional verification for urban no-map NOA and established deep collaborations with companies such as FAW, Dongfeng, Aptiv, Joyson Electronics, and Zebra Smart Mobility [3]
星宸科技:4月29日召开业绩说明会,投资者参与
Zheng Quan Zhi Xing· 2025-04-30 07:09
问:请董秘能否具体拆分说明Q1各业务线增长情况? 答:您好,2025年Q1公司各业务线均实现了超过20%的同比增长:其中,在智能物联领域,公司已导入众 多智能机器人头部品牌客户,智能机器人芯片单季度出货量及营收均已超过2024年全年,实现超预期增 长;在智能车载领域,得益于在前装市场加大拓展力度并持续突破,ADAS及感知芯片开始起量,实现了 显著增长;在智能安防领域,公司完整产品布局全方位满足市场需求,行业地位得到了进一步巩固和提 升。 问:公司本期盈利水平如何? 答:您好,公司盈利水平持续维持稳健增长,2024年度实现归属于上市公司股东的净利润约2.56亿元,同 比增长约25.18%;公司2025年一季度实现归属于上市公司股东的净利润约5,117.87万元,同比增长约 0.48%。感谢您对公司的关注! 证券之星消息,2025年4月30日星宸科技(301536)发布公告称公司于2025年4月29日召开业绩说明会。 具体内容如下: 问:公司之后的盈利有什么增长点? 答:您好,公司借由健全的市场洞察及战略布局体系,确保长期盈利能力及增长机会,同时加大投资具有 长期竞争力的前沿IP技术,包含大算力、运动ISP、超低 ...
星宸科技(301536) - 301536星宸科技投资者关系管理信息20250430
2025-04-30 00:02
Group 1: Business Performance - In Q1 2025, all business lines achieved over 20% year-on-year growth, with significant contributions from smart IoT and automotive sectors [2] - For the full year 2024, the company reported a net profit of approximately CNY 256 million, a year-on-year increase of about 25.18% [3] - Q1 2025 net profit was approximately CNY 51.18 million, reflecting a year-on-year growth of about 0.48% [3] Group 2: Product Development and Market Strategy - The company has launched the SSC309QL SoC chip for AI glasses, with expected shipments in the second half of 2025 [3] - In the humanoid robot sector, the company achieved over threefold growth in both shipment volume and revenue in 2024 compared to 2023 [4] - The company is focusing on advanced IP technologies, including high-performance chips for various applications such as smart robots and smart glasses [5] Group 3: Research and Development Investment - In 2024, R&D investment was approximately CNY 602 million, a year-on-year increase of about 21.95%, with an R&D investment rate of approximately 25.59% [6] - Q1 2025 R&D investment was about CNY 168 million, reflecting a year-on-year increase of approximately 19.8% [6] Group 4: Market Position and Future Outlook - The company has established a global sales strategy, with over half of sales coming from overseas markets [7] - The company aims to become a leading SoC chip supplier in the smart robot industry within the next two to three years [5] - The future development of AI SoC chips is expected to focus on higher efficiency, lower power consumption, and smaller sizes to meet growing smart device demands [11]