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势银观察 | More than Moore推动先进封装bumping加速微缩
势银芯链· 2026-02-09 07:29
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 信号高速高频传输与高效运算不仅驱动布线互联密度提升、线宽线距加速微缩, bumping键 合也在不断走向高密集成。 Bumping industry trends Bump工艺几乎在所有中高端产品封装中都有采用,囊括了智能手机、消费电子、汽车电 子、高性能计算等绝大多数应用场景(CPU、GPU、DDIC、AP、BB、MEMS、FPGA、 ASIC、Memory等等)。 无凸点键合(混合键合技术)当前仅应用于特定高阶应用场景,如HBM5、3D NAND、3D CIS、3D DRAM、3D SOC以及Micro LED等,但这些无bumping产品的异构集成工艺主要 在前道制程完成,即晶圆厂内部完成,对于封装厂来说仅是模组的封装,无法承接这些产 品。 Bumping应用 文章来源:势银(TrendBank) Bumping工艺与倒装芯片直接相关,不管是FCBGA/FCCSP,还是目前火热的HBM封装、 COWOS系列封装都已采用倒装技术,这使得封装集成密度陡然提升,bumping制程也在从 C4 bump向细间距bump、micr ...
2025年中期策略会速递:半导体:需求分化,关注AI、先进制造演进
HTSC· 2025-06-09 01:35
Group 1: Semiconductor Manufacturing Trends - Manufacturing utilization rates continue to improve year-on-year, with downstream manufacturers focusing on Chiplet and advanced packaging technologies[1] - The storage market is showing signs of a price turning point, with an upward trend expected to continue until Q3 2025, driven by AI-related demand[1] - Design companies are experiencing differentiated downstream demand, with power and analog companies reporting a recovery in industrial and automotive sectors[1] Group 2: Equipment and Domestic Production - Global WFE is projected to reach $100 billion in 2025, with a year-on-year growth of 4%-5%[3] - Domestic equipment manufacturers are seeing significant growth in new orders, benefiting from downstream expansion and increased localization rates[3] - The verification speed of core new equipment by domestic companies is accelerating, indicating a positive trend for advanced node domestic equipment breakthroughs[3] Group 3: Storage Market Dynamics - The storage market is expected to see price increases, with predictions of 18-23% and 13-18% growth for Server and PC DDR4 modules respectively in Q2 2025[4] - The enterprise storage market is projected to grow from $23.4 billion in 2024 to $49 billion by 2028, reflecting a compound annual growth rate (CAGR) of 16%[25] - Domestic manufacturers are positioned to benefit from the increasing demand for enterprise-level storage driven by AI infrastructure investments[25] Group 4: Design Sector Insights - The power semiconductor sector in China is entering a mild upward cycle, with a 14.5% year-on-year increase in domestic passenger car production from January to April 2025[38] - The demand for SoC and MCU products is significantly driven by national subsidies and export opportunities, with performance expected to vary across companies in Q2 2025[26] - The analog chip sector is recovering, with industrial and communication sectors seeing a return to inventory restocking[29]