Core Viewpoint - The company,卓胜微, indicates that its overall gross margin is influenced by multiple factors including depreciation of its subsidiary, market competition, and changes in product structure [1] Group 1 - In Q3 2025, the impact of self-produced wafer costs on gross margin improved compared to Q2 [1] - The company expects that as the production capacity utilization of its subsidiary increases, the negative impact of self-produced wafer costs on overall gross margin will gradually diminish [1]

格隆汇11月18日丨圣邦股份(300661.SZ)在投资者互动平台表示，公司与多家领先晶圆代工厂及封测服 务商保持长期稳定合作，构建稳健的高质量生产制造体系，具备稳定大量交付能力，为业务连续性提供 保障。 ...

11月18日，赛微电子盘中下跌2.03%，截至13:26，报26.61元/股，成交7.15亿元，换手率4.44%，总市值 194.84亿元。 资金流向方面，主力资金净流出3495.62万元，特大单买入2885.20万元，占比4.04%，卖出5147.24万 元，占比7.20%；大单买入1.67亿元，占比23.39%，卖出1.79亿元，占比25.11%。 责任编辑：小浪快报 资料显示，北京赛微电子股份有限公司位于北京市西城区裕民路18号北环中心A座2607室(德胜园区),北 京市北京经济技术开发区科创八街21号院1号楼，成立日期2008年5月15日，上市日期2015年5月14日， 公司主营业务涉及MEMS工艺开发及晶圆制造、GaN外延材料生长及芯片设计。主营业务收入构成为： MEMS晶圆制造54.30%，MEMS工艺开发39.14%，其他4.90%，半导体设备1.67%。 赛微电子所属申万行业为：电子-半导体-集成电路制造。所属概念板块包括：中盘、融资融券、参股新 三板、5.5G概念、低市盈率等。 截至9月30日，赛微电子股东户数7.62万，较上期增加15.65%；人均流通股7843股，较上期减少 13.54% ...

Core Viewpoint - ChipLink Integrated experienced a stock price decline of 2.09% on November 18, with a current price of 7.01 CNY per share and a total market capitalization of 58.763 billion CNY [1] Financial Performance - For the period from January to September 2025, ChipLink Integrated reported a revenue of 5.422 billion CNY, representing a year-on-year growth of 19.23%. However, the net profit attributable to shareholders was -463 million CNY, showing a year-on-year increase of 32.32% in losses [2] Stock Market Activity - As of November 18, the stock had a trading volume of 5.87 billion CNY, with a turnover rate of 1.87%. The main funds saw a net outflow of 90.156 million CNY, with large orders accounting for 22.58% of purchases and 37.95% of sales [1] Shareholder Structure - As of September 30, 2025, the number of shareholders for ChipLink Integrated was 139,800, an increase of 0.34% from the previous period. The average number of circulating shares per person decreased by 0.34% to 31,681 shares [2] Business Overview - ChipLink Integrated, established on March 9, 2018, and listed on May 10, 2023, specializes in wafer foundry and module packaging testing services in the MEMS and power device sectors. The revenue composition includes 85.96% from integrated circuit wafer manufacturing, 9.24% from module packaging, 3.58% from other services, and 1.21% from R&D services [1] Industry Classification - The company is classified under the Shenwan industry category of Electronics - Semiconductors - Integrated Circuit Manufacturing, and is associated with concepts such as SMIC International, smart vehicles, IGBT concepts, integrated circuits, and analog chips [1]

来源：新浪证券-红岸工作室 资料显示，中芯国际集成电路制造有限公司位于上海市浦东新区张江路18号,香港中环康乐广场8号交易 广场1期29楼，成立日期2000年4月3日，上市日期2020年7月16日，公司主营业务涉及提供0.35微米至14 纳米多种技术节点、不同工艺平台的集成电路晶圆代工及配套服务。主营业务收入构成为：集成电路晶 圆代工93.83%，其他6.17%。 中芯国际所属申万行业为：电子-半导体-集成电路制造。所属概念板块包括：IGBT概念、集成电路、大 基金概念、半导体、中芯国际概念等。 截至9月30日，中芯国际股东户数33.62万，较上期增加33.27%；人均流通股6134股，较上期减少 25.41%。2025年1月-9月，中芯国际实现营业收入495.10亿元，同比增长18.22%；归母净利润38.18亿 元，同比增长41.09%。 机构持仓方面，截止2025年9月30日，中芯国际十大流通股东中，易方达上证科创板50ETF（588080） 位居第五大流通股东，持股5730.50万股，相比上期减少1650.36万股。华夏上证科创板50成份ETF （588000）位居第六大流通股东，持股5599.90万 ...

证券代码：688403 证券简称：汇成股份 公告编号：2025-062 转债代码：118049 转债简称：汇成转债 合肥新汇成微电子股份有限公司2025年第二次临时股东会决议公告 ● 本次会议是否有被否决议案：无 一、会议召开和出席情况 （一）股东会召开的时间：2025年11月17日 （二）股东会召开的地点：安徽省合肥市新站区合肥综合保税区内项王路8号公司会议室 （三）出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及其持有表决权数量的情 况： 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容的 真实性、准确性和完整性依法承担法律责任。 重要内容提示： ■ （四）表决方式是否符合《公司法》及公司章程的规定，大会主持情况等。 本次股东会由公司董事会召集，董事长郑瑞俊先生主持，会议采取现场投票和网络投票相结合的方式表 决。本次股东会的召集、召开程序、表决程序符合《中华人民共和国公司法》《上海证券交易所科创板 股票上市规则》等有关法律法规、规范性文件以及《合肥新汇成微电子股份有限公司章程》《合肥新汇 成微电子股份有限公司股东会议事规则》等相关规章制度的规定，会议决 ...

Core Insights - The company Xilinx Integrated Circuit Manufacturing Co., Ltd. (stock code: 688469.SH) has officially launched its new Silicon Carbide G2.0 technology platform, which utilizes advanced 8-inch manufacturing technology and has reached a globally leading level [1] - This technology platform achieves the core goals of "high efficiency, high power density, and high reliability" through dual optimization of device structure and process technology, covering two main application scenarios: electric drive and power supply [1] - The G2.0 electric drive version enhances power density by 20% due to lower conduction losses and excellent switching softness, significantly improving the power output and energy efficiency of electric vehicle drive systems, thus supporting vehicle range [1] - In the power supply scenario, the G2.0 power version optimizes parasitic capacitance design and enhances heat dissipation through packaging optimization, reducing switching losses by up to 30%, while achieving significant improvements in power conversion efficiency and system power density [1] - The platform is expected to help customers seize opportunities in new energy electrification and AI computing power construction, establishing a leading differentiated competitive advantage [2]

Core Viewpoint - The article highlights the strong performance of SMIC in Q3 2025, with revenue and gross margin exceeding guidance, driven by high capacity utilization and strong demand across various sectors, despite a conservative outlook for Q4 2025 due to seasonal factors and customer ordering patterns [2][4]. Financial Performance - In Q3 2025, SMIC reported revenue of $2.382 billion, a year-on-year increase of 9.7% and a quarter-on-quarter increase of 7.8%, surpassing guidance of 5-7% [2][10]. - The gross margin for Q3 2025 was 22%, up 1.5 percentage points year-on-year and 1.6 percentage points quarter-on-quarter, exceeding the guidance of 18-20% [2][10]. - The net profit attributable to shareholders was $192 million, reflecting a year-on-year increase of 28.9% and a quarter-on-quarter increase of 44.7% [2][10]. Capacity and Utilization - The capacity utilization rate reached 95.8% in Q3 2025, an increase of 5.4 percentage points year-on-year and 3.3 percentage points quarter-on-quarter, indicating strong demand and supply constraints [2][10]. - The wafer shipment volume was 2.499 million pieces, equivalent to 8-inch wafers, with a quarter-on-quarter increase of 4.6% [17]. Sector Performance - Smartphone revenue in Q3 2025 was $510 million, down 4.5% year-on-year and 7.4% quarter-on-quarter, primarily due to capacity adjustments and seasonal fluctuations in customer demand [3]. - Revenue from computers and tablets was $336 million, up 2.5% year-on-year and 9.9% quarter-on-quarter, while consumer electronics revenue reached $873 million, up 12.7% year-on-year and 14.9% quarter-on-quarter [3]. - Industrial and automotive revenue surged by 66.6% year-on-year and 21.8% quarter-on-quarter, reflecting strong demand in these sectors [3]. Q4 2025 Outlook - The company provided a conservative revenue guidance for Q4 2025, expecting a quarter-on-quarter growth of 0-2% and a gross margin of 18-20% [4][10]. - The cautious outlook is attributed to customer hesitance regarding year-end orders and the traditional seasonal slowdown, particularly in the smartphone market [4][10]. Strategic Insights - The company anticipates an acceleration in capacity expansion to meet growing domestic demand, particularly in the storage and logic chip sectors [4][10]. - The ongoing trend of domestic substitution is expected to continue, with a stable order flow and a focus on enhancing production capabilities [4][10].

Core Insights - SMIC reported a revenue of $2.382 billion for Q3 2025, reflecting a quarter-on-quarter growth of 7.8% [1] - The company achieved a capacity utilization rate of 95.8% in Q3, with a total shipment of 2.499 million 8-inch equivalent wafers, marking a 4.6% increase from the previous quarter [1] - The average selling price of wafers increased by 3.8% quarter-on-quarter due to a shift in product mix towards more complex processes [1] Revenue Breakdown - Revenue by region showed China accounting for 86%, the US for 11%, and Eurasia for 3%, with a notable 11% quarter-on-quarter growth in China [1][2] - Revenue by application indicated that consumer electronics represented 43%, followed by smartphones at 22%, and computers and tablets at 15%, with consumer electronics experiencing a 15% quarter-on-quarter growth [2] Financial Performance - The gross margin for Q3 was 22.0%, up 1.6 percentage points from the previous quarter, driven by increased production offsetting rising depreciation costs [2] - For the first three quarters of the year, the company reported a total revenue of $6.838 billion, a 17.4% increase year-on-year, with a gross margin of 21.6%, up 5.3 percentage points from the previous year [2] Future Outlook - Despite Q4 being a traditional off-season, the company anticipates stable demand due to ongoing industry chain transitions, projecting Q4 revenue to remain flat or grow by 2% [2] - The company expects full-year revenue to exceed $9 billion, marking a significant milestone in revenue scale [2] Product Development - The company is advancing its product platforms, with the ultra-low power 28nm logic process entering mass production and various technology iterations in image sensors and embedded storage [3] - The company is capitalizing on growth opportunities in the automotive chip market by offering a range of specialized processes [3] - Current production lines are still in a state of supply-demand imbalance, with shipment volumes unable to fully meet customer demand [3]

11月14日，中芯国际盘中下跌2.01%，截至13:09，报120.62元/股，成交61.33亿元，换手率2.49%，总市 值9649.71亿元。 资金流向方面，主力资金净流出3.45亿元，特大单买入11.33亿元，占比18.46%，卖出15.11亿元，占比 24.63%；大单买入20.76亿元，占比33.85%，卖出20.43亿元，占比33.31%。 中芯国际今年以来股价涨27.48%，近5个交易日跌1.22%，近20日跌1.11%，近60日涨32.87%。 今年以来中芯国际已经1次登上龙虎榜，最近一次登上龙虎榜为8月28日，当日龙虎榜净买入-4.22亿 元；买入总计16.55亿元 ，占总成交额比6.10%；卖出总计20.77亿元 ，占总成交额比7.66%。 资料显示，中芯国际集成电路制造有限公司位于上海市浦东新区张江路18号,香港中环康乐广场8号交易 广场1期29楼，成立日期2000年4月3日，上市日期2020年7月16日，公司主营业务涉及提供0.35微米至14 纳米多种技术节点、不同工艺平台的集成电路晶圆代工及配套服务。主营业务收入构成为：集成电路晶 圆代工93.83%，其他6.17%。 中芯国际所属申 ...