证券日报网讯 8月19日晚间，明阳电路发布公告称，根据安排，截至2025年9月5日收市后仍未转股 的"明电转债"将被强制赎回，本次赎回完成后，"明电转债"将在深圳证券交易所摘牌，特提醒"明电转 债"持券人注意在限期内转股。债券持有人持有的"明电转债"如存在被质押或被冻结的，建议在停止转 股日前解除质押或冻结，以免出现因无法转股而被赎回的情形。 （文章来源：证券日报） ...

（编辑 李家琪） 证券日报网讯 8月19日晚间，中京电子发布公告称，截至2025年6月30日，公司及子公司担保合同总额 为376，345万元，公司及子公司实际担保余额为266，362万元，上述均为对全资子公司的担保，除此以 外公司及子公司无其他对外担保事项，无逾期担保情况，无涉及诉讼的担保及因担保被判败诉承担损失 的情况。 ...

担保合同订立需经批准后由董事长或授权代表签署，合同应明确规范，重要合同可征询法律顾问意见。 担保风险管理方面，财务部负责多项事务，经办责任人要关注被担保单位多方面情况，出现风险及时报 告处理。若被担保单位不能履约，公司将启动反担保追偿程序。 制度还明确了在担保过程中相关责任人违反规定的责任与处罚，公司也将建立健全监督检查制度，对发 现的薄弱环节及时纠正完善。本制度经股东会审议通过后生效，董事会可根据规定修改并解释。 公司对外担保管理实行多层审核监督制度，财务部负责审核及日常管理，董事会办公室负责合规性复核 与信息披露，审计部负责监督检查。在担保对象方面，公司可为符合一定条件的法人提供担保，特殊情 况经董事会或股东会同意也可为其他法人担保。 2025-08-19，惠州中京电子科技股份有限公司发布对外担保管理制度相关公告。 担保审查和批准环节，财务部要对申请担保单位资信状况调查评估。董事会审查时，对于存在多种不良 情形或资料不充分的，不得提供担保。公司提供担保除需全体董事过半数审议通过，还需出席董事会会 议三分之二以上董事审议同意并及时披露。涉及关联担保有特殊规定。一些对外担保行为经董事会审议 后还需股东会批准， ...

（文章来源：每日经济新闻） 2025年1至6月份，鹏鼎控股的营业收入构成为：印制电路板占比99.22%，其他业务占比0.78%。 鹏鼎控股（SZ 002938，收盘价：51.3元）8月19日晚间发布公告称，公司第三届第十九次董事会会议于 2025年8月19日以通讯方式召开。会议审议了《关于公司淮安园区投资计划的议案》等文件。 ...

2024年1至12月份，金禄电子的营业收入构成为：PCB占比93.37%，其他业务占比6.63%。 （文章来源：每日经济新闻） 金禄电子（SZ 301282，收盘价：28元）8月19日晚间发布公告称，公司第三届第一次董事会会议于2025 年8月19日以现场会议的方式召开。会议审议了《关于2025年半年度募集资金存放与使用情况专项报告 的议案》等文件。 ...

| 金禄电子科技股份有限公司 2025 年半年度报告全文 | | | --- | --- | | 金禄电子科技股份有限公司 | | | 2025 年半年度报告全文 金禄电子科技股份有限公司 | | | 公司董事会及董事、高级管理人员保证半年度报告内容的真实、准 | | | 确、完整，不存在虚假记载、误导性陈述或者重大遗漏，并承担个别和连 | | | 带的法律责任。 | | | 公司负责人李继林、主管会计工作负责人张双玲及会计机构负责人(会 | | | 计主管人员)张双玲声明：保证本半年度报告中财务报告的真实、准确、完 | | | | 整。 | | 所有董事均已出席了审议本次半年报的董事会会议。 | | | 公司已在本报告中列明可能存在的市场竞争加剧及产品降价风险、原 | | | 材料价格波动风险、汇率波动风险及新增产能无法消化风险，敬请查阅 | | | 管理层讨论与分析"之"十、公司面临的风险和应对措施"部分 | "第三节 | | | 内容。 | | 本报告中涉及的未来发展规划等前瞻性描述不构成公司对投资者的实 | | | 质承诺，敬请广大投资者理性投资，注意风险。 | | | 公司计划不派发现金红利，不送红 ...

威尔高8月19日披露，截至8月10日公司股东户数为16313户，较上期（7月31日）减少1400户，环比降幅 为7.90%。 融资融券数据显示，该股最新（8月18日）两融余额为3.03亿元，其中，融资余额为3.03亿元，本期筹码 集中以来融资余额合计增加7277.41万元，增幅为31.67%。 公司发布的一季报数据显示，一季度公司共实现营业收入3.09亿元，同比增长51.54%，实现净利润 2231.58万元，同比增长6.87%，基本每股收益为0.1700元，加权平均净资产收益率1.48%。 7月25日公司发布上半年业绩预告，预计实现净利润4300.00万元至5000.00万元，变动区间为 12.55%~30.87%。（数据宝） （文章来源：证券时报网） 证券时报·数据宝统计，截至发稿，威尔高最新股价为61.00元，下跌2.17%，本期筹码集中以来股价累 计上涨42.56%。具体到各交易日，8次上涨，5次下跌，其中，涨停1次。 ...

Core Insights - The main business of the company includes the research, production, and sales of printed circuit boards, with the enterprise communication market boards accounting for 75.65% of revenue and automotive boards at 18.05% [3] - The company has shown significant growth in net profit, increasing from 326 million yuan in 2010 to 2.587 billion yuan in 2024, representing a cumulative growth of 693.32% over 15 years [3] - Revenue has also grown from 7.460 billion yuan in 2020 to 13.342 billion yuan in 2024, with a notable revenue growth rate of 49.26% in 2024 [3] - The company's market capitalization has increased 6.61 times since its IPO, reaching a peak of 112.71 billion yuan on July 31, 2025 [5] Financial Performance - The company achieved a net profit of 1.343 billion yuan in 2020, which rose to 2.587 billion yuan in 2024, with a year-on-year growth of 71.05% in 2024 [3] - The company experienced a slight revenue decline in 2021 but has maintained a growth trend from 2022 to 2024 [3] - The company has recorded net profit growth in 11 out of the 15 years since its listing, indicating a strong profitability trend [3] Market Capitalization - As of August 15, the company's market capitalization was 106.478 billion yuan, down 62.33 million yuan from its peak, reflecting a 5.53% decrease [5]

Core Viewpoint - Shengyi Technology (600183) reported a significant increase in net profit and revenue for the first half of 2025, indicating strong business performance in the copper-clad laminate and printed circuit board industry [1] Financial Performance - The company achieved a net profit attributable to shareholders of approximately 1.426 billion yuan, representing a year-on-year growth of 52.98% [1] - Shengyi Technology's operating revenue for the first half of the year was about 12.68 billion yuan, reflecting a year-on-year increase of 31.68% [1] - The company's net profit after deducting non-recurring gains and losses was approximately 1.378 billion yuan, with a year-on-year growth of 51.68% [1] Business Overview - Shengyi Technology primarily engages in the design, production, and sales of copper-clad laminates and bonding sheets, as well as printed circuit boards [1] Market Performance - As of the market close on August 15, Shengyi Technology's stock price was 44.83 yuan per share, with a total market capitalization of approximately 108.9 billion yuan [1]

Core Viewpoint - The company plans to invest approximately 1.9 billion RMB in a smart manufacturing high-layer circuit board project to meet the growing demand in the mid-to-high-end market, particularly for servers and AI computing [1][2]. Group 1: Project Overview - The project will be implemented by the company's wholly-owned subsidiary in Jiangxi Province, with a total investment of about 1.9 billion RMB, including previously invested costs [1]. - The new investment for this project is approximately 1.75 billion RMB, with a planned construction period of 2.5 years [1]. - The project is set to be executed in two phases, with the first phase expected to begin trial production in 2026 and the second phase in 2027 [1]. Group 2: Market Focus and Capacity Planning - The project focuses on the smart manufacturing of high-layer circuit boards, targeting the needs of servers, high-layer network communications, and the rapidly growing AI computing market [2]. - The planned production capacity is 700,000 square meters of printed circuit boards annually, with each phase producing 350,000 square meters [2]. - The advancement of this project is expected to enhance the company's resource integration and optimize capacity layout, aligning better with market demand growth [2].