证券代码：300757 证券简称：罗博特科 罗博特科智能科技股份有限公司投资者关系活动记录表 该客户未来还有新的产线规划需求，公司将积极匹配其需 求。鉴于下游客户的保密要求，具体细节暂不便进一步展开， 后续若相关业务进展达到信息披露标准，公司将严格按照法律 法规及信息披露制度的要求及时履行披露义务，敬请投资者关 注公司官方公告。 4、请问公司当前产能布局是否匹配 CPO、OCS 等核心 业务的增长需求？后续产能扩产的整体规划及关键支撑条件 有哪些？ 答复：根据未来市场的高速增长态势及核心客户提供的需 求预测，公司亟需加速构建与之匹配的产能规模。得益于该业 务板块的轻资产属性与公司模块化、集成化的运营模式，现有 产能体系具备良好的弹性基础。目前，公司已从以下维度系统 推进产能提升工作： 编号：2026-01 | | 特定对象调研 ☑ | □分析师会议 | | | | --- | --- | --- | --- | --- | | 投资者关系活动 | □媒体采访 | □业绩说明会 | | | | 类别 | □新闻发布会 | □路演活动 | | | | | □现场参观 | | | | | | □其他 （电话会议） ...

2026 年 3 月 18 日，上海新国际博览中心！全球光电子与半导体产业的年度核心交汇点 —— 慕 尼黑上海光博会如期而至， 超 1200 家全球头部企业参展、数十万专业观众集结， 引爆 "技术迭 代 + 生态融合" 产业热潮。 《从器件到网络的协同创新论坛》 以 "激光光学技术 + 半导体全产业链协同" 为核心技术底座， 更辐射工业互联、智慧交通、数字医疗等多领域数字化转型 —— 既锚定国家数字经济发展、新基 建推进、国产化攻坚的多维战略导向，实现 "政策方向精准契合"；又深耕激光光学器件突破、半 导体全链条技术融合、跨领域网络协同创新，彰显 "硬核技术全局支撑力"；更紧扣多行业数字化 转型的核心需求与共性痛点，实现 "产业需求深度适配"。 在当前国家推进高水平科技自立自强、构建现代化产业体系的关键阶段，论坛凭借 "政策 - 技术 - 需求" 的三重核心优势，成为产业链上下游联动破局、共探技术融合路径、助力多产业升级的战略 级必参盛会！ 议程安排 2026/3/18 上海新国际博览中心 9:00-9:50 观众入场签到 + 成果展示 9:50-10:00 开场致辞 10:00-10:25 专家&教授 10 ...

Core Insights - The article highlights the significance of the Munich Shanghai Optical Expo as a pivotal event for the global optoelectronics and semiconductor industry, featuring over 1,200 leading companies and attracting hundreds of thousands of professional attendees, emphasizing the theme of "technological iteration + ecological integration" [2] Group 1: Policy Alignment - The forum aligns closely with the "14th Five-Year Plan," focusing on the critical role of laser technology in supporting 6G/5G-A, targeting key areas such as compound semiconductors, EDA tools, and optical communication chips, and aims to create a collaborative ecosystem through "policy - technology - capital" synergy [2][4] Group 2: Technical Focus - The forum emphasizes a comprehensive technology logic covering the entire supply chain from "materials - tools - chips - devices - components - applications," showcasing hard-core achievements from leading companies in critical areas like compound semiconductor mass production processes and AI-enabled optical chip design [3] Group 3: Demand-Supply Coupling - The forum effectively links the supply side, represented by leading technology firms like Silan Micro and Xizhi Technology, with the demand side, including major telecom operators and cloud service providers, creating a high-efficiency closed loop of "technology output - demand feedback - cooperation landing" [4] Group 4: Key Participants - Major telecom operators such as China Mobile, China Unicom, and China Telecom are participating to address 6G network architecture and 5G-A deployment needs, while leading cloud service providers like Alibaba Cloud and Tencent Cloud are seeking solutions for high-speed data transmission and green data center construction [6] Group 5: Final Opportunities - The article emphasizes the urgency of securing the last three sponsorship seats for the forum, highlighting the scarcity of resources and the potential for significant market engagement, with a focus on connecting with decision-makers from major telecom and cloud service companies [7][9]