Group 1 - The 27th China International High-tech Achievements Fair (referred to as "High-tech Fair") will be held in Shenzhen from November 14 to 16, 2025, featuring a new "Technology-Strong County Exhibition Area" focused on modernizing county industrial chains and developing new productive forces [1][2] - The "Technology-Strong County Exhibition Area" will showcase advancements in cutting-edge fields such as artificial intelligence, big data, biomanufacturing, and new energy, aiming to accelerate the integration of technological innovations into county economies [1][2] - There are over 1,800 counties and county-level cities in China, with the county economy being a crucial engine for new urbanization, rural revitalization, and urban-rural integration, contributing significantly to the national economy [1][3] Group 2 - The High-tech Fair aims to present how county economies can leverage technological innovation for transformation, creating a new development landscape characterized by technology-driven growth and rural prosperity [2][3] - The event will gather over 5,000 leading technology enterprises, research institutions, universities, and investment organizations globally, promoting resource sharing, talent exchange, and collaborative innovation [2][4] - The fair will feature multiple exhibition areas, including biotechnology, artificial intelligence, smart manufacturing, and clean energy, showcasing a wide range of technological advancements and fostering international cooperation [3][4]

首批科创债发行名单披露 2家深圳企业现身 智通财经5月8日电，债市"科技板"的构建迎来新进展，继昨日宣布在银行间市场创新推出科技创新债 券，今日，首批科创债发行名单在中国银行间市场交易商协会官网披露，截至智通财经记者发稿时涉及 发行主体已达27家，2家深圳企业现身其中。其中，立讯精密拟发行10亿元科创债，募集资金用途为优 化公司负债结构，补充公司营运资金，为高端智能制造基地建设及数字化制造升级赋能。深圳市投资控 股拟发行合计10亿元的科技创新债券，募集资金将专项用于向旗下母基金出资，投向智能制造、高端装 备、半导体与集成电路、AI与具身机器人、新材料、新能源及智能网联汽车等科创领域。（记者 周晓 雅） ...