Group 1 - Huawei's new AI SSD products are set to launch, which can effectively reduce inference costs by over 30% [1] - The AI SSD products have high requirements for stacking technology and active cooling, with one company being the only domestic producer capable of mass-producing HBM3 compatible substrates, while two other companies may provide active cooling products [1] - The penetration rate of liquid cooling in AI computing servers is expected to increase from 20% in 2025 to 50% in 2028, with leading manufacturers actively positioning themselves, and four companies have already gained a certain market share in their respective liquid cooling technology fields [1]