Group 1 - Company plans to raise up to 2.6 billion yuan through a private placement of shares, marking its first equity refinancing since its IPO in 2021 [1] - The raised funds will be allocated to the construction of an AI computing HDI production base, a smart manufacturing high-layer circuit board project, and to supplement working capital and repay bank loans [1] - The AI computing HDI production base project has a total investment of 2.032 billion yuan, with 1 billion yuan planned to be raised from this offering, aiming for an annual production capacity of 167,200 square meters [1] Group 2 - The demand for AI computing power is driving significant growth in the AI server and data center market, particularly increasing the demand for HDI boards [2] - AI HDI boards are expected to become one of the fastest-growing segments in the PCB market over the next five years, with a particular emphasis on high-tier HDI boards [2] - The market demand for high-layer and high-speed PCBs is expected to grow rapidly due to technological advancements in AI server and data center products [2] Group 3 - As of November 17, the company's stock closed at 93.4 yuan per share, with a market capitalization of 77.7 billion yuan [3]

【导读】生益电子拟定增募资不超过26亿元 中国基金报记者 卢鸰 生益电子 11月17日晚公告，拟向特定对象发行股票募集资金总额不超过26亿元，扣除发行 费用后的募集资金净额拟投资于人工智能计算HDI生产基地建设项目、智能制造高多层算力电 路板项目，以及补充流动资金和偿还银行贷款，发行对象为不超过35名（含35名）符合中国 证监会规定条件的特定对象。 这是生益电子2021年上市以来的首次股权再融资。 其中，人工智能计算HDI生产基地建设项目预计总投资20.32亿元，拟使用募集资金10亿元， 规划建设期为36个月，第三年开始试生产，至第五年达产。本项目的实施主体为生益电子， 地点位于广东省东莞市，拟建设生产人工智能用高阶HDI板，计划年产能为16.72万平方米。 智能制造高多层算力电路板项目预计总投资19.37亿元，拟使用募集资金11亿元，项目分两 阶段建设，规划建设期合计30个月，第一阶段于第二年开始试生产，至第三年达产；第二阶 段于第三年开始试生产，至第四年达产。该项目的实施主体为吉安生益，地点位于江西省吉 安市，拟建设生产高多层板，计划年产能70万平方米。 生益电子称，AI算力需求的指数级增长有力地带动了A ...