Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [10][12]. Event Details - The conference will take place from November 17 to 19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, aiming to create a high ground for advanced electronic information industry in Ningbo and the Yangtze River Delta region [10][13]. - The event will feature a series of discussions and presentations on cutting-edge topics related to heterogeneous integration and advanced packaging technologies [12][13]. Conference Agenda - The agenda includes a closed-door meeting on heterogeneous integration, government speeches, and various technical discussions on topics such as advanced packaging trends, optical chip innovations, and the challenges of heterogeneous integration technology [3][5][6]. - Notable speakers include experts from various organizations, including Alibaba Cloud, COMSOL, and Zhejiang University, discussing topics like optical interconnect solutions and advanced semiconductor manufacturing techniques [5][6][10]. Industry Context - The conference is positioned against the backdrop of increasing demands for chip performance, power consumption, and cost efficiency driven by applications in artificial intelligence and high-performance computing [10]. - Heterogeneous integration is highlighted as a crucial direction for the semiconductor industry, especially in the context of 2.5D/3D integration and optical-electrical co-packaging [10][12]. Participation and Costs - The conference is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [13][14].

Group 1 - The article emphasizes the importance of timely and professional information interpretation in the investment landscape, focusing on extracting investment value from significant events and analyzing industry chain companies [1] - A domestic storage chip testing leader has successfully passed tests for multiple materials related to storage chips and advanced packaging, indicating readiness for mass production [1] - A company leading in global AI server and switch market share has introduced a 6-stage 24-layer data center product, showcasing its capability in high-layer PCB technology with over 100 layers [1]