Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) packaging, expected in the first half of 2025 [2] - The related products have passed preliminary reliability testing, indicating progress in the company's CPO project [2] - Future developments will be determined based on customer and market demand, suggesting a responsive approach to market conditions [2]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) has made significant progress in the development of large-size FCBGA, entering mass production for large-size FCBGA and completing preliminary research for ultra-large size FCBGA, which is now in formal engineering assessment stage [1] Group 1 - The company has achieved important advancements in large-size FCBGA development, with large-size FCBGA entering mass production [1] - The ultra-large size FCBGA has completed preliminary research and is now undergoing formal engineering assessment [1] - The company has addressed product warping and heat dissipation issues for ultra-large size products through optimization of product structure design, material selection, and process improvements [1] Group 2 - The company has made breakthrough progress in the technology development of optical-electrical integrated packaging (CPO), with related products passing initial reliability testing [1]

Core Viewpoint - Tongfu Microelectronics reported a significant increase in net profit and revenue for the first half of 2025, indicating strong operational performance and advancements in product development [1] Financial Performance - The company achieved a revenue of 13.038 billion yuan, representing a year-on-year growth of 17.67% [1] - The net profit attributable to shareholders was 412 million yuan, reflecting a year-on-year increase of 27.72% [1] Product Development - The company made important progress in the development of large-size FCBGA, which has entered the mass production stage [1] - Research and engineering assessment for ultra-large size FCBGA has been completed [1] - The company addressed product warping and heat dissipation issues through optimization of product structure design, material selection, and process improvements [1] Technological Advancements - Breakthroughs were achieved in the field of Chip-on-Package (CPO) technology, with related products passing preliminary reliability tests [1]