Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) packaging, expected in the first half of 2025 [2] - The related products have passed preliminary reliability testing, indicating progress in the company's CPO project [2] - Future developments will be determined based on customer and market demand, suggesting a responsive approach to market conditions [2]

Core Viewpoint - Company has made significant progress in technology research and development in the field of Chip-on-Panel (CPO) and has passed preliminary reliability tests for related products [1] Group 1 - Company plans to assess future developments based on customer and market demand [1] - The breakthrough in CPO technology is expected to be realized in the first half of 2025 [1]

Group 1 - The company Tongfu Microelectronics (002156) announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) as of the first half of 2025 [1] - Related products have passed preliminary reliability testing, indicating progress in the company's technological capabilities [1] - Future developments will be assessed based on customer and market demand, suggesting a responsive approach to market conditions [1]

Market Performance - The main board led the gains with notable increases from companies such as Beiwai Technology (+10.02%), Fuzheng Technology (+10.00%), Yongxin Optics (+10.00%), and others [1] - The ChiNext board saw significant growth, particularly from Boshang Optoelectronics (+20.01%) and Huijin Co., Ltd. (+19.82%) [1] - The Sci-Tech Innovation board was also strong, with Liyang Chip (+20.01%) and Fengcai Technology (+20.00%) leading the way [1] - Active sub-industries included SW Semiconductor Equipment (+4.27%) and SW Passive Components (+3.56%) [1] Domestic News - Aibang announced the launch of a new AR glasses model aimed at outdoor athletes, featuring a single green Micro LED display engine with over 10 hours of battery life and brightness exceeding 4000 nits [1] - MediaTek announced the successful design tape-out of its first flagship SoC using TSMC's 2nm process, becoming one of the first companies to adopt this technology, with mass production expected by the end of next year [1] - Qiusui Semiconductor introduced the "Leyi AR" glasses, set for small-scale production in early October, utilizing Micro LED technology with a pixel size of 3.75μm [1] - Tongfu Microelectronics reported breakthroughs in Co-Packaged Optics (CPO) technology, with related products passing initial reliability tests [1] Company Announcements - Visual China announced a cash dividend of 0.11 RMB per 10 shares based on a total of 699,578,636 shares [3] - Dali Cap announced a cash dividend of 0.3 RMB per 10 shares, totaling 12 million RMB [3] - Daotong Technology declared a cash dividend of 5.8 RMB per 10 shares [3] - Juguang Technology reported share reductions by major shareholders, with specific holdings detailed [3] International News - The U.S. President indicated that semiconductors and pharmaceuticals, which have higher profits than automobiles, may face tariffs exceeding 25%, similar to those imposed on automobiles [1] - AMD launched the EPYC Embedded 4005 series processors, which include six SKUs with various core configurations [1] - Adani Group is in discussions with Sharp and Panasonic to establish India's first LCD panel factory [1] - Texas Instruments introduced a highly sensitive in-plane Hall effect switch for various applications [1]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) has made significant progress in the development of large-size FCBGA, entering mass production for large-size FCBGA and completing preliminary research for ultra-large size FCBGA, which is now in formal engineering assessment stage [1] Group 1 - The company has achieved important advancements in large-size FCBGA development, with large-size FCBGA entering mass production [1] - The ultra-large size FCBGA has completed preliminary research and is now undergoing formal engineering assessment [1] - The company has addressed product warping and heat dissipation issues for ultra-large size products through optimization of product structure design, material selection, and process improvements [1] Group 2 - The company has made breakthrough progress in the technology development of optical-electrical integrated packaging (CPO), with related products passing initial reliability testing [1]

Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) as of September 8, 2023 [1] - The related products have passed preliminary reliability testing, indicating progress in their development [1] - Future developments will be determined based on customer and market demand [1] Group 2 - An investor inquired whether the CPO products have been sent to GPU manufacturers for certification, reflecting interest in the company's advancements [3]