Core Viewpoint - The company is preparing for its 2024 annual shareholders' meeting, where various proposals will be discussed, including the appointment of auditors, financial reports, and capital changes. Group 1: Meeting Procedures - Shareholders and their representatives must arrive 30 minutes before the meeting to complete registration and present necessary identification documents [2][3] - The meeting will follow a specific agenda, allowing shareholders to exercise their rights to speak, inquire, and vote [2][3][4] - Voting will be conducted both on-site and online, with specific time frames for each method [5] Group 2: Financial Reports and Proposals - The company will present its 2024 annual financial report, which indicates a projected revenue increase of 51.38% despite a net loss for the year [8][9] - The profit distribution plan for 2024 proposes no cash dividends or stock bonuses due to the company's current financial situation and investment needs [8][11] - The company plans to continue its strategic investments in technology and capacity expansion, anticipating improved performance in the coming years [9][10] Group 3: Auditor Appointment - The company proposes to reappoint Tianjian Accounting Firm as its auditor for the 2025 fiscal year, with an audit fee of 750,000 RMB [11][12] - Tianjian has a strong track record and familiarity with the company's operations, which supports the decision for reappointment [11][12] Group 4: Capital and Financing - The company intends to apply for a credit limit of up to 1.5 billion RMB from financial institutions to support its operational and investment needs [19] - The company will provide guarantees for its subsidiaries' loans within the approved credit limit [19] - A proposal for foreign exchange hedging activities is also on the agenda, aimed at mitigating currency risk associated with international transactions [21][22] Group 5: Governance Changes - The company plans to amend its articles of association to eliminate the supervisory board, transferring its responsibilities to the audit committee of the board [30] - This change is part of a broader effort to enhance corporate governance and streamline operations [30]

Core Viewpoint - The article discusses the importance and evolution of semiconductor packaging technology, highlighting its critical role in enhancing chip performance, reducing power consumption, and enabling efficient system integration to meet the challenges posed by Moore's Law and complex application demands [27]. Group 1: Semiconductor Packaging Process - Semiconductor packaging technology is categorized into four levels: Level 0 (wafer cutting), Level 1 (chip-level packaging), Level 2 (mounting chips onto modules or circuit boards), and Level 3 (installing circuit boards with chips and modules onto system boards) [2]. - The primary functions of semiconductor packaging include mechanical protection, electrical connection, mechanical connection, and heat dissipation [9][12]. Group 2: Development Trends in Semiconductor Packaging - Key trends in semiconductor packaging technology include the development of materials with better thermal conductivity and packaging structures that effectively dissipate heat [13]. - The demand for packaging technologies that support high-speed signal transmission is increasing, particularly for applications in AI and 5G wireless communication [14]. - The trend towards three-dimensional semiconductor stacking technology allows multiple chips to be integrated within a single package, enhancing performance and efficiency [18]. - There is a growing emphasis on miniaturization of semiconductor devices to meet the needs of mobile and wearable products [19]. - Packaging technology must also ensure reliability in extreme environments, such as tropical rainforests and outer space [19]. Group 3: Advanced Packaging Technologies - Advanced packaging aims to improve chip performance, integration, and reliability through various methods, including Fan Out, System in Package (SiP), and 2.5D/3D packaging [27][28]. - The market for advanced packaging is projected to grow significantly, with wafer production expected to increase from approximately 36 million in 2023 to about 64 million by 2029, reflecting a compound annual growth rate (CAGR) of 9% [31]. Group 4: Testing and Validation of Packaging - Two methods are used to develop and ensure the effectiveness of semiconductor packaging: utilizing existing packaging technologies for new chips and developing new packaging technologies for existing chips [33]. - The packaging design process involves simultaneous development with chip design to optimize characteristics and ensure feasibility before mass production [34][36].