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长电科技(600584):产品高端化持续推进,单季度收入创历史新高
Changjiang Securities· 2025-11-09 14:42
Investment Rating - The investment rating for the company is "Buy" and is maintained [7] Core Insights - The company reported a total revenue of 286.69 billion yuan for the first three quarters of 2025, representing a year-on-year increase of 14.78%. However, the net profit attributable to shareholders decreased by 11.39% to 9.54 billion yuan. In Q3 2025, the company achieved a revenue of 100.64 billion yuan, up 6.03% year-on-year, with a net profit of 4.83 billion yuan, reflecting a year-on-year increase of 5.66% and a significant quarter-on-quarter increase of 80.60% [2][5][11] Summary by Sections Financial Performance - For the first three quarters of 2025, the company achieved a revenue of 286.69 billion yuan, a 14.78% increase year-on-year, while the net profit attributable to shareholders was 9.54 billion yuan, down 11.39%. In Q3 2025, the revenue reached a record high of 100.64 billion yuan, with a year-on-year growth of 6.03% and a quarter-on-quarter growth of 8.56%. The gross margin for Q3 2025 was 14.25%, up 2.02 percentage points year-on-year, leading to a net margin increase of 1.94 percentage points to 4.80% [2][11] Business Growth and Structure Optimization - The company has seen significant growth in high-growth sectors, with revenues from computing electronics, automotive electronics, and industrial and medical electronics increasing by 69.5%, 31.3%, and 40.7% year-on-year, respectively. The automotive electronics segment has successfully integrated power module packaging and automotive-grade MCU technology, while the computing electronics sector has expanded into the enterprise SSD market through the acquisition of Shengdie Semiconductor [11] R&D and Future Growth - The company has increased its R&D investment, with expenses reaching 15.4 billion yuan in the first three quarters of 2025, a 24.7% increase year-on-year. Key areas of focus include glass substrates, optoelectronic co-packaging, and high-density SiP technologies. The production capacity for automotive electronics and wafer-level packaging projects is gradually coming online, enhancing the company's delivery capabilities in high-value markets [11]