Group 1 - Five companies announced private placement plans on November 18 [1] - Haomei New Materials (002988) plans to issue up to 74.93 million shares to no more than 35 specific investors, aiming to raise approximately 1.897 billion yuan for projects related to automotive lightweight aluminum profiles and components, R&D innovation center, and working capital [1] - Yaxing Chemical (600319) intends to acquire 100% equity of Tianyi Chemical from 24 shareholders through a combination of share issuance and cash payment, which is expected to constitute a major asset restructuring [1] - Huayin Power (600744) plans to issue up to 250 million shares to no more than 35 specific investors, with an expected fundraising of 1.5 billion yuan for various wind power projects and working capital [1] Group 2 - Shengyi Electronics plans to issue up to 125 million shares to no more than 35 specific investors, with an expected fundraising of 2.6 billion yuan for AI computing HDI production base and smart manufacturing projects [2] - Runong Irrigation intends to raise no more than 84.51 million yuan through a private placement to its controlling shareholder, Hubei Xiangtou Group, at an issue price of 6.26 yuan per share, issuing 13.5 million shares [2]

中国经济网北京11月18日讯 生益电子(688183.SH)昨晚披露2025年度向特定对象发行A股股票预 案，本次向特定对象发行的发行对象为不超过35名（含）符合中国证监会规定条件的特定对象，包括证 券投资基金管理公司、证券公司、信托公司、财务公司、资产管理公司、保险机构投资者、合格境外机 构投资者、其他境内法人投资者、自然人或其他合格投资者。证券投资基金管理公司、证券公司、合格 境外机构投资者、人民币合格境外机构投资者以其管理的2只以上产品认购的，视为一个发行对象；信 托公司作为发行对象的，只能以自有资金认购。所有发行对象均以人民币现金方式并按同一价格认购本 次发行的股票。 据公司2025年第三季度报告，本报告期，公司实现营业收入30.60亿元，同比增长153.71%；归属于 上市公司股东的净利润5.84亿元，同比增长545.95%；扣除非经常性损益后的净利润-5.84亿元，同比增 长570.91%。 截至预案公告日，本次发行尚未确定发行对象，因而无法确定发行对象与公司的关系。 本次发行前，截至预案公告日，生益科技持有公司62.93%股份，为公司控股股东；公司无实际控 制人。本次向特定对象拟发行股票总数不超 ...

每经记者：吴泽鹏每经编辑：廖丹 抓住AI浪潮、加码布局高端产能，正成为PCB（印制电路板）行业头部企业的共同举措。 11月17日晚间，生益电子（SH688183，股价93.40元，市值776.92亿元）公告宣布，拟定增不超过26亿 元投向人工智能计算HDI生产基地建设项目、智能制造高多层算力电路板项目等。 此外，智能制造高多层算力电路板项目预计总投资19.37亿元，拟使用募集资金11亿元，项目分两阶段 建设，规划建设期合计30个月，第一阶段于第二年开始试生产，至第三年达产；第二阶段于第三年开始 试生产，至第四年达产，该项目的实施地点位于江西省吉安市，拟建设生产高多层板，计划年产能70万 平方米。 《每日经济新闻》记者在生益电子2024年年报中查询到，去年，生益电子PCB销售面积达到145.69万平 方米，同比增长15.24%。 《每日经济新闻》记者注意到，生益电子是一家印制电路板（PCB）企业，于2021年2月上市，这是该 企业上市以来的首次股权再融资。此外，生益电子股价在今年取得较大增长，截至11月17日收盘，其年 内涨幅约140%。 PCB被誉为"电子产品之母"，主要由覆铜板（CCL）、铜箔、玻纤布、树脂 ...

生益电子表示，公司拟通过本次募集资金扩大经营规模，利用现有行业领先工艺体系、先进的生产管理 经验，进一步提高高端PCB产能、实现技术产业化落地。利用公司作为PCB行业领先企业的技术优势， 打破同质化竞争，不断提升产品的技术含量与品质水平，巩固和扩大竞争优势，推动国内PCB行业向高 端化、高附加值方向发展。 公告显示，人工智能计算HDI生产基地建设项目地点位于广东省东莞市东城街道方中延长线余屋段北 侧，预计建设周期为36个月，第三年开始试生产，至第五年达产，计划总投资为20.32亿元，拟使用本 次向特定对象发行股票募集资金投入10亿元。截至目前，本项目正在办理发改备案、环评批复等相关手 续。 智能制造高多层算力电路板项目地点位于江西省吉安市井冈山经济技术开发区京九大道19号，项目分两 阶段建设，预计建设期合计30个月，第一阶段于第二年开始试生产，至第三年达产，第二阶段于第三年 开始试生产，至第四年达产，项目计划总投资为19.37亿元，拟使用本次向特定对象发行股票募集资金 投入11亿元。截至目前，该项目正在办理发改备案、环评批复等相关手续。 生益电子称，本次募集资金投资项目主要围绕公司主营业务展开，符合国家产业政 ...

Core Viewpoint - Shengyi Electronics (688183.SH) plans to issue A-shares to specific investors, aiming to raise up to RMB 2.6 billion for various projects and working capital [1] Group 1: Stock Issuance Details - The company intends to issue shares to no more than 35 specific investors [1] - The issuance price will be no less than 80% of the average trading price of the company's stock over the 20 trading days prior to the pricing date [1] - The total number of shares issued will not exceed 15% of the company's total share capital before the issuance, amounting to a maximum of 125 million shares [1] Group 2: Fund Utilization - The total funds raised will not exceed RMB 2.6 billion, including issuance costs [1] - The net proceeds after deducting issuance expenses are planned for investment in the AI computing HDI production base construction project, high-layer intelligent manufacturing circuit board project, replenishing working capital, and repaying bank loans [1]

Group 1 - The company, Shengyi Electronics (688183.SH), has disclosed a plan to issue A-shares to specific investors in 2025, targeting no more than 35 individuals [1] - The issuance price will be set at no less than 80% of the average trading price of the company's shares over the 20 trading days prior to the pricing date, which is the first day of the issuance period [1] - The total number of shares to be issued will not exceed 15% of the company's total share capital before the issuance, amounting to a maximum of 125 million shares [1] Group 2 - The total funds raised from this issuance are expected to be no more than 2.6 billion RMB, which will be used for various projects including the construction of an AI computing HDI production base and a smart manufacturing high-multilayer computing circuit board project [1] - The net proceeds after deducting issuance costs will also be allocated to supplement working capital and repay bank loans [1]

格隆汇11月17日丨生益电子(688183.SH)公布2025年度向特定对象发行A股股票预案，本次向特定对象发 行股票募集资金总额不超过人民币26亿元（含本数），扣除发行费用后的募集资金净额拟投资于以下项 目：人工智能计算HDI生产基地建设项目、智能制造高多层算力电路板项目、补充流动资金和偿还银行 贷款。 ...

每经头条（nbdtoutiao）——展望"十五五" | 专访尹艳林：让有钱且愿消费的人顺利消费；个税起征点可 提高，最高边际税率可下调，让有关群体少缴税、多收入 （记者 王晓波） 每经AI快讯，生益电子（SH 688183，收盘价：93.4元）11月17日晚间发布公告称，本次向特定对象发 行股票方案已经2025年11月17日召开的公司第三届董事会第三十二次会议审议通过，本次向特定对象发 行的发行对象为不超过35名（含35名）符合中国证监会规定条件的特定对象，本次发行的股票数量按照 募集资金总额除以发行价格确定，同时本次发行股票数量不超过本次向特定对象发行前公司总股本的 15%，即本次发行不超过约1.25亿股（含本数）。本次向特定对象发行股票的发行价格为不低于定价基 准日前二十个交易日公司股票交易均价的80%。本次发行拟募集不超过人民币26亿元，募集资金用于以 下用途：人工智能计算HDI生产基地建设项目，总投资约20.32亿元，拟投入募集资金10亿元；智能制 造高多层算力电路板项目，总投资约19.37亿元，拟投入募集资金11亿元；补充流动资金和偿还银行贷 款项目，总投资5亿元，拟投入募集资金5亿元。 2024年 ...

Core Viewpoint - Shengyi Electronics (688183) plans to raise up to 2.6 billion yuan through a private placement of shares to fund various projects, including the construction of an AI computing HDI production base and a smart manufacturing high-layer circuit board project, as well as to supplement working capital and repay bank loans [1] Group 1 - The company intends to issue shares to specific investors to raise a total of no more than 2.6 billion yuan [1] - The raised funds will be allocated to the construction of an AI computing HDI production base [1] - The funds will also support a smart manufacturing high-layer circuit board project [1] Group 2 - Additional uses of the funds include supplementing working capital [1] - The company plans to use part of the funds to repay bank loans [1]

Core Viewpoint - The company plans to raise no more than 2.6 billion yuan through a private placement of shares, with the net proceeds intended for investment in artificial intelligence computing projects, smart manufacturing high-layer circuit board projects, and to supplement working capital and repay bank loans [1] Group 1: Fundraising Details - The company aims to raise up to 2.6 billion yuan, net of issuance costs [1] - The fundraising will be conducted through a private placement to no more than 35 specific investors, including various financial institutions and qualified investors [1] Group 2: Investment Focus - The raised funds will be allocated to the construction of an AI computing production base [1] - Investment will also be directed towards smart manufacturing high-layer circuit board projects [1] - Additional funds will be used to enhance working capital and repay existing bank loans [1]