氧化镓衬底
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近百亿加注国产芯 | 半导体亿元级融资全解析
是说芯语· 2026-01-30 03:44
Core Viewpoint - The Chinese semiconductor industry has experienced a financing boom in the past six months (August 2025 - January 2026), with capital focusing on key segments such as inference GPUs, AI chips, server chips, advanced packaging, and wide bandgap semiconductors [1]. Financing Events Overview Over 2 Billion RMB Financing Events - **Sunrise**: Completed approximately 3 billion RMB in strategic financing, focusing on inference GPUs, with plans for next-generation GPU development and ecosystem building [1]. 1-2 Billion RMB Financing Events - **Aixin Yuanzhi**: Secured over 1 billion RMB in C-round financing, with a post-investment valuation of 10.6 billion RMB, aiming to become the "first stock of China's edge AI chips" [3]. - **Borui Jingxin**: Received over 1 billion RMB in financing, focusing on ARM server chips and digital solutions for various industries [4]. 500 Million to 1 Billion RMB Financing Events - **Heizhima Intelligent**: Obtained 500 million RMB in strategic investment, focusing on edge AI and embodied intelligence [5][6]. - **Jindishi Technology**: Completed over 600 million RMB in B-round financing, focusing on RISC-V AI chips [7]. - **Zhizhan Technology**: Secured nearly 300 million RMB in C-round financing, focusing on silicon carbide power semiconductor devices [8]. - **Mingjia Semiconductor**: Completed 110 million RMB in A++ round financing, focusing on gallium oxide semiconductors [9]. - **Xiqian Semiconductor**: Achieved over 1 billion RMB in strategic financing, focusing on silicon-based capacitors and related technologies [11]. - **Xulun Technology**: Completed over 1 billion RMB in A3 and A4 round financing, focusing on advanced packaging materials [12]. - **Lanxin Computing Power**: Secured over 1 billion RMB in A-round financing, focusing on RISC-V architecture intelligent computing chips [13]. - **Liangxuan Technology**: Completed several hundred million RMB in C-round financing, focusing on quantum computing [14]. - **Ruishi Technology**: Achieved several hundred million RMB in C-round financing, focusing on semiconductor optical chips [15]. Financing Characteristics - Capital is concentrated in high-end chips and advanced materials, addressing critical areas such as inference GPUs and ARM server chips, while also covering wide bandgap semiconductors and advanced packaging materials [16]. - The financing scale is clear, with leading companies like Sunrise and Aixin Yuanzhi securing over 1 billion RMB, while over 70% of smaller "specialized and innovative" companies received financing in the 100 million RMB range [16]. - Local state-owned platforms and industrial funds are key investors, focusing on both financial returns and the improvement of the industrial chain [16]. - The financing companies align with the distribution of semiconductor industry clusters, with major cities like Beijing, Shanghai, and Shenzhen leading, while emerging cities like Chengdu are also gaining traction [16].
氧化镓产业化提速!顺义企业获超亿元融资
Xin Lang Cai Jing· 2026-01-27 04:21
一款被誉为半导体领域 正悄然改变着人们的生活 它就是氧化镓 可以使新能源汽车快充效率不断提升 智能电网能耗持续降低 顺义企业北京铭镓半导体有限公司 正成为推动氧化镓 从实验室走向产业化的关键力量 签约仪式现场。 "性价比之王"的新材料 工作人员测试相关产品。 作为氧化镓领域龙头企业、全市唯一聚焦超宽禁带半导体的育新平台,铭镓半导体着力培育北京市超宽 禁带半导体未来产业,搭建概念验证平台,整合材料制备、器件中试、应用验证全环节资源,开放3000 平方米实验平台及50余套精密设备,为上下游企业提供样品试制、性能检测、工艺优化等服务,助力产 业链协同发展。 工作人员在产线上加工生产。 1月20日,铭镓半导体与20余家股权投资机构、合作银行、上下游企业签约,完成A++轮超亿元股权融 资,标志着资本与资源链条向产业化扩展转型。本轮融资1.1亿元,投后估值9.1亿元,由彭程创投、成 都科创投、天鹰资本、国煜基金及洪泰基金等多家机构联合注资。 企业生产的相关产品及部件。 "氧化镓成本仅为第三代半导体碳化硅的三分之一,击穿电场强度却是碳化硅的2倍以上,在高压、高温 场景下优势显著。"北京铭镓半导体有限公司董事长陈政委介绍,本 ...
铭镓半导体再获近4亿元融资,将主要用于6英寸氧化镓衬底量产|融资速递
Xin Lang Cai Jing· 2026-01-21 14:27
Group 1 - Beijing Mingjia Semiconductor Co., Ltd. has completed an A++ round of equity financing, raising approximately 110 million yuan, with a post-financing valuation of 910 million yuan [1][3] - The financing will primarily be directed towards the research and development of gallium oxide substrates and capacity expansion, including the development and mass production of 6-inch gallium oxide substrates [3][4] - Mingjia Semiconductor plans to add 20 sets of pilot production line equipment for 4-6 inch substrates, aiming for an annual production capacity of 30,000 pieces once fully operational [3] Group 2 - The company is positioned as a leader in gallium oxide and is the only platform in Beijing focusing on wide bandgap semiconductors, aiming to cultivate the future industry of wide bandgap semiconductors in the region [3] - Mingjia Semiconductor is collaborating with universities and research institutions to accelerate the application of gallium oxide in sectors such as drones, artificial intelligence, new energy vehicles, and smart grids [3][4] - The global gallium oxide wafer substrate market is projected to reach 430 million USD by 2031, with a compound annual growth rate (CAGR) of 27.6% in the coming years [4]