氧化镓：第四代半导体的"性价比之王" 公众号记得加星标⭐️，第一时间看推送不会错过。 日前，日本厂商Novel Crystal Technology宣布，开始交付用于下一代功率半导体的150毫米（6英 寸）氧化镓（β-Ga₂O₃）晶圆样品，这一动作标志着氧化镓作为超宽禁带半导体材料，向规模化量产 迈出了关键一步。 据悉，NCT已明确后续发展路线：2027年交付150毫米β-Ga₂O₃外延片样品，2029年实现全面量产， 2035年进一步开发并供应200毫米（8英寸）β-Ga₂O₃晶圆，逐步完善氧化镓产品矩阵，抢占下一代功 率半导体市场先机。 这一动态也引发了业界对氧化镓（Ga₂O₃）材料产业化进程的再度聚焦。 Ga 2 O 3 ，属于一种单晶材料，是继Si、SiC及GaN后的第四代宽禁带半导体材料。 作为备受瞩目的下一代功率半导体材料，氧化镓实际上并非新近发现的材料，但直到近年，随着新能 源汽车、智能电网、光伏逆变器等高压场景对功率器件性能要求的持续攀升，其卓越的材料特性才被 推到聚光灯下。 据 了 解 ， 氧 化 镓 的 禁 带 宽 度 高 达 4.9eV ， 远 超 硅 材 料 的 1.1eV ， 高 于 ...

一款被誉为半导体领域 正悄然改变着人们的生活 它就是氧化镓 可以使新能源汽车快充效率不断提升 智能电网能耗持续降低 顺义企业北京铭镓半导体有限公司 正成为推动氧化镓 从实验室走向产业化的关键力量 签约仪式现场。 "性价比之王"的新材料 工作人员测试相关产品。 作为氧化镓领域龙头企业、全市唯一聚焦超宽禁带半导体的育新平台，铭镓半导体着力培育北京市超宽 禁带半导体未来产业，搭建概念验证平台，整合材料制备、器件中试、应用验证全环节资源，开放3000 平方米实验平台及50余套精密设备，为上下游企业提供样品试制、性能检测、工艺优化等服务，助力产 业链协同发展。 工作人员在产线上加工生产。 1月20日，铭镓半导体与20余家股权投资机构、合作银行、上下游企业签约，完成A++轮超亿元股权融 资，标志着资本与资源链条向产业化扩展转型。本轮融资1.1亿元，投后估值9.1亿元，由彭程创投、成 都科创投、天鹰资本、国煜基金及洪泰基金等多家机构联合注资。 企业生产的相关产品及部件。 "氧化镓成本仅为第三代半导体碳化硅的三分之一，击穿电场强度却是碳化硅的2倍以上，在高压、高温 场景下优势显著。"北京铭镓半导体有限公司董事长陈政委介绍，本 ...

Group 1 - Beijing Mingjia Semiconductor Co., Ltd. has completed an A++ round of equity financing, raising approximately 110 million yuan, with a post-financing valuation of 910 million yuan [1][3] - The financing will primarily be directed towards the research and development of gallium oxide substrates and capacity expansion, including the development and mass production of 6-inch gallium oxide substrates [3][4] - Mingjia Semiconductor plans to add 20 sets of pilot production line equipment for 4-6 inch substrates, aiming for an annual production capacity of 30,000 pieces once fully operational [3] Group 2 - The company is positioned as a leader in gallium oxide and is the only platform in Beijing focusing on wide bandgap semiconductors, aiming to cultivate the future industry of wide bandgap semiconductors in the region [3] - Mingjia Semiconductor is collaborating with universities and research institutions to accelerate the application of gallium oxide in sectors such as drones, artificial intelligence, new energy vehicles, and smart grids [3][4] - The global gallium oxide wafer substrate market is projected to reach 430 million USD by 2031, with a compound annual growth rate (CAGR) of 27.6% in the coming years [4]

Core Viewpoint - Beijing Mingjia Semiconductor Co., Ltd. has completed an A++ round of equity financing exceeding 100 million yuan, with a total financing amount nearing 400 million yuan, indicating strong investor confidence and growth potential in the wide bandgap semiconductor materials sector [1] Financing Details - The recent financing round raised approximately 110 million yuan, with a post-investment valuation of 910 million yuan [1] - Investors include multiple institutions such as Pengcheng Venture Capital, Chengdu Science and Technology Investment, Tianying Capital, Guoyu Fund, and Hongtai Fund [1] Use of Funds - The funds will primarily be allocated for the research and mass production of 6-inch gallium oxide substrates, pilot production lines for 2-4 inch gallium oxide substrates, future industry cultivation of wide bandgap semiconductors, and scaling up the production line for indium phosphide polycrystalline [1] - Achieving mass production of 6-inch substrates is a critical milestone for the gallium oxide industry [1] Production Capacity Goals - The company plans to add equipment to enhance production capacity, targeting an annual output of 30,000 gallium oxide substrates upon reaching full production [1] - The indium phosphide polycrystalline business aims to increase annual production capacity to 20 tons by 2026 to meet the growing demand in AI and communication sectors [1] Market Position - According to QY Research's report on the global gallium oxide wafer substrate market from 2025 to 2031, Mingjia Semiconductor holds the third-largest market share globally in this segment [1]

Core Insights - The 2025 InnoMatch Technology Transfer Conference has launched six high-quality proof-of-concept platforms aimed at future industries [1] Group 1: Proof-of-Concept Platforms - The launched platforms include: - Brain-Computer Interface Proof-of-Concept Platform - Macromolecule and Nucleic Acid Drug Proof-of-Concept Platform - Gene Delivery and Gene Editing Technology Proof-of-Concept Platform - Silicon-Based Photonics Proof-of-Concept Platform - Wide Bandgap Semiconductor Proof-of-Concept Platform - Integrated Circuit Materials Proof-of-Concept Platform [1]